![]() |
|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
application INFO available UC1705 UC2705 UC3705 High Speed Power Driver FEATURES * * * * * * * * * 1.5A Source/Sink Drive 100 nsec Delay 40 nsec Rise and Fall into 1000pF Inverting and Non-Inverting Inputs Low Cross-Conduction Current Spike Low Quiescent Current 5V to 40V Operation Thermal Shutdown Protection MINIDIP and Power Packages DESCRIPTION The UC1705 family of power drivers is made with a high speed Schottky process to interface between low-level control functions and high-power switching devices - particularly power MOSFETs. These devices are also an optimum choice for capacitive line drivers where up to 1.5 amps may be switched in either direction. With both Inverting and Non-Inverting inputs available, logic signals of either polarity may be accepted, or one input can be used to gate or strobe the other. Supply voltages for both VS and VC can independently range from 5V to 40V. For additional application details, see the UC1707/3707 data sheet. The UC1705 is packaged in an 8-pin hermetically sealed CERDIP for -55C to +125C operation. The UC3705 is specified for a temperature range of 0C to +70C and is available in either a plastic minidip or a 5-pin, power TO-220 package. TRUTH TABLE INV H L H L N.I H H L L OUT L H L L CONNECTION DIAGRAMS DIL-8 MINIDIP, SOIC-8 (TOP VIEW) N or J Package, D Package 5-PIN TO-220 (TOP VIEW) T Package OUT = INV and N.I. OUT = INV or N.I. BLOCK DIAGRAM JANUARY 1994 - REVISED AUGUST 2000 - SLUS370A UC1705 UC2705 UC3705 ABSOLUTE MAXIMUM RATINGS N-Pkg J-Pkg T-Pkg Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . . 40V Collector Supply Voltage, VC . . . . . . . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . . 40V Output Current (Source or Sink) Steady-State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500mA. . . . . . . . . . . . . . . . 500mA. . . . . . . . . . . . . . . . . 1.0A Peak Transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5A. . . . . . . . . . . . . . . . . . 1.0A. . . . . . . . . . . . . . . . . . 2.0A Capacitive Discharge Energy . . . . . . . . . . . . . . . . . . . . . . 20J. . . . . . . . . . . . . . . . . . . 15J. . . . . . . . . . . . . . . . . . . 50J . . Digital Inputs (See Note) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V. . . . . . . . . . . . . . . . . . . 5.5V. . . . . . . . . . . . . . . . . . . 5.5V Power Dissipation at TA = 25C (See Note) . . . . . . . . . . . . . . 1W. . . . . . . . . . . . . . . . . . . . 1W. . . . . . . . . . . . . . . . . . . . 3W Power Dissipation at TA (Leads/Case) = 25C (See Note) . . . 3W. . . . . . . . . . . . . . . . . . . . 2W . . . . . . . . . . . . . . . . . . . 25W Operating Temperature Range . . . . . . . . . . . . . . . . . . . . 0C to +70C . . . . . . . . . . -55C to +125C . . . . . . . . . . 0C to +70C Storage Temperature Range . . . . . . . . . . . . . . . . . . . . -65C to +150C . . . . . . . . . -65C to +150C . . . . . . . . . -65C to +150C Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . . . . 300C . . . . . . . . . . . . . . . . . 300C . . . . . . . . . . . . . . . . . 300C Note: All currents are positive into, negative out of the specified terminal. Digital Drive can exceed 5.5V if input current is limited to 10mA Consult Packaging Section of Databook for thermal limitations and considerations of package. ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA = -55C to +125C for the UC1705, -25C to +85C for the UC2705, and 0C to +70C for the UC3705; VS = VC = 20V, TA = TJ. PARAMETERS VS Supply Current VC Supply Current (N, J Only) VC Leakage Current (N, J Only) Digital Input Low Level Digital Input High Level Input Current Input Leakage Output High Sat., VC-VO Output Low Sat., VO Thermal Shutdown TEST CONDITIONS VS = 40V, (Outputs High, T Pkg) VS = 40V, (Outputs Low, T Pkg) VC = 40V, Outputs Low VS = 0, VC = 30V MIN TYP 6 8 2 0.05 MAX UNITS 8 mA 12 mA 4 mA 0.1 mA 0.8 V V -1.0 mA 0.1 mA 2.0 V 2.5 V 0.4 V 2.5 V C 2.2 VI = 0 VI = 5V IO = -50mA IO = -500mA IO = 50mA IO = 500mA -0.6 0.05 155 TYPICAL SWITCHING CHARACTERISTICS: PARAMETERS From Inv. Input to Output: Rise Time Delay 10% to 90% Rise Fall Time Delay 90% to 10% Fall From N. I. Input to Output: Rise Time Delay 10% to 90% Rise Fall Time Delay 90% to 10% Fall VC Cross-Conduction Current Spike Duration VS = VC = 20V, TA = 25C. Delays measured to 10% output change. TEST CONDITIONS OUTPUT CL = open 1.0 2.2 60 60 60 20 40 60 60 60 60 25 40 50 90 20 60 25 25 0 90 40 60 40 90 60 60 50 UNIT nF ns ns ns ns ns ns ns ns ns ns Ouput Rise Output Fall 2 UC1705 UC2705 UC3705 APPLICATIONS Power MOSFET Drive Circuit Power MOSFET Drive Circuit using Negative Bias Voltage and Level Shifting to Ground Referenced PWMs. D1, D2: UC3611 Schottky Diodes D1, D2: UC3611 Schottky Diodes Transformer Coupled MOSFET Drive Circuit Charge Pump Circuits D1, D2: UC3611 Schottky Diodes UNITRODE CORPORATION 7 CONTINENTAL BLVD. * MERRIMACK, NH 03054 TEL. 603-424-2410 * FAX 603-424-3460 3 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2005 PACKAGING INFORMATION Orderable Device 5962-9579801M2A 5962-9579801MPA 5962-9579801VPA UC1705J UC1705J883B UC1705L883B UC2705D UC2705J UC2705N UC3705D UC3705DTR UC3705DTRG4 UC3705J UC3705N UC3705NG4 UC3705T UC3705TG3 (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type LCCC CDIP CDIP CDIP CDIP LCCC SOIC CDIP PDIP SOIC SOIC SOIC CDIP PDIP PDIP TO-220 TO-220 Package Drawing FK JG JG JG JG FK D JG P D D D JG P P KC KC Pins Package Eco Plan (2) Qty 20 8 8 8 8 20 8 8 8 8 8 8 8 8 8 5 5 1 1 1 1 1 1 75 1 50 75 TBD TBD TBD TBD TBD TBD Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) POST-PLATE Level-NC-NC-NC A42 SNPB A42 A42 SNPB A42 SNPB CU NIPDAU A42 SNPB CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU A42 SNPB CU NIPDAU CU NIPDAU CU SN CU SN Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-2-260C-1 YEAR Level-NC-NC-NC Level-NC-NC-NC Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC POST-PLATE Level-NC-NC-NC 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 1 50 50 50 50 TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2005 information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MCER001A - JANUARY 1995 - REVISED JANUARY 1997 JG (R-GDIP-T8) 0.400 (10,16) 0.355 (9,00) 8 5 CERAMIC DUAL-IN-LINE 0.280 (7,11) 0.245 (6,22) 1 4 0.065 (1,65) 0.045 (1,14) 0.063 (1,60) 0.015 (0,38) 0.020 (0,51) MIN 0.310 (7,87) 0.290 (7,37) 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 0-15 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) 28 TERMINAL SHOWN LEADLESS CERAMIC CHIP CARRIER 18 17 16 15 14 13 12 NO. OF TERMINALS ** 11 10 28 9 8 7 6 68 5 84 44 52 20 A MIN 0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) MAX 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) MIN 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6) B MAX 0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0) 19 20 21 B SQ 22 A SQ 23 24 25 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 0.045 (1,14) 0.035 (0,89) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPDI001A - JANUARY 1995 - REVISED JUNE 1999 P (R-PDIP-T8) 0.400 (10,60) 0.355 (9,02) 8 5 PLASTIC DUAL-IN-LINE 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.015 (0,38) 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.010 (0,25) NOM Gage Plane 0.020 (0,51) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) M 0.430 (10,92) MAX 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MSOT008B - JANUARY 1995 - REVISED SEPTEMBER 2000 KC (R-PSFM-T5) 0.420 (10,67) 0.380 (9,65) 0.113 (2,87) 0.103 (2,62) 0.185 (4,70) 0.175 (4,46) PLASTIC FLANGE-MOUNT 0.156 (3,96) DIA 0.146 (3,71) 0.055 (1,40) 0.045 (1,14) 0.147 (3,73) 0.137 (3,48) 0.340 (8,64) 0.330 (8,38) 0.125 (3,18) (see Note C) 1.037 (26,34) 0.997 (25,32) 1 0.040 (1,02) 0.030 (0,76) 0.010 (0,25) M 5 0.122 (3,10) 0.102 (2,59) 0.025 (0,64) 0.012 (0,30) 4040208/E 09/00 0.067 (1,70) 0.268 (6,81) NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Lead dimensions are not controlled within this area. All lead dimensions apply before solder dip. The center lead is in electrical contact with the mounting tab. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless |
Price & Availability of UC3705D
![]() |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |