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HT3670C Electronic Drum
Features
* * * * * * * * *
Operating voltage: 3.3V~5.2V System frequency: 3.58MHz RC type oscillator Low standby current Three 8-bit D/A audio outputs Embedded Holtek 8-bit microcontroller Four channel melody processing Two channel sound processing Eight level main volume control
* * * * * * *
Power on/off indication music 2 min. auto power off alert sound 36 rhythm/fill-in effects 13 percussion pads provided for selection of 18 effects Two 7-segment LED drive capability Adjustable tempo 40-pin DIP or die form package
General Description
The HT3670C is a CMOS VLSI designed specifically for Electronic Drum sound applications. With a comprehensive range of 18 instruments and 36 rhythm/fill-in effects, the device provides an exceptional amount of sound flexibility for a multitude of drum sound applications. Other important sound functions are provided in the way of adjustable tempo and volume keys in addition to replay and demo key functions. With the ability to control an external keypad and with full control over the internal sound processing circuits, Holteks embedded fully functional 8-bit microcontroller provides the programmable ability to create many varied and multi functional applications. Sound output is provided through a four-channel ETS (Electronic Tone Synthesizer) in addition to a two-channel sound processing circuit.
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HT3670C
Block Diagram
VDD C o n tro l R e g is te r D iv id e r C o n tro l & D a ta B U S VSS
LED1~LED2 C0~C5 LEDA~LEDG LEDD O T R0~R7 PD 0~PD 1 M ic r o C o n tr o lle r
T o n e ( s c a le ) G e n e ra to r
W ave P LA
E n v e lo p e G e n e ra to r 4
M u ltip lie r c h a n n e ls E T S
M u ltip le x e r
REST OSCI C o u n te r ROM DAC A u d io O /P
AUO1 AUO2 PVO
S a m p lin g R a te C o n tro l
D e -C o m p re s s
M u ltip le x e r
2 c h a n n e l s o u n d g e n e ra to r
Pin Assignment
LEDC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 LEDF LEDD LEDD O T LEDE LED1 LED2 C0 C1 C2 C3 C4 C5 REST R0 R1 R2 R3 R4 R5 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 LEDA LEDG LEDB AUO1 AUO2 PVO VDD NC NC NC NC NC NC PD1 PD0 NC OSCI VSS R7 R6
HT3670C 4 0 D IP
2 December 10, 1999
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HT3670C
Pad Assignment
LEDD O T AUO2 AUO1 LEDG LEDD LEDC LEDB LEDE LEDA LEDF
LED1 1 2 3 4 5 6 7 8 LED2 C0 C1 C2 C3 C4 C5
41
40
39
38
37
36
35
34
33
32 31 PVO
30 29 28 27 26 25 24 23 22
VDD NC NC NC NC NC NC PD1 PD0
(0 ,0 )
NC 9
REST
10
11 R0
12 R1
13 R2
14 R3
15 R4
16 R5
17 R6
18 R7
19 VSS
20 OSCI
21 NC
Chip size: 3770 3700 (mm)
2
* The IC substrate should be connected to VSS in the PCB layout artwork.
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December 10, 1999
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HT3670C
Pad Coordinates
Pad No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 X -1655.80 -1706.70 -1706.70 -1706.70 -1706.70 -1706.70 1706.70 1706.70 1676.90 1689.90 1336.10 1131.30 880.50 675.70 424.90 220.10 30.70 235.50 452.60 977.70 1699.40 Y 1623.00 1354.30 1083.50 818.90 548.10 283.50 12.70 251.90 1312.20 1604.00 1625.90 1625.90 1625.90 1625.90 1625.90 1625.90 1625.90 1625.90 1617.00 1620.60 1630.10 Pad No. 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 X 1704.80 1704.80 1704.80 1704.80 1704.80 1704.80 1704.80 1704.80 1701.30 1722.40 1535.90 676.10 405.80 151.20 109.60 364.20 625.00 879.60 140.40 1395.00 Unit: mm Y -1066.50 -841.70 -570.90 -346.10 -75.30 149.50 420.30 645.10 890.30 1455.40 1645.50 1645.50 1623.00 1623.00 1623.00 1623.00 1623.00 1623.00 1623.00 1623.00
Pad Description
Pad No. 1 2 34 35 36 37 38 39 40 41 3~6 7 8 9, 21 24~29 Pad Name LED1 LED2 LEDB LEDG LEDA LEDC LEDF LEDD LEDDOT LEDE C0~C3 C4 C5 NC I/O Internal Connection Description
O
CMOS
CMOS output for LED driving
O O O 3/4
CMOS CMOS CMOS 3/4
Keyboard scanning outputs 2 min. Auto power off control switch. Power on/off No connection
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HT3670C
Pad No. 10 11~18 19 20 22~23 30 31 Pad Name REST R0~R7 VSS OSCI PD0~PD1 VDD PVO I/O I I 3/4 O I 3/4 O Internal Connection CMOS CMOS Pull-high 3/4 3/4 Input without Pull-high 3/4 PMOS Description System reset input pad for the mC, active low Keyboard scanning inputs Power supply, ground OSCI connect to an RC network for an internal system clock. Bonding option for auto power off & auto bass chord Positive power supply Percussion signal output The output of PVO is of a current type D/A. Audio signal outputs The outputs of AUO1~AUO2 are of a current type D/A. The outputs of melody channels 0~1 are from AUO1 whereas the outputs of channels 2~3 from AUO2.
