 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| CALIFORNIA MICRO DEVICES PACDN1408C PACDN2408C ESD PROTECTION ARRAY, 8 CHANNEL, CHIP SCALE PACKAGE Features * 8 transient voltage suppressors in a single chip scale wafer level package. * Compact Chip Scale Package (CSP) format saves board space and ease layout in space critical applications compared to discrete solutions and traditional wire bonded packages. * In-system Electro Static Discharge (ESD) protection to 20kV contact discharge per IEC 61000-4-2 international standard. * PACDN2408C features back-to-back zener protection for AC signals. Applications * ESD protection of cellular phones, PDA, internet appliances and PC ports. * Protection of interface ports or IC pins which are exposed to high levels of ESD. * PACDN2408C can be used for ESD protection of set-top box R,L,V ports. Product Description The PACDN1408C and PACDN2408C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD. The back-to-back zener connections of the PACDN2408C provides ESD protection in cases where nodes with AC signals are present. These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge). All I/Os are rated at 20kV using the IEC 61000-4-2 contact discharge method. Using the MILSTD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than 30kV. The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. SCHEMATIC DIAGRAMS B1 B2 B3 B4 B5 B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 A1 A2 A3 A4 A5 PACDN1408C PACDN2408C S TA N D A R D PA R T O R D E R I N G I N F O R M AT I O N Package Style Chip Scale Chip Scale (c) 2000 California Micro Devices Corp. All rights reserved. 6/19/2000 Ordering Part Number Bumps 10 10 Tape & Reel PACDN1408C/R PACDN2408C/R C1130600 Part Marking 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 1 CALIFORNIA MICRO DEVICES PACDN1408C PACDN2408C PA C D N 1 4 0 8 C S P E C I F I C AT I O N S (At 25C unless specified otherwise) Min Reverse Stand-off Voltage, I = 10A Signal Clamp Voltage: Positive Clamp, 10mA Negative Clamp, 10mA In-system ESD withstand voltage*: Human Body Model (MIL-STD-883D, method 3015 IEC 61000-4-2, contact discharge method Clamping voltage during ESD discharge MIL-STD-883D (Method 3015), 8kV Capacitance at 2.5V dc, 1MHz Temperature Range: Operating Storage Positive Negative 5.5 5.6 -1.2 6.6 -0.8 30 25 12 -8 30 -40 -65 85 150 8.0 -0.4 Typ Max Unit V V V kV kV V V pF C * ESD applied between channel pin and ground, one at a time. All other channels are open. All GND pins grounded. This parameter is guaranteed by design and characterization. `GND' in this document refers to the lower supply voltage. PA C D N 2 4 0 8 C S P E C I F I C AT I O N S (At 25C unless specified otherwise) Min Reverse Stand-off Voltage, I = 10A Signal Clamp Voltage: Positive Clamp, 10mA Negative Clamp, 10mA In-system ESD withstand voltage*: Human Body Model (MIL-STD-883D, method 3015 IEC 61000-4-2, contact discharge method Clamping voltage during ESD discharge MIL-STD-883D (Method 3015), 8kV Capacitance at 2.5V dc, 1MHz Temperature Range: Operating Storage Positive Negative 5.9 6.0 -9.2 7.6 -7.6 30 18 14 -14 30 -40 -65 85 150 9.2 -6.0 Typ Max Unit V V V kV kV V V pF C * ESD applied between channel pin and common, one at a time. All other channels are open. This parameter is guaranteed by design and characterization. (c)2000 California Micro Devices Corp. All rights reserved. 2 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 6/19/2000 CALIFORNIA MICRO DEVICES Package Diagram 0.65mm 3.104mm 0.252mm B A 0.35mm dia. Bumps 1 2 3 4 5 0.65mm PACDN1408C PACDN2408C 0.252mm 0.381mm 0.643mm Pin Orientation Both parts are symmetrical, and do not require orientation to pin-1 found in conventional semiconductors. The part may rotated 180 without affecting operation. P R I N T E D C I R C U I T B OA R D R E C O M E N D AT I O N S Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening Solder Flux Ratio Solder Paste Bond Trace Finish 0.300mm Round Non Solder Mask Defined Pads (NSMD) 0.350mm 0.152mm 0.360mm (sq.) 50/50 No Clean OSP (Entek Cu Plus 106A) Typical Solder Reflow Thermal Profile (No Clean Flux) (c) 2000 California Micro Devices Corp. All rights reserved. 6/19/2000 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 1.154mm www.calmicro.com 3 |
Price & Availability of PACDN1408C
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |