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DS32KHZ 32.768 KHz TCXO
www.dalsemi.com
FEATURES
Accurate to 4 Min/Yr. (-40C to +85C) Accurate to 1 Min/Yr. (0C to 40C) Battery back up for continuous time keeping VBAT operating voltage 2.7 to 5.5 volts with VCC grounded VCC operating voltage 4.5 to 5.5 volts Operating temperature range: COM: 0C to 70C IND: -40C to +85C No calibration required Low power consumption Surface mountable using BGA package VCC : VBAT : 32KHz: GND: C2, C3, D2, D3 A4, A5, B4, B5 C4, C5, D4, D5 All Remaining Balls
PIN ASSIGNMENT
A 1 2 3 4 5 6 7 8 9 B C D

DS32KHZ 36-Pin SMD (TOP VIEW)
NC 1 2 3 GND VBAT NC NC 4 5 6 7 14 13 12 11 10 9 8 NC VCC 32 KHz OUT GND GND NC NC
ORDERING INFORMATION
Part Number DS32KHZ/BGA DS32KHZN/BGA DS32KHZ/DIP DS32KHZN/DIP Package 36-pin BGA 36-pin BGA 14-pin DIP 14-pin DIP Temp. Range Commercial Industrial Commercial Industrial
DS32KHZ 14-PIN DIP MODULE (300 MIL)
DESCRIPTION
The DS32KHZ is a temperature compensated crystal oscillator (TCXO) with an output frequency of 32.768 kHz. This device addresses applications requiring better timekeeping accuracy and may be used to drive the X1 input of most Dallas Semiconductor Real Time Clocks (RTC's), chipsets and other IC's containing RTC's. This device is available in commercial and industrial temperature versions, DS32KHZ and DS32KHZ-N respectively. The DS32KHZ requires four pins for operation: VCC, GND, VBAT and 32KHz OUT. See Figures 1, 2 and 3 for connection schemes. Power is applied via VCC and GND, while VBAT is used to maintain the 32KHz output in the absence of power. The output is accurate to 7.5 ppm (4 min/yr) from -40C to +85C and 2 ppm (1 min/yr) from 0C to 40C. 1 of 7 110399
DS32KHZ
The DS32KHZ is packaged in a small 36-pin SMD, utilizing Ball Grid Array (BGA) technology, with dimensions 0.400 inches wide, 0.450 inches long, and 0.180 inches high. Also availabe in a 14-pin DIP module. The additional board space required is negligible in most applications and therefore the recommended land pattern layout should be implemented on all new designs and future board revisions to satisfy applications requiring better timekeeping accuracy.
DELTA TIME vs TEMPERATURE
DELTA FREQUENCY vs TEMPERATURE
DELTA FREQUENCY (PPM)
DELTA TIME (MIN/YR)
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POWER SUPPLY CONNECTIONS
Figure 1.0
Figure 2.0
Figure 1.0 shows how the DS32KHZ should be connected when using two power supplies. VCC should be between 4.5 and 5.5 volts while V should be between 2.7 and 3.3 volts. Figure 2.0 shows how the BAT DS32KHZ can be used when only a single supply system is available. VCC should be grounded and VBAT should then be held between 2.7 and 5.5 volts. The V BAT pin should be connected directly to a battery using no external components.
DS32KHZ CONNECTIONS
Figure 3.0
Figure 4.0
Figure 3.0 illustrates how a standard 32.768 kHz crystal and the DS32KHZ should be connected to address the interchangeable option. Using this connection scheme and the recommended layout provides a solution which requires no hardware modifications. Only one device should be used at a time and both layouts should be located very close together if the recommended layout is not used. 3 of 7 110399
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Oscillators in general are designed using various topologies and most are intended to be used with either a quartz crystal or resonator. With this in mind, some oscillators may consume more power when driven by another oscillator instead of a quartz crystal or resonator. There are various circuits that can be used to reduce this increased power. Figure 4.0 shows one recommended circuit that can be used to reduce the total current consumption of a DS32KHZ and an RTC. The value of resistance, R, will vary depending on the RTC used. However, a value of 1.0 M is recommended as a starting point.
ABSOLUTE MAXIMUM RATINGS*
Voltage on Any Pin Relative to Ground Operating Temperature Storage Temperature Soldering Temperature -3.0V to +7.0V 0C to 70C - Commercial -40C to +85C - Industrial -40C to +85C +260C for 10 seconds (2 times max.)
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.
The Dallas Semiconductor DS32KHZ is built to the highest quality standards and manufactured for long term reliability. All Dallas Semiconductor devices are made using the same quality materials and manufacturing methods. However, the DS32KHZ is not exposed to environmental stresses, such as burnin, that some industrial applications require. For specific reliability information on this product, please contact the factory in Dallas at (972) 371-4448.
RECOMMENDED DC OPERATING CONDITIONS
PARAMETER Power Supply Voltage Battery Voltage SYMBOL VCC VBAT MIN 4.5 2.7 TYP 5.0 3.0 MAX 5.5 3.3, 5.5
(-40C to +85C)
UNITS V V NOTES 1 1, 7
DC ELECTRICAL CHARACTERISTICS
PARAMETER Active Supply Current Active Battery Current (VCC =0V, VBAT =3.3V) High Output Voltage IOH=-1.0 mA) Low Output Voltage (IOL =2.1 mA) Battery Switch Voltage SYMBOL ICC IBAT VOH VOL VSW MIN
(VCC =4.5V to 5.5V; -40C to +85C)
TYP 150 1 MAX 180 4 UNITS A A V 0.4 VBAT V V NOTES 2, 8 3, 8 6 6
2.4
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AC TIMING CHARACTERISTICS
PARAMETER Output Frequency Frequency Stability vs Temp (0C to 40C) (-40C to +85C) Duty Cycle Cycle Time High/Low Time Rise Time Fall Time Oscillator Start-Up Time Frequency Stability vs Operating Voltage SYMBOL fOUT f/fO TW /T tCYC tH/tL tR tF tOSC f/V 45 MIN
(VCC =4.5V to 5.5V; -40C to +85C)
TYP 32.768 2.0 7.5 50 30.518 15.06 200 60 150 1.0 MAX 7.5 55 UNITS kHz PPM % s s ns ns ms PPM/V NOTES
4 4 4 4 4
NOTES:
1. All voltages are referenced to ground. 2. Typical values are at +25C and nominal supplies. 3. This current is the active mode current sourced from the backup supply/battery. 4. These parameters are measured using a 15 pF load. 5. DS32KHZ-N is tested over the industrial temperature range to meet the specifications above. 6. These parameters are measured with VCC on under nominal operating conditions. 7. When VCC is grounded VBAT can operate from 2.7V to 5.5V. Freq. stability will be affected in this operation, typically 1PPM/Volt above or below 3.0V. 8. These parameters are measured under no load conditions. The difference between I CC and IBAT is due to power switching circuitry. 9. Typical crystal aging is 1 ppm/yr after reflow.
32KHz OUTPUT WAVEFORM
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MECHANICAL DIMENSIONS
RECOMMENDED LAND PATTERN LAYOUT (36-Pin BGA)
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14-PIN DIP MODULE
NOTE: PINS 2,3 ARE MISSING BY DESIGN.
PKG DIM A IN. B IN. C IN. D IN. E IN. F IN. G IN. H IN. J IN. K IN.
14-PIN DIP MIN MAX 0.825 0.840 0.420 0.440 0.235 0.260 0.100 0.130 0.015 0.030 0.110 0.140 0.090 0.110 0.290 0.330 0.008 0.012 0.015 0.021
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