 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| (R) Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cmC 0.01 W/cmC leadframe die attach copper epoxy glue ( silver glue ) epoxy resin 0.25 mm 10-40 m molding compound 3 mm 0.0063W/cmC Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data DIP 20 Rth(j-a) (C/W) 120 copper frame thickness = 0.25 mm die pad = 125 x 160 sq.mils die size = 10.000 sq.mils 1) 100 floating in air 80 mounted on board 60 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 dissipated power ( Watt ) 1.8 2 2.2 2.4 Transient Thermal Resistance (C/W) 100 copper frame thickness = 0.25 mm die pad = 110 x 120 sq.mils 50 30 20 2) 10 on die dissipating area = 2000 sq.mils mounted on board pd = 2 Watt 5 3 2 1 0.001 0.01 0.1 1 Time or pulse width ( s ) 10 100 1,000 2/2 |
Price & Availability of DIP20
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |