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| INTEGRATED CIRCUITS DATA SHEET TEA1098 Speech and handsfree IC Product specification Supersedes data of 2000 Sep 26 File under Integrated Circuits, IC03 2001 Aug 24 Philips Semiconductors Product specification Speech and handsfree IC FEATURES Line interface * Low DC line voltage * Voltage regulator with adjustable DC voltage * Symmetrical high impedance inputs (70 k) for dynamic, magnetic40 or electret microphones * DTMF input with confidence tone on earphone and/or loudspeaker * Receive amplifier for dynamic, magnetic or piezo-electric earpieces (with externally adjustable gain) * Automatic Gain Control (AGC) for true line loss compensation. Supplies * Provides a strong 3.35 V regulated supply for microcontrollers or diallers * Provides filtered power supply, optimized according to line current * Filtered 2.0 V power supply output for electret microphone * PD logic input for power-down. Handsfree * Asymmetrical high input impedance for electret microphone * Loudspeaker amplifier with single-ended rail-to-rail output and externally adjustable gain ORDERING INFORMATION TYPE NUMBER TEA1098TV TEA1098UH PACKAGE NAME VSO40 - bare die; on foil DESCRIPTION plastic very small outline package; 40 leads TEA1098 * Dynamic limiter on loudspeaker amplifier to prevent distortion * Logarithmic volume control on loudspeaker amplifier via linear potentiometer * Duplex controller consisting of: - Signal and noise envelope monitors for both channels (with adjustable sensitivities and timing) - Decision logic (with adjustable switch-over and Idle mode timing) - Voice switch control (with adjustable switching range and constant sum of gain during switching). APPLICATIONS * Line powered telephone sets. GENERAL DESCRIPTION The TEA1098 is an analog bipolar circuit dedicated to telephony applications. It includes a line interface, handset (HS) microphone and earpiece amplifiers, handsfree (HF) microphone and loudspeaker amplifiers and a duplex controller with signal and noise monitors on both channels. This IC provides a 3.35 V supply for a microcontroller or dialler and a 2.0 V filtered voltage supply for an electret microphone. VERSION SOT158-1 - 2001 Aug 24 2 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 QUICK REFERENCE DATA Iline = 15 mA; RSLPE = 20 ; Zline = 600 ; f = 1 kHz; Tamb = 25 C for TEA1098TV; Tj = 25 C for TEA1098UH; pin AGC connected to pin LN; PD = HIGH; HFC = LOW; MUTE = HIGH; measured according to test circuit; unless otherwise specified. SYMBOL Iline VSLPE VBB VDD IBB IBB(pd) Gv(MIC-LN) Gv(IR-RECO) Gv(QR) PARAMETER line current operating range stabilized voltage between pins SLPE and GND regulated supply voltage for internal circuitry regulated supply voltage on pin VDD current available on pin VBB current consumption on VBB during power-down phase CONDITIONS normal operation with reduced performance Iline = 15 mA Iline = 70 mA Iline = 15 mA Iline = 70 mA VBB > 3.35 V + 0.25 V (typ.) otherwise in speech mode in handsfree mode PD = LOW MIN. 11 1 3.4 5.7 2.75 4.9 3.1 - - - - 43.3 28.7 -3 VTXIN = 3 mV (RMS); RGATX = 30.1 k VHFTX = 15 mV (RMS) VHFRX = 30 mV (RMS); RGALS = 255 k; Iline = 70 mA RSWR = 365 k 12.7 33.5 25.5 - -40 5.45 - - 3.7 6.1 3.0 5.3 3.35 11 9 460 44.3 29.7 - 15.2 34.7 28 40 - 6.45 TYP. MAX. UNIT 130 11 4.0 6.5 3.25 5.7 3.6 - - - 45.3 30.7 +15 17.7 35.9 30.5 - +12 7.45 mA mA V V V V V V mA mA A dB dB dB dB dB dB dB dB dB VBB - 0.25 - voltage gain from pins MIC+/MIC- VMIC = 5 mV (RMS) to LN voltage gain from pin IR (referenced to LN) to RECO gain voltage range between pins RECO and QR VIR = 8 mV (RMS) Gv(TXIN-TXOUT) voltage gain from pin TXIN to TXOUT Gv(HFTX-LN) voltage gain from pin HFTX to LN Gv(HFRX-LSAO) voltage gain from pin HFRX to LSAO SWRA SWRA Gv(trx) switching range switching range adjustment gain control range for transmit and Iline = 70 mA receive amplifiers affected by the AGC; with respect to Iline = 15 mA 2001 Aug 24 3 Philips Semiconductors Product specification Speech and handsfree IC BLOCK DIAGRAM TEA1098 handbook, full pagewidth REG 19 SLPE 17 13 VBB LN 18 STARTER R1 22 VDD LINE CURRENT DETECTION LOW VOLTAGE BEHAVIOUR SWITCH SUPPLY MANAGEMENT 23 MICS AGC 21 AGC POWER-DOWN CURRENT SOURCES 1 PD GND 16 Tail currents for preamps HFTX 39 TEA1098TV DTMF 35 MIC+ 34 MIC- 33 ATTENUATOR LOGIC INPUTS DECODING 40 HFC 2 MUTE 30 GATX 29 TXOUT TXIN 31 32 GNDTX 27 SWT TSEN 8 TENV 7 TNOI 6 RNOI 9 RENV 11 RSEN 10 VOLUME CONTROL GALS 14 LSAO 15 26 VOL TX AND RX ENVELOPE AND NOISE DETECTORS BUFFERS AND COMPARATORS 24 STAB DUCO LOGIC SWT STATUS VOICE SWITCH 25 SWR 28 IDT 5 HFRX DLC 12 DYNAMIC LIMITER 20 IR RECO 38 GARX 37 QR 36 ATTENUATOR MGL317 Fig.1 Block diagram. 2001 Aug 24 4 Philips Semiconductors Product specification Speech and handsfree IC PINNING PIN SYMBOL TEA1098TV PD MUTE n.c. n.c. n.c. HFRX TNOI TENV TSEN RNOI RSEN RENV DLC VBB GALS LSAO n.c. GND SLPE LN REG IR AGC VDD MICS STAB SWR VOL SWT IDT TXOUT GATX TXIN GNDTX MIC- MIC+ DTMF QR 1 2 3 4 - 5 6 7 8 9 10 11 12 13 14 15 - 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 TEA1098UH 40 41 42 43 44 1 2 3 4 5 6 7 8 9 10 11 12 13 14 and 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 and 31 32 33 34 35 power-down input (active LOW) logic input (active LOW) not connected not connected not connected receive input for loudspeaker amplifier transmit noise envelope timing adjustment transmit signal envelope timing adjustment transmit signal envelope sensitivity adjustment receive noise envelope timing adjustment receive signal envelope sensitivity adjustment receive signal envelope timing adjustment dynamic limiter capacitor for the loudspeaker amplifier stabilized supply for internal circuitry loudspeaker amplifier gain adjustment loudspeaker amplifier output not connected ground reference line current sense positive line terminal input line voltage regulator decoupling receive amplifier input automatic gain control or line loss compensation input 3.35 V regulated voltage supply for microcontrollers microphone supply reference current adjustment switching range adjustment loudspeaker volume adjustment switch-over timing adjustment Idle mode timing adjustment HF microphone amplifier output HF microphone amplifier gain adjustment HF microphone amplifier input ground reference for microphone amplifiers negative handset microphone amplifier input positive handset microphone amplifier input dual tone multi-frequency input earpiece amplifier output PAD DESCRIPTION TEA1098 2001 Aug 24 5 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 PIN SYMBOL TEA1098TV GARX RECO HFTX HFC 37 38 39 40 PAD DESCRIPTION TEA1098UH 36 37 38 39 earpiece amplifier gain adjustment receive amplifier output transmit input for line amplifier logic input handbook, halfpage PD 1 MUTE 2 n.c. 3 n.c. 4 HFRX 5 TNOI 6 TENV 7 TSEN 8 RNOI 9 RSEN 10 40 HFC 39 HFTX 38 RECO 37 GARX 36 QR 35 DTMF 34 MIC+ 33 MIC- 32 GNDTX 31 TXIN TEA1098TV RENV 11 DLC 12 VBB 13 GALS 14 LSAO 15 GND 16 SLPE 17 LN 18 REG 19 IR 20 MGL341 30 GATX 29 TXOUT 28 IDT 27 SWT 26 VOL 25 SWR 24 STAB 23 MICS 22 VDD 21 AGC Fig.2 Pin configuration. 2001 Aug 24 6 Philips Semiconductors Product specification Speech and handsfree IC FUNCTIONAL DESCRIPTION All data values given in this chapter are typical, except when otherwise specified. Supplies LINE INTERFACE AND INTERNAL SUPPLY (PINS LN, SLPE, REG AND VBB) The supply for the TEA1098 and its peripherals is obtained from the line. The IC generates a stabilized reference voltage (Vref) between pins SLPE and GND. This reference voltage is equal to 3.7 V for line currents below 18 mA. When the line current rises above 45 mA, the reference voltage rises linearly to 6.1 V. For line currents below 9 mA, Vref is automatically adjusted to a lower value. The performance of the TEA1098 in this so-called low voltage area is limited (see Section "Low voltage behaviour"). The reference voltage is temperature compensated. The voltage between pins SLPE and REG is used by the internal regulator to generate the stabilized reference voltage and is decoupled by a capacitor connected between pins LN and REG. This capacitor, converted into an equivalent inductance realizes the set impedance conversion from its DC value (RSLPE) to its AC value (done by an external impedance). The IC regulates the line voltage at pin LN which can be calculated as follows: V LN = V ref + R SLPE x I SLPE I SLPE = I line - I LN where: Iline = line current ILN = current consumed on pin LN (approximately a few A) ISLPE = current flowing through the RSLPE resistor. The preferred value for RSLPE is 20 . Changing this value not only affects the DC characteristics, it also influences the transmit gains to the line, the gain control characteristic, the sidetone level, and the maximum output swing on the line. TEA1098 Figure 3 shows that the internal circuit is supplied by pin VBB, which combined with the line interface is a strong supply point. The line current through resistor RSLPE is sunk by the VBB voltage stabilizer, and is suitable for supplying a loudspeaker amplifier or any peripheral IC. VBB is 3.0 V at line currents below 18 mA and rises linearly to 5.3 V when the line current rises above 45 mA. It is temperature compensated. The current switch (TR1 and TR2) is intended to reduce distortion of large AC line signals. Current ISLPE is supplied to VBB via TR1 when the voltage on pin SLPE is above VBB + 0.25 V. When the voltage on pin SLPE is below this value, ISLPE is shunted to GND via TR2. Voltage Vref can be increased by connecting an external resistor between pins REG and SLPE. For large line currents, this increase can slightly affect some dynamic performances such as maximum signal level on the line at THD = 2%. The external resistor does not affect the voltage on pin VBB; see Fig.4 for the main DC voltages. VDD SUPPLY FOR MICROCONTROLLERS (PIN VDD) The voltage on the VDD supply point follows the voltage on VBB with a difference typically of 250 mV, internally limited to 3.35 V. This voltage is temperature compensated. This supply point can provide a current of up to typically 3 mA. Its internal consumption stays low (a few 10 nA) as long as VDD does not exceed 1.5 V (see Fig.5). An external voltage can be connected to VDD with limited extra consumption on VDD (typically 100 A). This voltage source should not be below 3.5 V or above 6 V. VBB and VDD can supply current to external circuits within the line limits, taking into account the internal current consumption. 2001 Aug 24 7 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 LN handbook, full pagewidth RSLPE 20 SLPE CREG 4.7 F E1 D1 J1 R3 REG R1 TR1 TR2 GND VBB E2 TP1 D1 TN2 R2 from preamp TN1 GND GND J2 MGM298 Fig.3 Line interface principle. SUPPLY FOR MICROPHONE (PINS MICS AND GNDTX) The MICS output can be used as a supply for an electret microphone. Its voltage is equal to 2.0 V; it can source a current of up to 1 mA and has an output impedance equal to 200 . LOW VOLTAGE BEHAVIOUR For line currents below 9 mA, the reference voltage is automatically adjusted to a lower value; the VBB voltage follows the SLPE voltage with a difference of 250 mV. Any excess current available, other than for the purposes of DC biasing the IC, will be small. At low reference voltage, the IC has limited performance. When voltage VBB falls below 2.7 V, it is detected by the receive dynamic limiter circuit connected to pin LSAO and is continuously activated, discharging the capacitor connected to pin DLC. In the DC condition, the loudspeaker is then automatically disabled below this voltage. When VBB falls below 2.5 V, the TEA1098 is forced into a low voltage mode irrespective of the logic input levels. This is a speech mode with reduced performance which only enables the microphone channel (between the MIC inputs and pin LN) and the earpiece amplifier. These two channels are able to deliver signals for line currents as small as 3 mA. The HFC input is tied to GND sinking a current of typically 300 A. POWER-DOWN MODE (PIN PD) To reduce consumption during dialling or register recall (flash), the TEA1098 is provided with a power-down input (pin PD). When the voltage on pin PD is LOW, the current consumption from VBB and VDD is reduced to typically 460 A. Therefore a capacitor of 470 F on VBB is sufficient to power the TEA1098 during pulse dialling or flash. The PD input has a pull-up structure. In this mode, the capacitor CREG is internally disconnected. 2001 Aug 24 8 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 handbook, full pagewidth 8 FCA049 LN voltages (V) SLPE 6 VBB 4 VDD 2 MICS 0 0 0.01 0.02 0.03 0.04 0.05 0.06 Iline (A) 0.07 Fig.4 Main DC voltages. 