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Optical Pickup Chipset with Photodetector PDIC for Blue-Violet Laser Diodes
CXA2674EM CXA2673EM
The age of the blue-violet laser diode has arrived making even higher recording densities possible. Sony has now developed a new photodiode semiconductor wafer process and a new package for photodetector IC for use with blue-violet laser diodes. This article introduces a chipset for use with blueviolet laser diodes; a chipset that concentrates the industry's leading technologies in a unified system.
CXA2674EM
RF/Servo PDIC for blue-violet laser diodes I Includes a high-sensitivity photodiode (0.3 A/W at 405 nm) I Low-noise amplifier I Standby mode function I Cavity mold glass sealed small package
CXA2673EM
Laser front monitor PDIC for blue-violet laser diodes I Two-channel structure (Vin1, Vin2) I Standby mode function I Cavity mold glass sealed small package
CXA2674EM
The CXA2674EM is a photodetector IC (PDIC) that detects both RF and servo signals and mounted in a record/playback optical pickup that supports the blue-violet laser diode used for Blu-ray and other optical discs. This device is fabricated in a leading-edge process that improves the optoelectronic conversion characteristics in the blue-violet wavelength range to almost the theoretical limits. It also achieves a high signal-to-noise ratio by including a low-noise amplifier. This device features a standby mode function that allows power consumption to be minimized when the device is not being
operated. (Operating mode: 30 mA, standby mode: 2 mA) This product is provided in a newly-developed package that is appropriate for photodetection in the wavelength range of the blue-violet laser.
Newly-Developed Package for Blue-Violet Laser Diodes
Sony has developed a new cavity mold glass sealed package for blue-violet laser diodes. Conventional transparent plastic packages have low transparency in the wavelength range of the blue-violet laser diode, and furthermore, it has been shown that long-term exposure to blue-violet laser diode light degrades plastic package material. Therefore, Sony developed this new package that mounts the silicon chips in a molded cavity area and seals them in that area with glass that has antireflection coating on both sides, thus resolving both these problems.
CXA2673EM
The CXA2673EM is a photodetector IC (PDIC) developed for use as a laser power monitor and mounted in a record/playback optical pickup that uses the blue-violet laser diode used for Blu-ray and other optical discs. This device adopts the same leading-edge process used for the CXA2674EM and the same package. It provides excellent performance as a front monitor for blue-violet laser diodes.
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No rose without a thorn. While the blue laser diode was a miraculous development, and it is an extremely attractive device, it was not easy to develop a PDIC that could receive that light. Revising the fabrication process was, of course, necessary, and we even developed a new package in creating this new product! This is a very friendly product and can be used by almost anyone. It's good to be able to relax again now that this project is done.
8
GND
EHo
1
Vcc
18 17 Vout
900
18
2 3 4
200 Vc
17
16
x1
15
14
13
x1
12
11
10
16 SLEEP 15 SW
Ao Bo Co Do
5
200
14 Vin1 13 Vin2
1.75 k
Eo Ho
Fo Go
6 7
PD GND
12
x1 x1
8 9
11 IV_OUT
1
Vcc
2
SLEEP
3
Bo
4
Ho
5
Vc
6
Go
7
Co
8
FGo
9
GND
10
I Figure 1 CXA2673EM Block Diagram
I Figure 2 CXA2674EM Block Diagram
0.160
0.160 0.030
0.7 mm
0.005
B
A
0.130
C
Photosensitive area position: At the package center
0.005 0.130
D
0.005 0.130 0.130
0.005
Unit: mm
I Figure 3 CXA2673EM Acceptance Pattern Dimensions
I Figure 4 CXA2674EM Acceptance Pattern Dimensions
0.240
G
H
E
F
+0.09 0.14 -0.03 +0.09 0.25 -0.03
5.0V
1 Vcc
GND 18
0.05 M
SAB
2 SLEEP
0.05 M SAB
EHo 17
1.0 0.1
5.8 5.2 18 10
1.1 0.1 0.8
A
0.4 10 18
3 Bo
Ao 16
(0.18) 0.2
3.3
0.4 0.05
0.5 0.05
4 Ho
CB DA
Eo 15
4.4
5.0
0.5 PIN 1 INDEX 9 0.5 1 (0.23) +0.09 0.35 -0.03 +0.09 0.24 -0.03
0.02 MAX
2.1V
5 Vref
G H
Fo 14
B x4 0.05 S A B
0.1 0.1
1 9 PIN 1 INDEX
6 Go
0.05 M 0.05 M SAB
F E
Do 13
7 Co
SW 12
SAB
8 FGo
S
RF- 11
S Gold plating
9 GND
RF+ 10
0.05 S
Unit: mm
Terminal section
* Load conditions: 1 k//10 pF The photosensitive area position is at the package center.
I Figure 6 CXA2673/74EM Package Dimensions
I Figure 5 CXA2674EM Pin Configuration
Ao Bo Co Do
RF+
RF-
5.4 k
SW
Do
Ao
Eo
Fo
9

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