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| (R) Thermal Data SO 14 14 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cmC 0.01 W/cmC leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.20 mm 10-40 m molding compound 1.65 mm 0.0063W/cmC Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data SO 14 Rth(j-a) (C/W) 220 die size = 60 x 90 sq.mils 1) 200 180 floating in air 160 mounted on : 140 SM PCB1A SGS board 120 SM PCB1 SGS board 100 alumina 80 0 0.2 0.4 0.6 0.8 1 1.2 dissipated power ( Watt ) 1.4 1.6 1.8 2 Transient Thermal Resistance (C/W) 200 SINGLE PULSE 100 mounted on SM PCB1 SGS board Pd = 1,5 Watt 50 2) 20 10 die size = 60 x 90 sq.mils on die dissipating area = 2000 sq.mils 5 2 1 0.001 0.01 0.1 1 Time or pulse width ( s ) 10 100 1,000 2/2 |
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