32 33
AUO2 AUO1
O
PMOS
Absolute Maximum Ratings
Supply Voltage .............................-0.3V to 5.5V Input Voltage ................. VSS-0.3V to VDD+0.3V Storage Temperature ................-50C to 125C Operating Temperature .................0C to 70C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
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HT3670C
Electrical Characteristics
Symbol VDD IDD ISTB IAUD IPVO IOL IOH IIL VIH VIL fOSC tWDTOSC tWDT1 tWDT2 tRES tINT Parameter Operating Voltage Operating Current Standby Current max. Output Current (for AUO1, AUO2) max. Output Current (for PVO) Sink Current (for Ports A, B) Source Current (for Ports A, B) Input Current (for Ports A, B, C, D with Pull-high Resistor) Input High Voltage for Input Port Input Low Voltage for Input Port System Frequency Watchdog Oscillator Watchdog Time-out Period (RC) Watchdog Time-out Period (system clock) External Reset Low Pulse Width Interrupt Pulse Width 4.5V 3/4 3/4 3/4 3/4 3/4 4.5V 4.5V Test Conditions VDD Conditions 3/4 No load fOSC=3.58MHz No load system halt Min. 3.3 3/4 3/4 -1.4 -1.4 5.4 -1.8 80 3/4 3/4 3.58MHz crystal or ROSC 3/4 Without WDT prescaler Without WDT prescaler 3/4 3/4 0.8VDD VSS 3/4 31 8 3/4 1 1 Typ. 4.5 3.5 2 -2.2 -2.2 9 -3 130 3/4 3/4 3.58 78 20 1024 3/4 3/4 Ta=25C Max. 5.2 7.0 10 -3.08 -3.08 3/4 3/4 260 VDD 0.2VDD 3/4 140 36 3/4 3/4 3/4 Unit V mA mA mA mA mA mA mA V V MHz ms ms tSYS ms ms
4.5V VOH=0.6V 4.5V VOH=0.6V 4.5V VOL=0.45V 4.5V VOH=4.05V 4.5V VIL=0V
Note: tSYS=1/fSYS
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HT3670C
Functional Description
The HT3670C is a VLSI CMOS device specifically designed to offer maximum drum and rhythm sound flexibility for many drum instrument applications. The device provides 13 percussion pads each of which can select from a range of 18 percussion instruments. The additional choice of 36 rhythm/fill-in sounds, from which one can be chosen using 6 selection keys, supplies the additional backing sounds. Other important sound functions are provided in the way of adjustable tempo and volume keys in addition to replay and demo key functions. By utilizing a fully functional embedded Holtek 8-bit microcontroller, the device has the means to fully control a multi-key input keypad as well Rhythm listing The following table lists the range of 36 rhythms available. The rhythm to be played chosen can be selected using the 6 selection keys, the corresponding number will be displayed on the LED display. No. 00 01 02 03 04 05 10 11 12 13 14 15 20 21 22 23 24 25 Rhythm Dance Pop Folk Rock Casa Funk Rap Pop Rock Hard Rock Disco Party Rave Dance 8 Beat Beguine Bigband Boogie Chacha Disco Pop Latin Rock March No. 30 31 32 33 34 35 40 41 42 43 44 45 50 51 52 53 54 55 Reggae Rock & Roll Samba Soul Tango Twist Waltz Mambo Pop Bossa Polka Disco Soul R&B Blues Merengue 16 Beat Pop 8 Beat Light Fusion Pop Shuffle Rhythm as having the ability to control the internal ETS (Electronic Tone Synthesizer). After receiving the required action from the keypad, the microcontroller will generate and send the correct control code to the ETS to produce the required drum sound signals. The sound outputs appear on two melody outputs and a single sound output, all driven by current type D/A converters. Internal hardware circuitry is also provided to drive two seven-segment LED displays which together with connection to an appropriate external sound amplifier, a complete and fully programmable drum sound system can be created.
