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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1.1GHz Prescaler
MC12074
The MC12074 is a divide by 256 prescaler. Typical frequency synthesis applications include elctronically tuned TV/CATV and communication systems as well as instrumentation. An internal preamplifier is included which isolates the differential inputs and provides gain for the input signal. Differential PECL outputs are provided.
MECL PLL COMPONENTS /256 PRESCALER
* * * * * *
1.1GHz Toggle Frequency Operating Supply Voltage of 4.5 to 5.5V Low-Power 23mA Typical at VCC = 5.0V High Input Sensitivity, 20mVrms at VCC = 5.0 10%, TA = 0C to +70C 800mV Minimum Peak-to-Peak Output Swing Differential PECL Outputs
MAXIMUM RATINGS
Symbol VCC TA Tstg Characteristic Power Supply Voltage Operating Temperature Range Storage Temperature Range Range 7.0 0 to +70 -65 to +175 Unit Vdc C C
P SUFFIX 8-LEAD PLASTIC PACKAGE CASE 626-05
ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5V; TA = 0 to +70C)
Symbol fmax1 fmin ICC Vout Vin min Characteristic Toggle Frequency (Sine Wave Input) Supply Current at 5.5V Output Voltage (Load =10pF) Input Voltage Sensitivity 150-1100MHz 90MHz 200 0.8 Min 1.1 Typ* 1.3 90 23 1.2 30 Max Unit GHz MHz mA VPP mVrms 10 400 20 30 mVrms
D SUFFIX 8-LEAD PLASTIC SOIC PACKAGE CASE 751-05
Pinout: 8-Lead Plastic (Top View)
VCC 8 7 Output 6 NC 5
Vin max Input Overload * Typical measured at +25C, 5.0V 1. See Figure 1
1 NC
2 Input
3
4 GND
7/93
(c) Motorola, Inc. 1996
1
REV 1
MC12074
PRESCALER BLOCK DIAGRAM
VCC
8
550
550
Output 7 6
/256
2 0.001F
3 0.001F 4 GND
Signal Input
15 10 5 0 -5 -10 INPUT -15 - 20 - 25 - 30 - 35 - 40 - 45 - 50
1250 710 400 225 200 125 71 40 30 22.5 20 12.8 7.1 4 2.25 1.25 0.71 2400 2000 1600 1200 800 400 0 1000 1100 1200 1300 1400 1500 RMS PP HIPERCOMM BR1334 -- Rev 4 MILLIVOLTS
AMPLITUDE (dBm) OUTPUT
0 90 100 150 200
300
400
500
600
700
800
900
FREQUENCY (MHz)
Figure 1. Divide Ratio = 256 (Maximum Toggle Frequency: Min = 1357, Mean = 1357, Max = 1357 Temp = 25C, VCC = 5.0V, Number of Devices = 1)
MOTOROLA
2
MC12074
OUTLINE DIMENSIONS
P SUFFIX PLASTIC PACKAGE CASE 626-05 ISSUE K
NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
8
5
-B-
1 4
F
NOTE 2
-A- L
DIM A B C D F G H J K L M N
C -T-
SEATING PLANE
J N D K
M
M
H
G 0.13 (0.005) TA
M
MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC --- 10_ 0.76 1.01
INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC --- 10_ 0.030 0.040
B
M
A
8
D
5
D SUFFIX PLASTIC SOIC PACKAGE CASE 751-05 ISSUE R
C H 0.25
M
E
1 4
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.18 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_
B C
e h A
SEATING PLANE X 45 _
q
0.10 A1 0.25 B
M
L CB
S
A
S
q
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JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 81-3-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
HIPERCOMM BR1334 -- Rev 4 3
MC12074/D MOTOROLA

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