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DATA SHEET
CX65003: 1400 - 2500 MHz Linear Power Amplifier Driver
Applications
* PCS/DCS/2.5G/3G base stations * Wireless Local Area Networks (WLANs) * GSM/CDMA/W-CDMA handsets * Wireless Local Loop (WLL) and Industrial, Scientific, Medical (ISM) bands * Repeaters * Telematics
Description
Skyworks CX65003 power amplifier driver offers a desirable combination of features that provide superb performance and ease of use in a low-cost Surface-Mounted Technology (SMT) package. This Gallium Arsenide (GaAs) Heterojunction Bipolar Transistor (HBT) power amplifier driver was developed and optimized for extreme linear performance in a variety of applications. It is ideal as a driver or output stage in transceivers and repeaters for Wideband Code Division Multiple Access (W-CDMA) and CDMA2000 applications. The 8-pin Small Outline Integrated Circuit (SOIC) device package and pinout are shown in Figure 1. Figure 2 shows a functional block diagram for the CX65003. Signal pin assignments and functional pin descriptions are provided in Table 1.
Features
* 5 V single supply operation * Linear POUT of 24.5 dBm * OIP3 of 48 dBm * Excellent W-CDMA performance * Internal bias circuits * 8-pin SOIC 5.994 x 4.928 mm package with downset paddle
VCC1
NC
1 8
8 5
VCC1
VCC2
Driver Bias
4
Y
VB
2
7
RFOUT
VB
RFIN
3 6
2
Input Bias PA
6 7
RFOUT
RFIN
Y
4 5
3
RFOUT
VCC2
C1215
C1216
Figure 1. CX65003 Pinout - 8-Pin SOIC Package (Top View)
Figure 2. CX65003 Functional Block Diagram
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DATA SHEET * CX65003
Table 1. CX65003 Signal Descriptions
Pin # 1 2 3 4 NC VB RFIN Y Name No connection Input bias for amplifier driver RF input Output of internal bias circuit Description Pin # 5 6 7 8 VCC2 RFOUT RFOUT VCC1 Name Supply voltage RF output RF output Supply voltage Description
Table 2. CX65003 Absolute Maximum Ratings
Parameter RF input power Supply voltage (VCC1 and VCC2 pins) Supply current (ID + IBIAS) Power dissipation Case operating temperature Storage temperature Junction temperature TC TST TJ -40 -55 PIN VCC ICC Symbol Min Typical Max 15 5.5 240 1.3 +85 +125 +150 Units dBm V mA W C C C
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value.
Technical Description
The CX65003 is a single stage linear amplifier. The device can be externally matched for optimum gain and linearity using two to three passive components. These external components allow the amplifier to be set to a desired operating frequency. The CX65003 contains a bias circuit for optimum temperature tracking performance. An external resistor is used to set the bias current level. The value of this resistor can be selected to set the amplifier operational mode to Class A, B, or AB.
Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. For packaging details, refer to the Skyworks Application Note, Tape and Reel, document number 101568.
Electrical and Mechanical Specifications
The absolute maximum ratings of the CX65003 are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Table 4. Typical performance characteristics of the CX65003 are shown in Figures 3 through 18. Figure 25 provides the package dimensions for the 8-pin SOIC and Figure 26 provides the tape and reel dimensions.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 C per second. Maximum temperature should not exceed 225 C and the time spent at a temperature that exceeds 210 C should be limited to less than 10 seconds. If the part is manually attached, precaution should be taken to ensure that the part is not subjected to a temperature that exceeds 300 C for more than 10 seconds.
Electrostatic Discharge (ESD) Sensitivity
The CX65003 is a static-sensitive electronic device. Do not operate or store near strong electrostatic fields. Take proper ESD precautions.
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DATA SHEET * CX65003
Table 3. CX65003 Recommended Operating Conditions
Parameter Supply voltage (VCC1 and VCC2 pins) Operating frequency Junction temperature Maximum bias condition VCC FO TJ (VCC x ID) < (TJ_RECOMMENDED - TC)/RTH,J-C 1400 Symbol Min Typical 5 2500 140 Max Units V MHz C
Table 4. CX65003 Electrical Characteristics
(VCC = 5 V, TC = 25 C) Parameter OIP3 Match, Frequency = 1960 MHz (Note 1) Quiescent current (lD + lBIAS) Small signal gain Linear output power (Note 2) Power Added Efficiency Noise Figure (NF) Output IP3 Iq G POUT PAE NF OIP3 Two CW tones with 1 MHz spacing, PIN = -4 dBm per tone 42 RBIAS = 270 PIN = -15 dBm PIN = +13 dBm PIN = +13 dBm 10 23 30 120 11.5 24.5 38 5 48 6 130 mA dB dBm % dB dBm Symbol Test Conditions Min Typical Max Units
Thermal resistance (junction - case) ACPR Match, Frequency = 2140 MHz (Note 3) Quiescent current (lD + lBIAS) Small signal gain (Note 4) Peak envelope power (Note 2)
RTH,J-C
65
C/W
Iq G PPEP
RBIAS = 330 PIN = -15 dBm 3G-WCDMA downlink test model #1 signal or IS95 downlink 9 ch Fwd signal, PIN = 9 dBm IS95 downlink CDMA signal, 9 ch Fwd, PIN = 11 dBm 3G-WCDMA downlink test model #1 signal with 64 DPCH, PIN = 9 dBm 20 9.5
90 11 29
105
mA dB dBm
Average output power (F = 1.96 GHz) @ ACPR = -45 dBc (Note 3), 885 kHz offset Average output power (F = 2.14 GHz) @ ACLR = -45 dBc, 5 MHz offset
POUTACPR
21
dBm
POUTACLR
18.5
20
dBm
Note 1: Device matched for optimum OIP3 according to circuit shown in Figure 21. Note 2: For reliable operation, do not violate the maximum input drive level specified in Table 2. Note 3: Device matched for optimum ACPR according to circuit shown in Figure 22. Note 4: For optimum output small signal gain and Noise Figure, use the matching circuit shown in Figure 21 and the characterization values for 1960 MHz operation.
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DATA SHEET * CX65003
25 21 Pout (dBm) 17 13
-40C
50 40 PAE (%) 30 20
-40C
9 5 -5 -1 3 Pin (dBm) 7 11
25C 85C
10 0 15 -5 -1 3 Pin (dBm) 7 11
25C 85C
15
Figure 3. Typical POUT vs PIN @ 1960 MHz Over Temperature (Circuit Match for Optimum OIP3)
Figure 4. Typical PAE vs PIN @ 1960 MHz Over Temperature (Circuit Match for Optimum OIP3)
15
13 Small Signal Gain (dB) 12 11 10
-40C
Small Signal Gain (dB)
14 13 12 11 10 9 1400.0 1512.5 1625.0 Freq (MHz) 1737.5 1850.0
-40C 25C 85C
9 8 1850 1880 1910 1940 1970
25C 85C
2000
Freq (MHz)
Figure 5. Typical Small Signal Gain From 1.4 to 1.85 GHz Over Temperature (Circuit Match for Optimum Gain)
Figure 6. Typical Small Signal Gain From 1.85 to 2.0 GHz Over Temperature (Circuit Match for Optimum OIP3)
13 12 11 10 9 8 7 2000
12 Small Signal Gain (dB) 11 10 9
-40C
Small Signal Gain (dB)
-40C 25C 85C
8 7 2300 2350 2400 Freq (MHz) 2450
25C 85C
2050
2100
2150
2200
2500
Freq (MHz)
Figure 7. Typical Small Signal Gain From 2 to 2.2 GHz Over Temperature (Circuit Match for Optimum OIP3)
Figure 8. Typical Small Signal Gain From 2.3 to 2.5 GHz Over Temperature (Circuit Match for Optimum OIP3)
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DATA SHEET * CX65003
6 5 NF (dB) NF (dB) 4 3 2 1 0 1400.0 1512.5 1625.0 Freq (MHz) 1737.5 1850.0
-40C 25C 85C
6 5 4 3 2 1 0 1850 1880 1910 1940 1970 2000 Freq (MHz)
-40C 25C 85C
Figure 9. Typical Noise Figure From 1.4 to 1.85 GHz Over Temperature (Circuit Match for Optimum Gain)
Figure 10. Typical Noise Figure From 1.85 to 2.0 GHz Over Temperature (Circuit Match for Optimum OIP3)
6 5 NF (dB) NF (dB)
-40C 25C 85C
8 7 6 5 4 3 2 1 0 2050 2100 Freq (MHz) 2150 2200 2300 2350 2400 Freq (MHz) 2450 2500
-40C 25C 85C
4 3 2 1 0 2000
Figure 11. Typical Noise Figure From 2.0 to 2.2 GHz Over Temperature (Circuit Match for Optimum OIP3)
Figure 12. Typical Noise Figure From 2.3 to 2.5 GHz Over Temperature (Circuit Match for Optimum OIP3)
55 50
OIP3 (dBm)
50 45 40 35 30 1880 1910 1940 1970 2000 2000 2050 2100 Freq (MHz) 2150 2200 Freq (MHz)
-40C 25C 85C
45 40
-40C
35 30 1850
25C 85C
Figure 13. Typical OIP3 From 1.85 to 2.0 GHz Over Temperature (Circuit Match for Optimum OIP3)
Figure 14. Typical OIP3 From 2.0 to 2.2 GHz Over Temperature (Circuit Match for Optimum OIP3)
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
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OIP3 (dBm)
5
DATA SHEET * CX65003
55 50 50 OIP3 (dBm) 45 40
-40C
OIP3 (dBm)
45 40
-40C
35 30 2300 2350 2400 Freq (MHz) 2450
25C 85C
35 30 2500 -5 -4 -3 -2 -1
25C 85C
0
Pin (dBm)
Figure 15. Typical OIP3 From 2.3 to 2.5 GHz Over Temperature (Circuit Match for Optimum OIP3)
Figure 16. Typical OIP3 vs PIN @ 1960 MHz Over Temperature (Circuit Match for Optimum OIP3)
-40 -45 ACPR (dBc) 10 12 14 16 Pout (dBm) 18 20 22 ACLR (dBc) -50 -55 -60 -65
-40 -45 -50 -55 -60 -65 -70 11 13 15 17 Pout (dBm) 19 21 23
Figure 17. Typical ACLR vs POUT @ 2.14 GHz, 5 MHz Offset, 25 C (Circuit Match for Optimum ACPR)
Figure 18. Typical ACPR vs POUT @ 1.96 GHz, 885 kHz Offset, 25 C (Circuit Match for Optimum ACPR)
Evaluation Board Description
The CX65003 Evaluation Board is used to test the performance of the CX65003 power amplifier driver. An Evaluation Board schematic diagram, optimized for the 3rd Order Output Intercept Point (OIP3), is shown in Figure 19. A schematic diagram optimized for Adjacent Channel Power Rejection (ACPR) is provided in Figure 20. The Evaluation Board assembly diagram is shown in Figure 21 and the Evaluation Board layer detail is shown in Figure 22. The mounting footprint for the CX65003 is shown in Figure 23. Circuit Design Configurations The following design considerations are general in nature and must be followed regardless of final use or configuration. 1. Paths to ground should be made as short as possible. 2. The ground pad of the CX65003 power amplifier has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit
board acts as the heat sink, it must shunt as much heat as possible from the amplifier. As such, design the connection to the ground pad to dissipate the maximum wattage produced to the circuit board. Multiple vias to the grounding layer are required. NOTE: Junction temperature (TJ) of the device increases with a poor connection to the slug and ground. This reduces the lifetime of the device. 3. External bypass capacitors are required on the VCC line and on pins 4, 5, and 8. 4. Bias resistor R1 is used to control the reference voltage of the bias circuit (VCC1) at pin 8. 5. Inductor L1 is placed between the bias circuit output (pin 4) and the base of RF transistor (pin 2) for bias circuit and RF transistor connection. Suggested matching circuits are shown in Figures 19 and 20.
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DATA SHEET * CX65003
Testing Procedure Use the following procedure to set up the CX65003 Evaluation Board for testing. Refer to Figure 24 for guidance: 1. Connect a 5.0 V supply to VCC. If available, enable the current limiting function of the power supply to 240 mA. 2. Connect a signal generator to the RF signal input port. Set it to the desired RF frequency at a power level of -15 dBm or less to the Evaluation Board but do NOT enable the RF signal. 3. Connect a spectrum analyzer to the RF signal output port.
4. Enable the power supply. 5. Enable the RF signal 6. Take measurements. CAUTION: If any of the input signals exceed the rated maximum values, the CX65003 Evaluation Board can be permanently damaged.
