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| DISCRETE SEMICONDUCTORS DATA SHEET handbook, 2 columns M3D116 BY527 Controlled avalanche rectifier Product specification Supersedes data of April 1992 1996 Jun 11 Philips Semiconductors Product specification Controlled avalanche rectifier FEATURES * Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * Guaranteed avalanche energy absorption capability * Available in ammo-pack. DESCRIPTION BY527 Rugged glass package, using a high temperature alloyed construction. 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM VRWM VR IF(AV) PARAMETER repetitive peak reverse voltage crest working reverse voltage continuous reverse voltage average forward current This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. a MAM047 Fig.1 Simplified outline (SOD57) and symbol. CONDITIONS MIN. - - - MAX. 1250 800 800 2.0 V V V A UNIT Ttp = 45 C; lead length = 10 mm; averaged over any 20 ms period; see Figs 2 and 4 Tamb = 80 C; PCB mounting (see Fig.9); averaged over any 20 ms period; see Figs 3 and 4 - - 0.8 A IFSM ERSM Tstg Tj non-repetitive peak forward current non-repetitive peak reverse avalanche energy storage temperature junction temperature t = 10 ms half sinewave L = 120 mH; Tj = Tj max prior to surge; inductive load switched off see Fig.5 - - -65 -65 50 20 +175 +175 A mJ C C 1996 Jun 11 2 Philips Semiconductors Product specification Controlled avalanche rectifier ELECTRICAL CHARACTERISTICS Tj = 25 C; unless otherwise specified. SYMBOL VF V(BR)R IR trr PARAMETER forward voltage reverse avalanche breakdown voltage reverse current CONDITIONS IF = 1 A; Tj = Tj max; see Fig.6 IF = 1 A; see Fig.6 IR = 0.1 mA VR = VRWMmax; see Fig.7 VR = VRWMmax; Tj = 165 C; see Fig.7 reverse recovery time when switched from IF = 0.5 A to IR = 1 A; measured at IR = 0.25 A; see Fig.10 diode capacitance VR = 0 V; f = 1 MHz; see Fig.8 MIN. - - 1250 - - - TYP. - - - - - 3 BY527 MAX. 0.8 1.0 - 1 150 - V V V UNIT A A s Cd - 50 - pF THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 40 m, see Fig.9. For more information please refer to the "General Part of associated Handbook". PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS lead length = 10 mm VALUE 46 100 UNIT K/W K/W 1996 Jun 11 3 Philips Semiconductors Product specification Controlled avalanche rectifier GRAPHICAL DATA MBG044 BY527 handbook, halfpage 3 handbook, halfpage 1.6 MBG054 IF(AV) (A) 2 IF(AV) (A) 1.2 0.8 1 0.4 0 0 40 80 120 160 200 Ttp (C) 0 0 40 80 120 200 160 Tamb (C) a = 1.57; VR = VRWMmax; = 0.5. Lead length 10 mm. a = 1.57; VR = VRWMmax; = 0.5. Device mounted as shown in Fig.9. Fig.2 Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage). Fig.3 Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage). MGC745 handbook, halfpage 4 handbook, halfpage 200 MBH393 P (W) 3 2.5 2 1.57 1.42 Tj (C) 2 a=3 100 1 0 0 1 2 IF(AV) (A) 3 0 0 400 800 VR (V) 1200 a = IF(RMS)/IF(AV); VR = VRWMmax; = 0.5. Fig.4 Maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current. Solid line = VR. Dotted line = VRWM; = 0.5. Fig.5 Maximum permissible junction temperature as a function of reverse voltage. 1996 Jun 11 4 Philips Semiconductors Product specification Controlled avalanche rectifier BY527 MGC735 MGC734 handbook, halfpage 15 10 3 handbook, halfpage IR (A) 10 2 IF (A) 10 max 10 5 1 0 0 1 VF (V) 2 10 -1 0 40 80 120 160 Tj (oC) 200 Solid line: Tj = 25 C. Dotted line: Tj = 175 C. VR = VRWMmax. Fig.6 Forward current as a function of forward voltage; maximum values. Fig.7 Reverse current as a function of junction temperature; maximum values. 10 2 handbook, halfpage MBG031 handbook, halfpage 50 25 Cd (pF) 7 10 50 2 3 1 10 VR (V) 10 2 MGA200 1 f = 1 MHz; Tj = 25 C. Dimensions in mm. Fig.8 Diode capacitance as a function of reverse voltage; typical values. Fig.9 Device mounted on a printed-circuit board. 1996 Jun 11 5 Philips Semiconductors Product specification Controlled avalanche rectifier BY527 handbook, full pagewidth DUT + IF (A) 0.5 1 t rr 10 25 V 50 0 0.25 0.5 IR (A) 1.0 t MAM057 Input impedance oscilloscope: 1 M, 22 pF; tr 7 ns. Source impedance: 50 ; tr 15 ns. Fig.10 Test circuit and reverse recovery time waveform and definition. 1996 Jun 11 6 Philips Semiconductors Product specification Controlled avalanche rectifier PACKAGE OUTLINE handbook, full pagewidth k 3.81 max 28 min Dimensions in mm. Fig.11 SOD57. , 4.57 max BY527 a 0.81 max 28 min MBC880 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. 1996 Jun 11 7 |
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