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HT3670C
Instrument Listing The following table lists the range of percussion instruments that can be chosen. By using the Pad Left/Right Keys and the corresponding Pad Key, each one of the 13 drum pads can select an individual instrument from the following list. No. 1 2 3 4 5 6 7 8 9 Instrument Bass Drum E-Snare Hand Clap Snare Drum Hi-Hat Close Hi-Hat Open Crash Cymbal Ha Ya No. 10 11 12 13 14 15 16 17 18 Cowbell Bongo Scratch Conga Timbale Guiro Long Mid Tom E-Tom Whistle Instrument
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HT3670C
Key listing The following table shows the function assigned to each of the keypad switches. To understand how the keypad switches correspond to the IC pins please refer to the application circuits. Key Pad1~13 Rhy0~5 T+ & TV+ & VContent Total of 13 input drum percussion pads These 6 selection keys select the required rhythm from a total choice of 36 Tempo control Up/Down, when pressed a Beep sound will be heard unless the upper or lower limit is reached Volume control Up/Down, when this key is pressed a Beep sound will be heard unless the upper or lower limit is reached, the default volume is set to be the largest volume setting Assigns one of the 18 percussion sounds to each of the 13 keys; pressing either the Pad Left/Right key and then pressing the corresponding drum pad key will change the presently assigned sound of that key one position to the left or to the right Toggle function key to start or stop the rhythm Total of 36 kinds The internal memory can record up to 8 drum beats Auto Bass Chord On/Off Before playing the Rhythm, the keys function is Intro; after playing the keys function is Ending Pressing the Demo key will sequentially play all the Rhythms starting from 00, pressing again or pressing the Start/Stop key will stop Play Repeat play of the recorded content
Pad Left & Pad Right Start/Stop Fill In Rec A.B.C Intro/Ending Demo Replay
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HT3670C
C5 OSCI P o w e r O n /O ff
150kW
74H C 244 LEDD LE LE LE
1kW 8550 V
DD
OT DC DD DE
120W
4 Com m on Anode 7 -s e g m e n t L E D
C4
1mF 470W
0 .1 m F
2 4
0 .1 m F 22W
220mF
PD0
O P T 1 (A u to P o w e r O ff) O P T 2 (A u to B a s s C h o rd )
PD1 C3 C2 C1 C0
F ill In Rec Pad R Pad L V o lV o l+ Tem p Tem p
* N o te OPT1 Pad Pad Pad Pad Pad Pad Dem In tro Rep Pad Pad Pad Pad Pad Pad Pad V 1 2 3 4 5 6 7 8 9 10 11 12 la y 13 o /E n d V V V
DD SS
R7 R6 R5 R4 R3 R2 R1 R0
OPT2
DD SS
A u to B a s s C h o rd No Yes 74H C 244 or 74HC4050
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Application Circuits
A u to P o w e r O ff Yes No
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HT3670C
AUO1 AUO2 PVO
1kW
10kW 3
6
LM 386 5
220mF
* N o te : 7 4 H C 2 4 4 b u ffe r c h ip is u s e d to in c r e a s e th e lig h tn e s s o f th e 7 - s e g m e n t L E D d is p la y . It c a n b e o m itte d u n d e r c o s t e ffe c tiv e c o n s id e r a tio n s .
LE LE LE LE LE LE
1kW 120W 4 8550
D2 D1 DG DF DA DB
74H C 244
1kW 8550
V
DD
December 10, 1999
A .B .C S ta rt/S to p R hy5 R hy4 R hy3 R hy2 R hy1 R hy0
+ ig h t e ft
HT3670C
LED2 LED1 8550 8550 1kW
1kW
V
DD
C5 P o w e r O n /O ff 150kW 200W OSCI
LEDD O T
C4 8550 V
DD
1kW AUO1 AUO2 PVO
1kW 1mF 470W 0 .1 m F
10kW 3 2
HT3670C
PD0 PD1 C3 C2 C1 C0 F ill In Rec Pad R Pad L V o lV o l+ Tem p Tem p + ig h t e ft R7 R6 R5 R4 R3 R2 R1 R0 A .B .C S ta rt/S to p R hy5 R hy4 R hy3 R hy2 R hy1 R hy0 O P T 2 (A u to B a s s C h o rd ) O P T 1 (A u to P o w e r O ff)
6 4
LM 386 5
220mF 0 .1 m F 22W 220mF
V 1 o /E n d 2 3 4 5 6 7 8 9 10 11 12 la y 13 V V V
DD SS
OPT2
DD SS
A u to B a s s C h o rd No Yes
This Material Copyrighted By Its Respective Manufacturer
* N o te OPT1 Pad Pad Pad Pad Pad Pad Dem In tro Rep Pad Pad Pad Pad Pad Pad Pad
A u to P o w e r O ff No Yes
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HT3670C
Holtek Semiconductor Inc. (Headquarters) No.3 Creation Rd. II, Science-based Industrial Park, Hsinchu, Taiwan, R.O.C. Tel: 886-3-563-1999 Fax: 886-3-563-1189 Holtek Semiconductor Inc. (Taipei Office) 5F, No.576, Sec.7 Chung Hsiao E. Rd., Taipei, Taiwan, R.O.C. Tel: 886-2-2782-9635 Fax: 886-2-2782-9636 Fax: 886-2-2782-7128 (International sales hotline) Holtek Semiconductor (Hong Kong) Ltd. RM.711, Tower 2, Cheung Sha Wan Plaza, 833 Cheung Sha Wan Rd., Kowloon, Hong Kong Tel: 852-2-745-8288 Fax: 852-2-742-8657 Copyright O 1999 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
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