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BSI
FEATURES
Very Low Power/Voltage CMOS SRAM 256K X 8 bit
DESCRIPTION
BS62LV2000
* Wide Vcc operation voltage : 2.7V ~ 5.5V * Very low power consumption : Vcc = 3.0V C-grade : 20mA (Max.) operating current I- grade : 25mA (Max.) operating current 0.15uA (Typ.) CMOS standby current Vcc = 5.0V C-grade : 40mA (Max.) operating current I- grade : 45mA (Max.) operating current 3uA (Typ.) CMOS standby current * High speed access time : -70 70ns(Max.) at Vcc = 3.0V -10 100ns(Max.) at Vcc = 3.0V * Automatic power down when chip is deselected * Three state outputs and TTL compatible * Fully static operation * Data retention supply voltage as low as 1.5V * Easy expansion with CE2, CE1, and OE options * All I/O pins are 3V/5V tolerant
The BS62LV2000 is a high performance , very low power CMOS Static Random Access Memory organized as 262,144 words by 8 bits and operates from a wide range of 2.7V to 5.5V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with a typical CMOS standby current of 0.15uA and maximum access time of 70ns in 3V operation. Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2), and active LOW output enable (OE) and three-state output drivers. The BS62LV2000 has an automatic power down feature , reducing the power consumption significantly when chip is deselected. The BS62LV2000 is available in the JEDEC standard 32 pin 450mil Plastic SOP, 8mmx13.4mm STSOP and 8mmx20mm TSOP.
PRODUCT FAMILY
PRODUCT FAMILY BS62LV2000TC BS62LV2000STC BS62LV2000SC BS62LV2000TI BS62LV2000STI BS62LV2000SI -40 C to +85OC
O O O +0 C to +70 C
OPERATING TEMPERATURE
Vcc RANGE
SPEED (ns) Vcc=3V
POWER DISSIPATION STANDBY Operating
(ICCSB1 , Max) (ICC , Max)
PKG TYPE
Vcc=5V 10uA
Vcc=3V Vcc=5V Vcc=3V TSOP - 32 3uA 40mA 20mA STSOP - 32 SOP - 32 TSOP - 32
2.7V ~ 5.5V
70 / 100
2.7V ~ 5.5V
70 / 100
20uA
5uA
45mA
25mA
STSOP - 32 SOP - 32
PIN CONFIGURATIONS
BLOCK DIAGRAM
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE1 DQ7 DQ6 DQ5 DQ4 DQ3 GND DQ2 DQ1 DQ0 A0 A1 A2 A3 A13 A17 A15 A16 A14 A12 A7 A6 A5 A4
*
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 BS62LV2000TC BS62LV2000STC BS62LV2000TI BS62LV2000STI A17 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 GND 1 2 3 4 5 6 7 BS62LV2001SC 8 BS62LV2001SI 9 10 11 12 13 14 15 16
A11 A9 A8 A13 WE CE2 A15 VCC A17 A16 A14 A12 A7 A6 A5 A4
Address Input Buffer
20
Row Decoder
1024
Memory Array 1024 x 2048
2048 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 8 Data Input Buffer 8 Column I/O Write Driver Sense Amp 256 Column Decoder 16 Control Address Input Buffer
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
VCC A15 CE2 WE A13 A8 A9 A11 OE A10 CE1 DQ7 DQ6 DQ5 DQ4 DQ3
Brilliance Semiconductor, Inc. reserves the right to modify document contents without notice.
R0201-BS62LV2000
*
8
Data Output Buffer
8
CE1 CE2 WE OE Vdd Gnd
A11 A9 A8 A3 A2 A1 A0 A10
1
Revision 2.4 Jan. 2004
BSI
PIN DESCRIPTIONS
BS62LV2000
Function
These 18 address inputs select one of the 262,144 x 8-bit words in the RAM CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when data read from or write to the device. If either chip enable is not active, the device is deselected and is in a standby power mode. The DQ pins will be in the high impedance state when the device is deselected.
Name
A0-A17 Address Input CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input
WE Write Enable Input
The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location.
OE Output Enable Input
The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impedance state when OE is inactive.
DQ0-DQ7 Data Input/Output Ports Vcc Gnd
These 8 bi-directional ports are used to read data from or write data into the RAM. Power Supply Ground
TRUTH TABLE
MODE WE CE1 CE2 OE I/O OPERATION Vcc CURRENT
Not selected (Power Down) Output Disabled Read Write
X X H H L
H X L L L
X L H H H
X X H L X
High Z High Z DOUT DIN
I CCSB, I CCSB1 I CC I CC I CC
ABSOLUTE MAXIMUM RATINGS(1)
SYMBOL V TERM T BIAS T STG PT I OUT PARAMETER
Terminal Voltage with Respect to GND Temperature Under Bias Storage Temperature Power Dissipation DC Output Current
OPERATING RANGE
UNITS
V
O
RATING
-0.5 to Vcc+0.5 -40 to +125 -60 to +150 1.0 20
RANGE
Commercial Industrial
AMBIENT TEMPERATURE
0 O C to +70 O C -40 C to +85 C
O O
Vcc
2.7V ~ 5.5V 2.7V ~ 5.5V
C C
O
W mA
CAPACITANCE (1) (TA = 25oC, f = 1.0 MHz)
SYMBOL
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
CIN CDQ
PARAMETER Input Capacitance Input/Output Capacitance
CONDITIONS
MAX.