10 8 handbook, full pagewidth IDD (pA) 10 7 FCA050 10 6 10 5 10 4 10 3 10 2 10 1.0 1.5 2.0 2.5 VDD (V) 3.0 Fig.5 Current consumption on VDD. 2001 Aug 24 9 Philips Semiconductors Product specification Speech and handsfree IC Transmit channels (pins MIC+, MIC-, DTMF, HFTX and LN) HANDSET MICROPHONE AMPLIFIER (PINS MIC+, MIC- AND LN) The TEA1098 has symmetrical microphone inputs. The input impedance between pins MIC+ and MIC- is typically 70 k. The voltage gain between pins MIC+/MIC- and LN is set to 44.3 dB. Without output limitation, the microphone input stage can accept signals of up to 18 mV (RMS) at THD = 2% (room temperature). The microphone inputs are biased at a voltage of one diode. Automatic gain control is provided for line loss compensation. DTMF AMPLIFIER (PINS DTMF, LN AND RECO) The TEA1098 has an asymmetrical DTMF input. The input impedance between DTMF and GND is typically 20 k. The voltage gain between pins DTMF and LN is set to 25.35 dB. Without output limitation, the input stage can accept signals of up to 180 mV (RMS) at THD = 2% (room temperature). When the DTMF amplifier is enabled, dialling tones may be sent on the line. These tones can be heard in the earpiece or in the loudspeaker at a low level. This is called the confidence tone. The voltage attenuation between pins DTMF and RECO is typically -16.5 dB. This input is DC biased at 0 V. The automatic gain control has no effect on these channels. HANDSFREE TRANSMIT AMPLIFIER (PINS HFTX AND LN) The TEA1098 has an asymmetrical HFTX input, which is mainly intended for use in combination with the TXOUT output. The input impedance between HFTX and GND is typically 20 k. The voltage gain between pins HFTX and LN is set to 34.7 dB. Without output limitation, the input stage can accept signals of up to 95 mV (RMS) at THD = 2% (room temperature). The HFTX input is biased at a voltage of two diodes. Automatic gain control is provided for line loss compensation. TEA1098 Receive channels (pins IR, RECO, GARX and QR) RX AMPLIFIER (PINS IR AND RECO) The receive amplifier has one input (IR) which is referenced to the line. The input impedance between pins IR and LN is typically 20 k and the DC bias between these pins is equal to the voltage of one diode. The gain between pins IR (referenced to LN) and RECO is typically 29.7 dB. Without output limitation, the input stage can accept signals of up to 50 mV (RMS) at THD = 2% (room temperature). The receive amplifier has a rail-to-rail output (RECO), which is designed for use with high ohmic (real) loads of more than 5 k. This output is biased at a voltage of two diodes. Automatic gain control is provided for line loss compensation. EARPIECE AMPLIFIER (PINS GARX AND QR) The earpiece amplifier is an operational amplifier which has an output (QR) and an inverting input (GARX). Its input signal is fed by a decoupling capacitor from the receive amplifier output (RECO) to two resistors which set the required gain or attenuation from -3 to +15 dB compared to the receive gain. Two external capacitors CGAR (connected between GAR and QR) and CGARS (connected between GAR and GND) ensure stability. The CGAR capacitor provides a first-order low-pass filter. The cut-off frequency corresponds to the time constant CGAR x Re2. The relationship CGARS 10 x CGAR must be satisfied. The earpiece amplifier has a rail-to-rail output (QR) biased at a voltage of two diodes. It is designed for use with low ohmic (real) loads of 150 , or capacitive loads of 100 nF in series with 100 . 2001 Aug 24 10 Philips Semiconductors Product specification Speech and handsfree IC AGC (pin AGC) The TEA1098 performs automatic line loss compensation, which fits well with the true line attenuation. The automatic gain control varies the gain of some transmit and receive amplifiers in accordance with the DC line current. The control range is 6.45 dB for Gv(MIC-LN) and Gv(IR-RECO), and 6.8 dB for Gv(HFTX-LN), which corresponds approximately to a line length of 5.5 km for a 0.5 mm twisted-pair copper cable. To enable this gain control, pin AGC must be shorted to pin LN. The start current for compensation corresponds to a line current of typically 23 mA and a stop current of 57 mA. The start current can be increased by connecting an external resistor between pins AGC and LN. It can be increased by up to 40 mA (using a resistor of typically 80 k). The start and stop current will be maintained at a ratio of 2.5. By leaving pin AGC open, the gain control is disabled and no line loss compensation occurs. Handsfree application Figure 6 shows a loop is formed by the sidetone network in the line interface section, and by the acoustic coupling between loudspeaker and microphone in the handsfree section. A loop-gain of greater than 1 causes howl. TEA1098 To prevent howl in full duplex applications, the loop-gain must be set much lower than 1. This is achieved by the duplex controller which detects the channel with the `largest' signal and controls the gains of the microphone and the loudspeaker amplifiers so that the sum of their gains remains constant. Therefore in the handsfree application, the circuit can have three stable modes: 1. Transmit mode (Tx mode): The microphone amplifier is at maximum gain, and the loudspeaker amplifier is at minimum gain. 2. Receive mode (Rx mode): The microphone amplifier is at minimum gain, and the loudspeaker amplifier is at maximum gain. 3. Idle mode: The microphone amplifier and the loudspeaker amplifier are both midway between maximum and minimum gain. The difference between the maximum and minimum gain is called the switching range. handbook, full pagewidth acoustic coupling telephone line HYBRID DUPLEX CONTROL sidetone MGM299 Fig.6 Handsfree telephone set principles. 2001 Aug 24 11 Philips Semiconductors Product specification Speech and handsfree IC HANDSFREE MICROPHONE CHANNEL (PINS TXIN, GATX, TXOUT AND GNDTX; See Fig.7) The TEA1098 has an asymmetrical handsfree microphone input (TXIN) with an input resistance of 20 k. The input DC bias is 0 V. The gain of the input stage varies according to the TEA1098 mode. In Tx mode, it has maximum gain; in Rx mode, it has minimum gain, and in Idle mode, it is midway between maximum and minimum gain. TEA1098 Switch-over from one mode to the other is smooth and click-free. The output (TXOUT) is biased at a voltage of two diodes and has a current capability of 20 A (RMS). In Tx mode, the overall gain of the microphone amplifier (from pins TXIN to TXOUT) can be adjusted from 0 up to 31 dB to suit specific application requirements. The gain is proportional to the value of RGATX and equals 15.2 dB when RGATX is 30.1 k. Without output limitation, the microphone input stage can accept signals of up to 18 mV (RMS) at THD = 2% (room temperature). handbook, full pagewidth VBB RMIC CMIC TXIN 31 V I I V 30 GATX RGATX 29 TXOUT to envelope detector from voice switch 32 GNDTX MGL342 Fig.7 Handsfree microphone channel. LOUDSPEAKER CHANNEL Loudspeaker amplifier (pins HFRX, GALS and LSAO) The TEA1098 loudspeaker amplifier has an asymmetrical input with an input resistance of 20 k between pins HFRX and GND. It is biased at a voltage of two diodes. Without output limitation, the input stage can accept signals of up to 580 mV (RMS) at THD = 2% (room temperature). The gain of the input stage varies according to the TEA1098 mode. In Rx mode, it has maximum gain; in Tx mode, it has minimum gain and in Idle mode, it is halfway between maximum and minimum gain. Switch-over from one mode to the other is smooth and click-free. The rail-to-rail output stage is designed to power a loudspeaker connected as a single-ended load (between pins LSAO and GND). 2001 Aug 24 12 In Rx mode, the overall gain of the loudspeaker amplifier can be adjusted from 0 up to 35 dB to suit specific application requirements. The gain from pin HFRX to pin LSAO is proportional to the value of RGALS and is 28 dB when RGALS is 255 k. It is recommended that a capacitor is connected in parallel with RGALS to provide a first-order low-pass filter. Volume control (pin VOL) The loudspeaker amplifier gain can be adjusted by the potentiometer RVOL. For logarithmic gain control, a linear potentiometer can be used. Each 1.9 k increase of RVOL results in a gain loss of 3 dB. The maximum gain reduction using the volume control is internally limited to the switching range (see Fig.8). Philips Semiconductors Product specification Speech and handsfree IC TEA1098 handbook, full pagewidth RGALS to logic GALS 14 VBB LSAO 15 V I to/from voice switch to envelope detector CGALS CLSAO I V 5 HFRX DLC 12 CDLC DYNAMIC LIMITER VOLUME CONTROL 26 VOL RVOL MGL343 Fig.8 Loudspeaker channel. Dynamic limiter (pin DLC) The TEA1098 dynamic limiter prevents clipping of the loudspeaker output stage and protects the operation of the circuit when the supply voltage at VBB falls below 2.7 V. Hard clipping of the loudspeaker output stage is prevented by rapidly reducing the gain when the output stage starts to saturate. The time taken to effect gain reduction (clipping attack time) is approximately a few milliseconds. The circuit stays in the reduced gain mode until the peaks of the loudspeaker signals no longer cause saturation. The gain of the loudspeaker amplifier then returns to its normal value within the clipping release time (typically 250 ms). Both attack and release times are proportional to the value of the capacitor CDLC. The total harmonic distortion of the loudspeaker output stage, in reduced gain mode, stays below 2% up to 10 dB (minimum) of input voltage overdrive providing VHFRX is below 580 mV (RMS). When the supply voltage falls below an internal threshold voltage of 2.7 V, the gain of the loudspeaker amplifier is reduced rapidly (approximately 1 ms). When the supply voltage rises above 2.7 V, the gain of the loudspeaker amplifier is increased. By forcing a level lower than 0.2 V on pin DLC, the loudspeaker amplifier is muted and the TEA1098 is automatically forced into the Tx mode. DUPLEX CONTROLLER Signal and noise envelope detectors (pins TSEN, TENV, TNOI, RSEN, RENV and RNOI) The strength of signal level and background noise in both channels is monitored by signal envelope detectors and noise envelope detectors respectively. The outputs of the envelope detectors provide inputs to the decision logic. The signal and noise envelope detectors are shown in Fig.9. For the transmit channel, the signal between pin TXIN and pin TSEN is amplified by 40 dB. For the receive channel, the signal between pin HFRX and pin RSEN is amplified by 0 dB. The signals between pin TSEN and pin TENV, and between pin RSEN and pin RENV are logarithmically compressed and buffered. The sensitivity of the envelope detectors is set by resistors RTSEN and RRSEN. The capacitors connected in series with these two resistors block any DC component and form a first-order high-pass filter. In the basic application (see Fig.17) it is assumed that VTXIN = 1 mV (RMS) and VHFRX = 100 mV (RMS) nominal and RTSEN and RRSEN both have a value of 10 k. When capacitors CTSEN and CRSEN both have a value of 100 nF, the cut-off frequency is at 160 Hz. 13 2001 Aug 24 Philips Semiconductors Product specification Speech and handsfree IC The buffer amplifiers feeding the compressed signals to pins TENV and RENV have a maximum source current of 120 A and a maximum sink current of 1 A. Capacitors CTENV and CRENV set the timing of both signal envelope detectors. In the basic application, the value of both capacitors is 470 nF. Because of the logarithmic compression, each 6 dB signal increase means an 18 mV increase on the signal envelopes at pins TENV or RENV (room temperature). Thus, timings can be expressed in dB/ms. At room temperature, the 120 A sourced current corresponds to a maximum signal envelope rise-slope of 85 dB/ms, which is sufficient to track normal speech signals. The 1 A current sunk by pin TENV or pin RENV corresponds to a maximum fall-slope of 0.7 dB/ms. This is sufficient for a smooth envelope and also eliminates the effect of echoes on switching behaviour. To determine the noise level, the signals between pin TENV and pin TNOI, and between pin RENV and pin RNOI are buffered. The buffers have a maximum source current of 1 A and a maximum sink current of 120 A. TEA1098 Capacitors CTNOI and CRNOI set the timing of both noise envelope detectors. In the basic application (see Fig.17) the value of both capacitors is 4.7 F. At room temperature, the 1 A sourced current corresponds to a maximum noise envelope rise-slope of approximately 0.07 dB/ms which is small enough to track background noise without being affected by speech bursts. The 120 A sink current corresponds to a maximum fall-slope of approximately 8.5 dB/ms. However, because the noise envelope tracks the fall of the signal envelope, it will never fall faster than approximately 0.7 dB/ms. The behaviour of the signal envelope and noise envelope detectors is illustrated in Fig.10. handbook, full pagewidth DUPLEX CONTROLLER to logic LOG from microphone amplifier from loudspeaker amplifier LOG to logic 8 TSEN RTSEN CTSEN 7 TENV 6 TNOI 10 RSEN RRSEN 11 RENV 9 RNOI CTENV CTNOI CRSEN CRENV CRNOI MGL344 Fig.9 Signal and noise envelope detectors. 2001 Aug 24 14 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 handbook, full pagewidth 4 mV (RMS) 1 mV (RMS) MBG354 INPUT SIGNAL SIGNAL ENVELOPE A A: 85 dB/ms B: 0.7 dB/ms 36 mV B A B NOISE ENVELOPE C B: 0.7 dB/ms C: 0.07 dB/ms 36 mV B C B time Fig.10 Signal and noise envelope waveforms. Decision logic (pins IDT and SWT) The TEA1098 selects its mode of operation (Tx, Rx or Idle) by comparing the signal and noise envelopes of both channels. This is executed by the decision logic. The resulting voltage on pin SWT is the input to the voice switch. To facilitate the distinction between signal and noise, the signal is considered as speech when its envelope is more than 4.3 dB above the noise envelope. At room temperature, this is equal to a voltage difference of VENV - VNOI = 13 mV. This so called speech/noise threshold is implemented in both channels. The signal on pin TXIN contains both speech and the acoustically coupled signal from the loudspeaker. In Rx mode, the loudspeaker signal overrides the speech. Therefore, the signal envelope on pin TENV consists mainly of the loudspeaker signal. To correct this, an attenuator is connected between pin TENV and the TENV/RENV comparator. Its attenuation is equal to that applied to the microphone amplifier. When a dial tone is present on the line, without monitoring, it would be recognized as noise because it has a constant amplitude. This would cause the TEA1098 to go into Idle mode, and the user would hear the dial tone fade away. 2001 Aug 24 15 To prevent this, a dial tone detector monitors input signals between pins HFRX and GND. In standard applications, the detector does not consider a signal level above 25 mV (RMS) to be noise. This level is proportional to the value of RRSEN. Similarly, a transmit detector monitors input signals between pins TXIN and GNDTX. In standard applications the detector does not consider a signal level above 0.75 mV (RMS) to be noise. This level is proportional to the value of RTSEN. Figure 11 shows that the output of the decision logic is a current source. The logic table shows the relationship between the input levels and the value of the current source. The current source can charge or discharge the capacitor CSWT at a switch-over current of 10 A. If the current is zero, the voltage on pin SWT becomes equal to the voltage on pin IDT via the high-ohmic resistor RIDT (idling). The resulting voltage difference between pins SWT and IDT can vary between -400 and +400 mV and determines the TEA1098 mode (see Table 1). Philips Semiconductors Product specification Speech and handsfree IC TEA1098 handbook, full pagewidth 28 IDT DUPLEX CONTROLLER Vref TENV 7 TNOI 6 13 mV ATTENUATOR LOGIC(1) RIDT 27 SWT CSWT X X 1 X X 0 1 0 0 1 0 1 X X 0 X -10 A +10 A +10 A 0 0 RENV 11 RNOI 9 13 mV X 1 X 0 Vdt from logic from dynamic limiter MGL345 (1) When DLC < 0.2 V the current of -10 A is forced. Fig.11 Decision logic. Table 1 TEA1098 modes MODE Tx mode Idle mode Rx mode VSWT - VIDT (mV) <-180 0 >180 The switch-over time, from Rx or Tx mode to Idle mode is equal to 4 x RIDT x CSWT and is approximately 2 s (Idle mode time). The DLC input overrides the decision logic. When the voltage on pin DLC falls below 0.2 V, the capacitor CSWT is discharged by 10 A which selects Tx mode. The switch-over timing can be set by capacitor CSWT and the Idle mode timing can be set by capacitor CSWT and resistor RIDT. In the basic application given in Fig.17, CSWT is 220 nF and RIDT is 2.2 M. This enables a switch-over time from Tx to Rx mode or vice-versa of approximately 13 ms (580 mV swing on pin SWT). The switch-over time from Idle mode to Tx or Rx mode is approximately 4 ms (180 mV swing on pin SWT). 2001 Aug 24 16 Philips Semiconductors Product specification Speech and handsfree IC Voice switch (pins STAB and SWR) Figure 12 is a diagram of the voice switch. With a voltage on pin SWT, the TEA1098 voice switch regulates the gains of the transmit and the receive channels so that the sum of both is held constant. In Tx mode, the microphone amplifier is at maximum gain and the loudspeaker amplifier is at minimum gain. In Rx mode, their gains are the opposite. In Idle mode, both microphone and loudspeaker amplifiers are midway between maximum and minimum gain. The difference between the maximum and minimum gain is called the switching range. This range is determined by the ratio of resistors RSWR to RSTAB and is adjustable between 0 and 52 dB. Resistor RSTAB should be 3.65 k which sets an internally used reference current. TEA1098 In the basic application diagram (see Fig.17) resistor RSWR is 365 k which results in a switching range of 40 dB. The switch-over behaviour is illustrated in Fig.13. In Rx mode, the gain of the loudspeaker amplifier can be reduced using the volume control. At the same time, the gain of the microphone amplifier increases, since the voice switch keeps the sum of the gains constant (see dashed curves in Fig.13). However, in Tx mode, the volume control has no effect on the gains of the microphone or loudspeaker amplifiers. Consequently, the switching range is reduced when the volume is reduced. At maximum reduction of volume, the switching range is 0 dB. handbook, halfpage halfpage Idle mode MGM305 DUPLEX CONTROLLER to microphone amplifier from SWT Gvtx, Gvrx (10 dB/div) Tx mode Rx mode RVOL () 11400 7600 3800 0 0 3800 7600 11400 Gvtx Gvtx + Gvrx = C(1) VOICE SWITCH 24 STAB 25 SWR RSTAB RSWR from volume control to loudspeaker amplifier MGL346 Gvrx -400 -200 0 +200 +400 VSWT - VIDT (mV) (1) C = constant. Fig.12 Voice switch. Fig.13 Switch-over behaviour. 2001 Aug 24 17 Philips Semiconductors Product specification Speech and handsfree IC Logic inputs Table 2 Selection of transmit and receive channels for 5 different application modes LOGIC INPUTS FEATURES PD 0 1 1 1 1 HFC X 0 0 1 1 MUTE X 0 1 0 1 DTMF to LN; DTMF to RECO; QR and MICS are active MICS to LN; IR to RECO; QR and MICS are active DTMF to LN; DTMF to RECO; HFRX to LSAO; QR and MICS are active TXIN to TXOUT; HFTX to LN; IR to RECO; HFRX to LSAO; MICS is active TEA1098 APPLICATION EXAMPLES flash; DC dialling DTMF dialling in handset mode handset conversation mode DTMF dialling in handsfree mode handsfree conversation mode LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); all DC levels are referenced to GND. SYMBOL VLN PARAMETER positive continuous line voltage repetitive line voltage during switch-on or line interruption Vn(max) maximum voltage on pins REG, SLPE, IR and AGC maximum voltage on all other pins except VDD Iline Ptot maximum line current total power dissipation TEA1098TV TEA1098UH Tstg Tamb Tj Note 1. Mostly dependent on the maximum required ambient temperature, on the voltage between LN and SLPE and on the thermal resistance between die and ambient temperature. This thermal resistance depends on the application board layout and on the materials used. Figure 15 shows the safe operating area versus this thermal resistance for ambient temperature Tamb = 75 C. storage temperature ambient temperature junction temperature Tamb = 75 C; see Fig.14 Tamb = 75 C; note 1 - - -40 -25 - 400 - +125 +75 125 mW mW C C C CONDITIONS MIN. -0.4 -0.4 -0.4 -0.4 - MAX. +12 +13.2 UNIT V V VLN + 0.4 V VBB + 0.4 V 130 mA 2001 Aug 24 18 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 handbook, full pagewidth 160 Iline (mA) FCA028 120 (1) (2) (3) (4) 80 (5) (6) 40 0 3.5 5.5 7.5 9.5 11.5 VSLPE (V) 13.5 CURVE (1) (2) (3) (4) (5) (6) Fig.14 Safe operating area of the TEA1098TV. Tamb (C) 25 35 45 55 65 75 Ptot (mW) 790 710 630 550 470 390 2001 Aug 24 19 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 handbook, full pagewidth 160 FCA079 Iline (mA) (1) 120 (2) (3) 80 (4) (5) (6) (7) 40 0 2 4 6 8 10 VSLPE (V) 12 CURVE (1) (2) (3) (4) (5) (6) (7) Fig.15 Safe operating area of the TEA1098UH at Tamb = 75 C. Rth(j-a) (K/W) 40 50 60 75 90 105 130 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) TEA1098TV TEA1098UH Note 1. The value is to be determined by the customer in the application. PARAMETER thermal resistance from junction to ambient in free air note 1 117 - K/W K/W CONDITIONS VALUE UNIT 2001 Aug 24 20 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 CHARACTERISTICS Iline = 15 mA; RSLPE = 20 ; Zline = 600 ; f = 1 kHz; Tamb = 25 C for TEA1098TV; Tj = 25 C for TEA1098UH; pin AGC connected to pin LN; PD = HIGH; HFC = LOW; MUTE = HIGH; measured according to test circuit; all DC levels are referenced to GND; unless otherwise specified. SYMBOL Supplies LINE INTERFACE AND INTERNAL SUPPLY (PINS LN, SLPE, REG AND VBB) VSLPE VBB Iline VSLPE(T) VBB(T) IBB VLN stabilized voltage between pins SLPE and GND regulated supply voltage for internal circuitry line current for voltage increase Iline = 15 mA Iline = 70 mA Iline = 15 mA Iline = 70 mA start current stop current stabilized voltage variation with Tamb = -25 to +75 C temperature referenced to 25 C regulated voltage variation with Tamb = -25 to +75 C temperature referenced to 25 C current available on pin VBB line voltage in speech mode in handsfree mode Iline = 1 mA Iline = 4 mA Iline = 15 mA Iline = 130 mA SUPPLY FOR PERIPHERALS (PIN VDD) VDD regulated supply voltage on VDD VBB > 3.35 V + 0.25 V (typ.) otherwise VDD(T) regulated voltage variation with Tamb = -25 to +75 C; temperature referenced to 25 C VBB > 3.35 V + 0.25 V (typ.) current consumption on VDD in trickle mode; Iline = 0 mA; VDD = 1.5 V; VBB discharging VDD > 3.35 V IDD(o) VMICS IMICS VIL VIH IPD current available for peripherals VDD = 3.35 V SUPPLY FOR MICROPHONE (PIN MICS) supply voltage for a microphone current available on MICS - - -0.4 1.8 - 2.0 - - - -3 - -1 +0.3 -6 V mA 3.1 - - 3.35 3.6 V V mV 3.4 5.7 2.75 4.9 - - - - - - - - 3.7 - 3.7 6.1 3.0 5.3 18 45 60 30 11 9 1.55 2.35 4.0 8.7 4 6.5 3.25 5.7 - - - - - - - - 4.3 9.5 V V V V mA mA mV mV mA mA V V V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VBB - 0.25 - 30 - IDD - 15 150 nA 60 - 100 -3 - - A mA POWER-DOWN INPUT (PIN PD) LOW-level input voltage HIGH-level input voltage input current V A VBB + 0.4 V 2001 Aug 24 21 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 SYMBOL IBB(PD) PARAMETER current consumption on VBB during power-down CONDITIONS PD = LOW MIN. - TYP. 460 - MAX. UNIT A Preamplifier inputs (pins MIC+, MIC-, IR, DTMF, TXIN, HFTX and HFRX) Zi(MIC) input impedance differential between pins MIC+ and MIC- single-ended between pins MIC+/MIC- and GNDTX Zi(IR) Zi(DTMF) Zi(TXIN) Zi(HFTX) Zi(HFRX) TX amplifiers TX HANDSET MICROPHONE AMPLIFIER (PINS MIC+, MIC- AND LN) Gv(MIC-LN) Gv(f) Gv(T) CMRR THD voltage gain from pins MIC+/MIC- to LN gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C common mode rejection ratio total harmonic distortion at LN VLN = 1.4 V (RMS) Iline = 4 mA; VLN = 0.12 V (RMS) Vno(LN) noise output voltage at pin LN; pins MIC+/MIC- shorted through 200 gain reduction if not activated VMIC = 5 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C 43.3 - - - - - 44.3 0.25 0.25 80 - - -77.5 45.3 - - - 2 10 - dB dB dB dB % % dBmp input impedance between pins IR and LN input impedance between pins DTMF and GND input impedance between pins TXIN and GNDTX input impedance between pins HFTX and GND input impedance between pins HFRX and GND - - - - - - - 70 35 20 20 20 20 20 - - - - - - - k k k k k k k psophometrically weighted - (p53 curve) see Table 2 60 Gv(mute) Gv(DTMF-LN) Gv(f) Gv(T) Gv(mute) 80 - 26.35 - - - dB DTMF AMPLIFIER (PINS DTMF, LN AND RECO) voltage gain from pins DTMF to LN gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C gain reduction if not activated VDTMF = 50 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C see Table 2 24.35 25.35 - - 60 0.25 0.25 80 dB dB dB dB 2001 Aug 24 22 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 SYMBOL Gv(DTMF-RECO) PARAMETER voltage gain from pin DTMF to RECO CONDITIONS VDTMF = 50 mV (RMS) MIN. - TYP. -16.5 - MAX. UNIT dB TX AMPLIFIER USING HFTX (PINS HFTX AND LN) Gv(HFTX-LN) Gv(f) Gv(T) THD VHFTX(rms) Vno(LN) voltage gain from pin HFTX to LN gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C total harmonic distortion at LN VHFTX = 15 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C VLN = 1.4 V (RMS) 33.5 - - - - 34.7 0.25 0.25 - 95 -77.5 35.9 - - 2 - - dB dB dB % mV dBmp maximum input voltage at HFTX Iline = 70 mA; THD = 2% (RMS value) noise output voltage at pin LN; pin HFTX shorted to GND through 200 in series with 10 F gain reduction if not activated psophometrically weighted - (p53 curve) Gv(mute) RX amplifiers see Table 2 60 80 - dB RX AMPLIFIERS USING IR (PINS IR AND RECO) Gv(IR-RECO) Gv(f) Gv(T) VIR(rms)(max) voltage gain from pin IR (referenced to LN) to RECO gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C maximum input voltage on IR (referenced to LN) (RMS value) VIR = 8 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C Iline = 70 mA; THD = 2% THD = 2% 28.7 - - - 0.75 29.7 0.25 0.3 50 0.9 -88 30.7 - - - - - dB dB dB mV V dBVp VRECO(rms)(max) maximum output voltage on RECO (RMS value) Vno(RECO)(rms) noise output voltage at pin RECO; pin IR is an open-circuit (RMS value) gain reduction if not activated psophometrically weighted - (p53 curve) see Table 2 60 -3 sine wave drive; RL = 150 ; THD < 2% 0.75 Gv(mute) Gv(RECO-QR) VQR(rms)(max) Vno(QR)(rms) 80 - 0.9 -88 - +15 - - dB RX EARPIECE AMPLIFIER (PINS GARX AND QR) gain voltage range between pins RECO and QR maximum output voltage on QR (RMS value) noise output voltage at pin QR; pin IR is an open-circuit (RMS value) dB V dBVp Gv(QR) = 0 dB; - psophometrically weighted (p53 curve) 2001 Aug 24 23 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 SYMBOL Gv(trx) PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Automatic Gain Control (pin AGC) gain control range for transmit and receive amplifiers affected by the AGC; with respect to Iline = 15 mA highest line current for maximum gain lowest line current for maximum gain Iline = 70 mA; Gv(MIC-LN); Gv(IR-RECO) 5.45 6.45 6.8 23 57 7.45 7.8 - - dB dB mA mA Iline = 70 mA for Gv(HFTX-LN) 5.8 - - Istart Istop Logic inputs (pins HFC and MUTE) VIL VIH Ii LOW-level input voltage HIGH-level input voltage input current for pin HFC for pin MUTE Handsfree mode (HFC = HIGH) HF MICROPHONE AMPLIFIER (PINS TXIN, TXOUT AND GATX) Gv(TXIN-TXOUT) Gv Gv(f) Gv(T) Vno(TXOUT)(rms) voltage gain from pin TXIN to TXOUT voltage gain adjustment with RGATX gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C noise output voltage at pin TXOUT; pin TXIN is shorted through 200 in series with 10 F to GNDTX (RMS value) gain reduction if not activated f = 300 to 3400 Hz Tamb = -25 to +75 C VTXIN = 3 mV (RMS); RGATX = 30.1 k 12.7 -15 - - 15.2 - 0.1 0.15 -101 17.7 +16 - - - dB dB dB dB dBmp VBB = 3.0 V - - 3 -3 6 -12 A A -0.4 1.8 - - +0.3 V VBB + 0.4 V psophometrically weighted - (p53 curve) Gv(mute) Gv(HFRX-LSAO) see Table 2 60 80 - 30.5 dB HF LOUDSPEAKER AMPLIFIER (PINS HFRX, LSAO, GALS AND VOL) voltage gain from pin HFRX to LSAO voltage gain adjustment with RGALS gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C voltage gain variation related to RVOL = 1.9 kW f = 300 to 3400 Hz Tamb = -25 to +75 C total attenuation does not exceed switching range VHFRX = 30 mV (RMS); RGALS = 255 k; Iline = 70 mA 25.5 28 dB Gv Gv(f) Gv(T) Gv(vol) -28 - - - - 0.3 0.3 -3 +7 - - - dB dB dB dB 2001 Aug 24 24 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 SYMBOL PARAMETER CONDITIONS Iline = 70 mA; RGALS = 33 k; for THD = 2% in the input stage MIN. - TYP. 580 - MAX. UNIT mV VHFRX(rms)(max) maximum input voltage at pin HFRX (RMS value) Vno(LSAO)(rms) noise output voltage at pin LSAO; pin HFRX is open-circuit (RMS value) gain reduction if not activated output voltage (RMS value) psophometrically weighted - (p53 curve) see Table 2 IBB = 0 mA; IDD = 1 mA Iline = 18 mA Iline = 30 mA Iline > 50 mA - - - 150 60 -79 - dBVp Gv(mute) VLSAO(rms) 80 0.9 1.3 1.6 300 - - - - - dB V V V mA ILSAO(max) maximum output current at pin LSAO (peak value) DYNAMIC LIMITER (PINS LSAO AND DLC) tatt attack time VHFRX jumps from 20 mV to 20 mV + 10 dB VBB jumps below VBB(th) trel THD VBB(th) VDLC(th) release time total harmonic distortion VBB limiter threshold threshold voltage required on pin DLC to obtain mute receive condition threshold current sourced by pin DLC in mute receive condition voltage gain reduction in mute receive condition VDLC = 0.2 V VHFRX jumps from 20 mV + 10 dB to 20 mV VHFRX = 20 mV + 10 dB; t > tatt - - - - - -0.4 - 1 100 1 2.7 - 5 - - 2 - +0.2 ms ms ms % V MUTE RECEIVE (PIN DLC) V IDLC(th) - 100 - A Gvrx(mute) VDLC = 0.2 V 60 80 - dB TX AND RX ENVELOPE AND NOISE DETECTORS (PINS TSEN, TENV, TNOI, RSEN, RENV AND RNOI) Preamplifiers Gv(TSEN) Gv(RSEN) voltage gain from pin TXIN to TSEN voltage gain from pin HFRX to RSEN ITSEN = 0.8 to 160 A - - 40 0 - - dB dB Logarithmic compressor and sensitivity adjustment Vdet(TSEN) sensitivity detection on pin TSEN; voltage change on pin TENV when doubling the current from TSEN - 18 - mV 2001 Aug 24 25 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 SYMBOL Vdet(RSEN) PARAMETER sensitivity detection on pin RSEN; voltage change on pin RENV when doubling the current from RSEN CONDITIONS IRSEN = 0.8 to 160 A MIN. - 18 TYP. - MAX. UNIT mV Signal envelope detectors Isource(ENV) Isink(ENV) VENV maximum current sourced from pin TENV or RENV maximum current sunk by pin TENV or RENV voltage difference between pins RENV and TENV - 120 - -0.75 - A A mV -1.25 -1 10 A is sourced from both - RSEN and TSEN; signal detectors tracking; note 1 3 Noise envelope detectors Isource(NOI) Isink(NOI) VNOI maximum current sourced from pin TNOI or RNOI maximum current sunk by pin TNOI or RNOI voltage difference between pins RNOI and TNOI 5 A is sourced from both RSEN and TSEN; noise detectors tracking; note 1 0.75 - - 1 -120 3 1.25 - - A A mV DIAL TONE DETECTOR VHFRX(th)(rms) threshold level at pin HFRX (RMS value) RRSEN = 10 k - 25 - mV TX LEVEL LIMITER VTXIN(th)(rms) threshold level at pin TXIN (RMS value) RTSEN = 10 k - 0.75 - mV DECISION LOGIC (PINS IDT AND SWT) Signal recognition VSrx(th) threshold voltage between pins RENV and RNOI to switch-over from receive to Idle mode threshold voltage between pins TENV and TNOI to switch-over from transmit to Idle mode VHFRX < VHFRX(th); note 2 - 13 - mV VStx(th) VTXIN < VTXIN(th); note 2 - 13 - mV Switch-over Isource(SWT) Isink(SWT) Iidle(SWT) current sourced from pin SWT when switching to receive mode current sunk by pin SWT when switching to transmit mode current sourced from pin SWT in Idle mode 7.5 10 12.5 -7.5 - A A A -12.5 -10 - 0 2001 Aug 24 26 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 SYMBOL PARAMETER CONDITIONS MIN. - TYP. - MAX. UNIT VOICE SWITCH (PINS STAB AND SWR) SWRA SWRA Gv switching range switching range adjustment voltage gain variation from transmit or receive mode to Idle mode gain tracking (Gvtx + Gvrx) during switching, referenced to Idle mode RSWR = 365 k 40 - 20 dB dB dB -40 - +12 - Gtr - 0.5 - dB Notes 1. Corresponds to 1 dB tracking. 