Power Supply
1 2
C8 18 pF
+5 V
C9 1 F
C6 18 pF
R2 0
C10 4.7 F
x
1
CX65003
8
R1 270 T_LINE
2
7
C2 2.7 pF
3 6
SMA
C1 0.5 pF
C3 0.5 pF
L1 5.6 nH
C11 DNI
4 5
C12 6.8 pF
SMA L2 DNI
C5 20 pF DNI -- Do Not Install
C7 18 pF
C1217
Figure 19. Application Schematic Optimized for OIP3 @ 1960 MHz
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DATA SHEET * CX65003
Power Supply
1 2
C8 18 pF
+5 V
C9 4.7 F
C6 18 pF
L3 10 nH
C10 1 F
x
1
CX65003
8
R1 270 T_LINE
2
7
C2 2.7 pF
3 6
SMA
C1 1 pF
C3 0.5 pF
L1 5.6 nH
C11 1.5 pF
4 5
C12 4.7 pF L2 4.7 nH
SMA
C5 20 pF DNI -- Do Not Install
C7 18 pF
C1410
Figure 20. Application Schematic Optimized for ACPR @ 2140 MHz
J3
GND
GND
JP1
C9 C8 R2 R1 C6 C12 C2 C3 L1 C5 C1433 C7 C11 L2
GND
Vcc
C10
J1 (RF In)
C1
J2 (RF Out)
Figure 21. Evaluation Board Assembly Diagram
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DATA SHEET * CX65003
Layer 1: Top Metal
Layer 2: Ground
Layer 3: Inner Traces
Layer 4: Ground
C1435
Figure 22. Evaluation Board Layer Detail
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9
DATA SHEET * CX65003
6.985
0.381 1.800
1.524 Minimum
1.270
2.710
0.635 Minimum 0.381 diameter plated-through via (minimum 20 recommended)
Dimensions are in millimeters
C1218
Figure 23. PCB Mounting Footprint
Power Supply
Signal Generator
Input
CX65003 Evaluation Board
Output
Power Meter or Spectrum Analyzer
C1240g
Figure 24. CX65003 Evaluation Board Testing Configuration
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DATA SHEET * CX65003
3
2
1 2.464 .051
5.994 .178
1.956 .051
Top View
2.921 .203
Bottom View
1.270 BSC 0.406 .076 0.330 .076 x 45
o
1.524 .127
1.473 .076 0.203 .038
0.051 .051
4.928 .102
Seating Plane Detail A
3.937 .102
Side View
End View
Parting Line Gauge Plane Seating Plane 0.254 0.635 .254
4 4
o
o
Detail A
All measurements are in millimeters
C1444
Figure 25. CX65003 8-Pin SOIC Package Dimensions
2.007 .203
1.55 0.05 8.00 0.10 Pin #1 Indicator 4.00 0.10 2.00 0.05
1.75 0.10
5.50 0.05
B A A
B
1.50 0.25 0.292 0.13
o 8 Max
5o Max
6.88 0.10
1.68 0.10
5.49 0.10
A
1. Carrier tape: black conductive polycarbonate or polystyrene. 2. Cover tape material: transparent conductive PSA. 3. Cover tape size: 9.3 mm wide. 4. All measurements are in millimeters.
B
C1242
Figure 26. CX65003 8-Pin SOIC Tape and Reel Dimensions
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
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12.00 + 0.30/-0.10
11
DATA SHEET * CX65003
Ordering Information
Model Name CX65003 1400-2500 MHz Linear Power Amplifier Driver Manufacturing Part Number CX65003-12 Evaluation Kit Part Number TW10-D292 (tuned for optimum OIP3 @ 1.96 GHz ) TW10-D293 (tuned for optimum ACPR @ 2.14 GHz and 1.96 GHz)
Copyright (c) 2002, 2004, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by or under this document. Except as may be provided in Skyworks Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever in association with its documentation, products, specifications and product descriptions. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED OR OTHERWISE, RELATING TO SALE AND/OR USE OF SKYWORKS PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: SkyworksTM, the Skyworks logo, and Breakthrough SimplicityTM. Product names or services listed in this publication are for identification purposes only, and may be trademarks of Skyworks or other third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.
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