UNIT
VIN=0V VI/O=0V
6 8
pF pF
1. This parameter is guaranteed and not 100% tested.
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BSI
DC ELECTRICAL CHARACTERISTICS ( TA = 0oC to + 70oC )
PARAMETER NAME
VIL VIH IIL ILO VOL VOH ICC ICCSB
BS62LV2000
TEST CONDITIONS
Vcc=3.0V Vcc=5.0V Vcc=3.0V Vcc=5.0V
PARAMETER
Guaranteed Input Low (2) Voltage Guaranteed Input High (2) Voltage Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current Standby Current-TTL
MIN.
-0.5 2.0 2.2 --Vcc=3.0V Vcc=5.0V Vcc=3.0V Vcc=5.0V Vcc=3.0V Vcc=5.0V Vcc=3.0V Vcc=5.0V Vcc=3.0V
TYP. (1)
----------0.15 3
MAX.
0.8 Vcc+0.2 1 1 0.4 -20 40 1 2 3 10
UNITS V V uA uA V V mA mA
Vcc = Max, VIN = 0V to Vcc Vcc = Max, CE1 = VIH or CE2=VIL or OE = VIH, VI/O = 0V to Vcc Vcc = Max, IOL = 2mA Vcc = Min, IOH = -1mA Vcc = Max, CE1= VIL, CE2=VIH IDQ = 0mA, F = Fmax(3) Vcc = Max, CE1 = VIH or CE2=VIL IDQ = 0mA Vcc = Max, CE1Vcc-0.2V or CE20.2V ;VIN Vcc - 0.2V or VIN0.2V
-2.4 -------
ICCSB1
Standby Current-CMOS
Vcc=5.0V
uA
1. Typical characteristics are at TA = 25oC. 2. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included. 3. Fmax = 1/tRC .
DATA RETENTION CHARACTERISTICS ( TA = 0oC to + 70oC )
SYMBOL
VDR ICCDR tCDR tR
PARAMETER
Vcc for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time
TEST CONDITIONS
CE1 Vcc - 0.2V or CE2 0.2V, VIN Vcc - 0.2V or VIN 0.2V CE1 Vcc - 0.2V or CE2 0.2V, VIN Vcc - 0.2V or VIN 0.2V See Retention Waveform
MIN.
1.5 -0 TRC
(2)
TYP. (1)
-0.01 ---
MAX.
-1 ---
UNITS
V uA ns ns
1. Vcc = 1.5V, TA = + 25OC 2. tRC = Read Cycle Time
LOW VCC DATA RETENTION WAVEFORM (1) ( CE1 Controlled )
Data Retention Mode VDR 1.5V
Vcc
VIH
Vcc
Vcc
t CDR
CE1 Vcc - 0.2V
tR
VIH
CE1
LOW VCC DATA RETENTION WAVEFORM (2) ( CE2 Controlled )
Data Retention Mode
Vcc
Vcc
VDR 1.5V
Vcc
t CDR
tR
CE2 0.2V
CE2
R0201-BS62LV2000
VIL
VIL
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Revision 2.4 Jan. 2004
BSI
AC TEST CONDITIONS
Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Vcc/0V 1V/ns 0.5Vcc
WAVEFORM INPUTS
BS62LV2000
KEY TO SWITCHING WAVEFORMS
OUTPUTS MUST BE STEADY WILL BE CHANGE FROM H TO L WILL BE CHANGE FROM L TO H CHANGE : STATE UNKNOWN CENTER LINE IS HIGH IMPEDANCE "OFF "STATE
MUST BE STEADY MAY CHANGE FROM H TO L MAY CHANGE FROM L TO H DON T CARE: ANY CHANGE PERMITTED DOES NOT APPLY
AC TEST LOADS AND WAVEFORMS
3.3V OUTPUT
100PF
INCLUDING JIG AND SCOPE
1269
3.3V OUTPUT
1269
,
5PF 1404
INCLUDING JIG AND SCOPE
1404
FIGURE 1A
THEVENIN EQUIVALENT 667
FIGURE 1B
OUTPUT
1.73V
ALL INPUT PULSES
Vcc GND
10%
90% 90%
10%
5ns
FIGURE 2
AC ELECTRICAL CHARACTERISTICS ( TA = 0oC to + 70oC, Vcc = 3.0V )
READ CYCLE
JEDEC PARAMETER NAME PARAMETER NAME DESCRIPTION
Read Cycle Time Address Access Time Chip Select Access Time Chip Select Access Time Output Enable to Output Valid Chip Select to Output Low Z Chip Select to Output Low Z Output Enable to Output in Low Z Chip Deselect to Output in High Z Chip Deselect to Output in High Z Output Disable to Output in High Z Data Hold from Address Change (CE1) (CE2) (CE1) (CE2) (CE1) (CE2) CYCLE TIME : 70ns MIN. TYP. MAX. CYCLE TIME : 100ns MIN. TYP. MAX.