2. Corresponds to 4.3 dB noise/speech recognition level. 2001 Aug 24 27 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... andbook, full pagewidth 2001 Aug 24 Zexch 600 i = 15 mA J_line Dz Vd = 10 V Cexch Cemc 10 nF Cimp CIR 100 nF CMICS 4.7 F MICS MIC+ RMIC 200 MIC- 23 34 IR Zimp 620 VIR RSLPE 20 CREG 4.7 F SLPE 17 100 F 100 F 20 REG 19 21 VMIC 33 CHFTX 100 nF TXOUT RGATX 30.1 k GATX CTXIN VHFTX 100 nF CDTMF VTXIN 100 nF DTMF 30 HFTX 39 TEST AND APPLICATION INFORMATION Philips Semiconductors Speech and handsfree IC CVBB 470 F AGC 18 LN VBB 13 22 CVDD 47 F VDD 1 40 2 PD HFC MUTE 36 QR CGAR 100 pF Re2 100 k RQR 37 GARX Re1 100 k 150 CQR 4.7 F CGARS 1 nF Crxe TEA1098TV 29 38 RECO 100 nF CHFRX VHFRX 28 VDTMF 5 HFRX 100 nF TXIN 14 31 GALS RGALS 255 k CGALS 150 pF 35 15 10 LSAO RSEN RENV RNOI IDT RIDT 2.2 M CRNOI 4.7 F RRSEN 10 k CRENV 470 nF CLSAO 220 F RLSAO 50 TSEN TENV 8 11 7 9 28 16 32 24 25 26 12 27 TNOI RTSEN 10 k CTSEN 100 nF CTENV 470 nF 6 GND CTNOI 4.7 F GNDTX STAB RSTAB 3.65 k SWR RSWR 365 k VOL RVOL 0 to 22 k DLC CDLC 470 nF SWT CSWT 220 nF Product specification CRSEN 100 nF TEA1098 MGL440 Fig.16 Test configuration. This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 2001 Aug 24 Rbal2 820 Zimp 620 Cimp 22 F Rbal1 130 Rast2 3.92 k Cbal 220 nF RSLPE 20 Rast3 392 CIR 100 nF IR SLPE 17 20 19 Philips Semiconductors handbook, full pagewidth Speech and handsfree IC CREG 4.7 F D2 D3 Dz Vd = 10 V Cemc 10 nF CVBB 470 F AGC 21 CVDD 47 F VDD 22 1 40 2 REG LN 18 VBB 13 PD HFC MUTE QR CGAR 100 pF Re1 100 k RECO Crxe 100 nF CHFRX 100 nF from microcontroller CQR 10 F Re2 100 k CGARS 1 nF Rast1 130 k MICS RMICP 1 k Ctx2 handset micro CMICH 33 nF 22 nF Ctx1 Rtx2 15 k Rtx1 MICS CMICS 10 F MIC+ Rtx3 8.2 k 23 36 34 37 GARX A MIC- 33 B 22 nF RMICM 1 k from MICS RBMICS 2 k handsfree micro 15 k CHFTX 100 nF RGATX 30.1 k HFTX TXOUT 39 38 29 D1 D4 TEA1098TV 29 5 HFRX GALS GATX TXIN CTXIN CDTMF 100 nF 30 31 14 CMICB 100 nF 22 nF DTMF 15 35 10 RGALS 255 k LSAO RSEN RENV RNOI IDT RIDT 2.2 M CGALS 150 pF CLSAO 220 F TSEN TENV TNOI RTSEN 10 k CTSEN 100 nF CTENV 470 nF 8 7 6 16 32 24 25 26 12 27 11 9 28 GND CTNOI 4.7 F GNDTX STAB RSTAB 3.65 k SWR RSWR 365 k VOL RVOL 0 to 22 k DLC CDLC 470 nF SWT CSWT 220 nF RRSEN 10 k CRNOI 4.7 F CRENV 470 nF CRSEN 100 nF Product specification TEA1098 MGL316 Fig.17 Basic application diagram. Philips Semiconductors Product specification Speech and handsfree IC BONDING PAD LOCATIONS FOR TEA1098UH COORDINATES(1) SYMBOL HFRX TNOI TENV TSEN RNOI RSEN RENV DLC VBB GALS LSAO n.c. GND SLPE SLPE LN REG IR AGC VDD MICS STAB SWR VOL PAD x 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 137.5 137.5 137.5 137.5 137.5 137.5 137.5 137.5 137.5 137.5 185.2 401.2 861.5 1125.0 1348.2 1537.5 1704.8 1888.8 2084.0 2251.0 2508.8 2703.8 2897.0 2944.8 y 3139.2 2944.0 2605.8 2375.5 2164.5 1945.2 1721.8 1494.5 1050.2 616.8 128.0 128.0 128.0 128.0 128.0 128.0 128.0 128.0 128.0 128.2 127.0 128.5 128.0 343.0 SWT IDT TXOUT GATX TXIN GNDTX GNDTX MIC- MIC+ DTMF QR GARX RECO HFTX HFC PD MUTE n.c. n.c. n.c. Note 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 SYMBOL PAD x 2944.8 2945.0 2945.0 2945.0 2945.0 2945.0 2945.0 2945.0 2945.0 2945.0 2940.0 2651.0 2451.0 2170.8 1934.2 1678.8 1425.0 1177.0 942.2 738.5 TEA1098 COORDINATES(1) y 570.0 784.0 973.8 1182.0 1390.0 1581.0 1747.8 1917.2 2129.0 2931.0 3136.8 3171.2 3171.2 3171.2 3171.2 3171.2 3171.2 3171.2 3171.2 3171.2 1. All x/y coordinates (in m) represent the position of the centre of the pad with respect to the origin (x/y = 0/0) of the die (see Fig.18). 2001 Aug 24 30 Philips Semiconductors Product specification Speech and handsfree IC TEA1098 44 1 2 3 4 5 6 7 8 R9571R 43 42 41 40 39 38 37 36 35 34 die identifier 33 32 31 30 29 28 TEA1098UH/C2 9 27 26 10 25 24 23 0 x y 0 11 12 13 14 15 16 17 18 19 20 21 22 FCA200 Pad size: 80 m2. Fig.18 TEA1098UH bonding pad locations. 2001 Aug 24 31 Philips Semiconductors Product specification Speech and handsfree IC PACKAGE OUTLINE VSO40: plastic very small outline package; 40 leads TEA1098 SOT158-1 D E A X c y HE vMA Z 40 21 Q A2 A1 pin 1 index Lp L 1 e bp 20 wM detail X (A 3) A 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT158-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A max. 2.70 0.11 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 bp 0.42 0.30 c 0.22 0.14 D (1) 15.6 15.2 E (2) 7.6 7.5 0.30 0.29 e 0.762 0.03 HE 12.3 11.8 0.48 0.46 L 2.25 Lp 1.7 1.5 Q 1.15 1.05 v 0.2 w 0.1 y 0.1 Z (1) 0.6 0.3 0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60 0.067 0.089 0.059 0.045 0.024 0.008 0.004 0.004 0.041 0.012 7 0o o ISSUE DATE 92-11-17 95-01-24 2001 Aug 24 32 Philips Semiconductors Product specification Speech and handsfree IC SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: TEA1098 * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 2001 Aug 24 33 Philips Semiconductors Product specification Speech and handsfree IC Suitability of surface mount IC packages for wave and reflow soldering methods TEA1098 SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable Preliminary data Qualification Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 2001 Aug 24 34 Philips Semiconductors Product specification Speech and handsfree IC DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. TEA1098 Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. BARE DIE DISCLAIMER All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. 2001 Aug 24 35 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2001 SCA73 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 403502/06/pp36 Date of release: 2001 Aug 24 Document order number: 9397 750 08576 |
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