UNIT
tAVAX tAVQV tE1LQV tE2HOV tGLQV tE1LQX tE2HOX tGLQX tE1HQZ tE2HQZ tGHQZ tAXOX
tRC tAA t ACS1 t ACS2 tOE t CLZ1 t CLZ2 tOLZ t CHZ1 t CHZ2 tOHZ tOH
70 ----10 10 10 ---10
-------------
-70 70 70 35 ---35 35 30 --
100 ----15 15 15 ---15
-------------
-100 100 100 50 ---40 40 35 --
ns ns ns ns ns ns ns ns ns ns ns ns
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Revision 2.4 Jan. 2004
BSI
SWITCHING WAVEFORMS (READ CYCLE)
READ CYCLE1
(1,2,4)
BS62LV2000
t RC
ADDRESS
t
D OUT
t
OH
AA
t OH
READ CYCLE2
CE1
(1,3,4)
t
CE2
(5) CLZ
ACS1
t t
ACS2
t
CHZ1,
t
(5)
CHZ2
D OUT
(1,4)
READ CYCLE3
t RC
ADDRESS
t
OE
AA
t
CE1
OE
t
OH
t t
(5) CLZ1
OLZ
t ACS1
t OHZ (5) (1,5) t CHZ1
CE2
t t
(5) CLZ2
ACS2
t
(2,5)
CHZ2
D OUT
NOTES: 1. WE is high in read Cycle. 2. Device is continuously selected when CE1 = VIL and CE2= VIH. 3. Address valid prior to or coincident with CE1 transition low and/or CE2 transition high. 4. OE = VIL . 5. Transition is measured 500mV from steady state with CL = 5pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested.
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Revision 2.4 Jan. 2004
BSI
AC ELECTRICAL CHARACTERISTICS ( TA = 0oC to + 70oC, Vcc = 3.0V )
WRITE CYCLE
JEDEC PARAMETER NAME PARAMETER NAME DESCRIPTION
Write Cycle Time Chip Select to End of Write Address Set up Time Address Valid to End of Write Write Pulse Width Write Recovery Time Write Recovery Time Write to Output in High Z Data to Write Time Overlap Data Hold from Write Time Output Disable to Output in High Z End of Write to Output Active (CE1 , WE) (CE2) CYCLE TIME : 70ns MIN. TYP. MAX.
BS62LV2000
CYCLE TIME : 100ns MIN. TYP. MAX.
UNIT
tAVAX t E1LWH tAVWL tAVWH tWLWH tWHAX t E2LAX tWLOZ tDVWH tWHDX tGHOZ tWHQX
tWC tCW tAS tAW tWP t WR1 t WR2 tWHZ tDW tDH tOHZ tOW
70 70 0 70 35 0 0 -30 0 -5
-------------
-------30 --30 --
100 100 0 100 50 0 0 -40 0 -10
-------------
-------40 --40 --
ns ns ns ns ns ns ns ns ns ns ns ns
SWITCHING WAVEFORMS (WRITE CYCLE)
WRITE CYCLE1 (1)
ADDRESS
t WC
t
OE
(3)
WR1
t CW
CE1
(5)
(11)
CE2
(5)
t CW t
AW
(11)
t WR2
(2)
(3)
WE
t AS
(4,10)
t
WP
t OHZ
D OUT
t DH t DW
D IN Revision 2.4 Jan. 2004
R0201-BS62LV2000
6
BSI
WRITE CYCLE2 (1,6)
BS62LV2000
t WC
ADDRESS
(11) (5)
t
CW
CE1
CE2
(5)
t
WE
t CW
AW
(11)
t WR2
(2)
t WP
(3)
t AS
(4,10)
t WHZ
D OUT
t t DW t
OW
(7)
(8)
DH
(8,9)
D IN
NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE1 and CE2 active and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. TWR is measured from the earlier of CE1 or WE going high or CE2 going low at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL ). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE1 is low and CE2 is high during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured 500mV from steady state with CL = 5pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested. 11. TCW is measured from the later of CE1 going low or CE2 going high to the end of write.
R0201-BS62LV2000
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Revision 2.4 Jan. 2004
BSI
ORDERING INFORMATION
BS62LV2000
Z YY
SPEED 70: 70ns 10: 100ns PKG MATERIAL -: Normal G: Green P: Pb free GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC PACKAGE S: SOP T: TSOP (8mm x 20mm) ST: Small TSOP (8mm x 13.4mm)
BS62LV2000 X X
Note: BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments.
PACKAGE DIMENSIONS
STSOP - 32
R0201-BS62LV2000
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Revision 2.4 Jan. 2004
BSI
PACKAGE DIMENSIONS (continued)
BS62LV2000
TSOP - 32
WITH PLATING
b
c c1
BASE METAL
b1
SECTION A-A
SOP -32
R0201-BS62LV2000
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Revision 2.4 Jan. 2004

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