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| Advanced Power MOSFET FEATURES n Avalanche Rugged Technology n Rugged Gate Oxide Technology n Lower Input Capacitance n Improved Gate Charge n Extended Safe Operating Area n Lower Leakage Current : 10 A (Max.) @ VDS = 100V n Lower RDS(ON) : 0.046 (Typ.) IRLS540A BVDSS = 100 V RDS(on) = 0.058 ID = 17 A TO-220F 1 2 3 1.Gate 2. Drain 3. Source Absolute Maximum Ratings Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt PD TJ , TSTG TL Characteristic Drain-to-Source Voltage Continuous Drain Current (TC=25) Continuous Drain Current (TC=100) Drain Current-Pulsed Gate-to-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation (TC=25) Linear Derating Factor Operating Junction and Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8 from case for 5-seconds Value 100 17 12 98 20 385 17 4.4 6.5 44 0.29 - 55 to +175 Units V A A V mJ A mJ V/ns W W/ 300 Thermal Resistance Symbol RJC RJA Characteristic Junction-to-Case Junction-to-Ambient Typ. --Max. 3.4 62.5 Units o C/W Rev. A IRLS540A Electrical Characteristics (TC=25 unless otherwise specified) Symbol BVDSS BV/TJ VGS(th) IGSS IDSS RDS(on) gfs Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd Characteristic Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coeff. Gate Threshold Voltage Gate-Source Leakage , Forward Gate-Source Leakage , Reverse Drain-to-Source Leakage Current Static Drain-Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain(Miller) Charge Min. Typ. Max. Units 100 -1.0 -----------------0.1 ------22 --2.0 100 -100 10 100 0.058 -A S pF V V/ V nA N-CHANNEL POWER MOSFET Test Condition VGS=0V,ID=250A ID=250A VGS=20V VGS=-20V VDS=100V VDS=80V,TC=150 VGS=5V,ID=8.5A VDS=40V,ID=8.5 See Fig 7 VDS=VGS, ID=250A 1215 1580 310 390 145 180 7 12 38 24 38.4 6.2 23.3 25 35 85 60 54 --nC ns VGS=0V,VDS=25V,f =1MHz See Fig 5 VDD=50V,ID=28A, RG=4.6 See Fig 13 VDS=80V,VGS=5V, ID=28A See Fig 6 & Fig 12 Source-Drain Diode Ratings and Characteristics Symbol IS ISM VSD trr Qrr Characteristic Continuous Source Current Pulsed-Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Min. Typ. Max. Units --------132 0.63 28 98 1.5 --A V ns C Test Condition Integral reverse pn-diode in the MOSFET TJ=25,IS=17A,VGS=0V TJ=25,IF=28A diF/dt=100A/s Notes ; Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature L=2mH, IAS=17A, VDD=25V, RG=27, Starting TJ =25 ISD28A, di/dt400A/s, VDDBVDSS , Starting TJ =25 Pulse Test : Pulse Width = 250s, Duty Cycle 2% Essentially Independent of Operating Temperature N-CHANNEL POWER MOSFET Fig 1. Output Characteristics 12 0 Top : VGS 7.0 V 6.0 V 5.5 V 5.0 V 4.5 V 4.0 V 3.5 V Bottom : 3.0 V IRLS540A Fig 2. Transfer Characteristics 12 0 ID , Drain Current [A] ID , Drain Current [A] 11 0 1 5 oC 7 11 0 2 oC 5 - 5 oC 5 10 0 @Nts: oe 1 V =0V . GS 2 V =4 V . DS 0 3 2 0 s P l e T s .5 us et 4 6 8 1 0 10 0 1 -1 0 10 0 @Nts: oe 1 2 0 s P l e T s .5 us et 2 T = 2 oC .C 5 11 0 0 2 VDS , Drain-Source Voltage [V] VGS , Gate-Source Voltage [V] Fig 3. On-Resistance vs. Drain Current 00 .8 Fig 4. Source-Drain Diode Forward Voltage IDR , Reverse Drain Current [A] 12 0 RDS(on) , [ ] Drain-Source On-Resistance 00 .6 V =5V GS 00 .4 11 0 V =1 V 0 GS 00 .2 @ N t : T = 2 oC oe J 5 00 .0 0 3 0 6 0 9 0 10 2 1 5 oC 7 2 oC 5 1 0 04 . 0 @Nts: oe 1 V =0V . GS us et 2 2 0 s P l e T s .5 10 . 12 . 14 . 16 . 18 . 20 . 22 . 24 . 06 . 08 . ID , Drain Current [A] VSD , Source-Drain Voltage [V] Fig 5. Capacitance vs. Drain-Source Voltage 20 50 C =C +C (C =sotd) iss gs gd ds h r e C =C +C oss ds gd C =C rss gd C iss 10 50 C oss 10 00 C rss 50 0 @Nts: oe 1 V =0V . GS 2 f=1Mz . H 6 Fig 6. Gate Charge vs. Gate-Source Voltage VGS , Gate-Source Voltage [V] 20 00 V =2 V 0 DS V =5 V 0 DS V =8 V 0 DS 4 Capacitance [pF] 2 @Nts:I =2 A oe 8 D 0 0 8 1 6 2 4 3 2 4 0 00 1 0 11 0 VDS , Drain-Source Voltage [V] QG , Total Gate Charge [nC] IRLS540A Fig 7. Breakdown Voltage vs. Temperature 12 . 30 . N-CHANNEL POWER MOSFET Fig 8. On-Resistance vs. Temperature Drain-Source Breakdown Voltage 11 . RDS(on) , (Normalized) Drain-Source On-Resistance 25 . BVDSS , (Normalized) 20 . 10 . 15 . 10 . @Nts: oe 1 V =5V . GS 2 I =1 A .D 4 -0 5 -5 2 0 2 5 5 0 7 5 10 0 15 2 10 5 15 7 20 0 09 . @Nts: oe 1 V =0V . GS D 05 . 2 I = 2 0 A . 5 08 . -5 7 -0 5 -5 2 0 2 5 5 0 7 5 10 0 15 2 o 10 5 15 7 20 0 00 . -5 7 TJ , Junction Temperature [ C] TJ , Junction Temperature [oC] Fig 9. Max. Safe Operating Area Oeaini Ti Ae prto n hs ra i Lmtdb R s iie y DS(on) Fig 10. Max. Drain Current vs. Case Temperature 3 0 12 0 ID , Drain Current [A] 2 4 ID , Drain Current [A] 1 0 s 0 1m s 1 0 1 1 8 1m 0s D C @Nts: oe 1 T = 2 oC . 5 C J 1 2 10 0 7 2 T = 1 5 oC . 3 Snl Ple . ige us 1 -1 0 0 1 0 11 0 12 0 6 0 2 5 5 0 7 5 10 0 15 2 10 5 15 7 VDS , Drain-Source Voltage [V] Tc , Case Temperature [oC] Fig 11. Thermal Response Thermal Response 100 D=0.5 @ Notes : 1. Z J C (t)=1.24 0.2 0.1 10- 1 0.05 0.02 0.01 single pulse o C/W Max. 2. Duty Factor, D=t1 /t2 3. TJ M -TC =PD M *Z PDM t1 t2 JC (t) Z (t) , JC 10- 2 - 5 10 10- 4 10- 3 10- 2 10- 1 100 101 t 1 , Square Wave Pulse Duration [sec] N-CHANNEL POWER MOSFET Fig 12. Gate Charge Test Circuit & Waveform IRLS540A * Current Regulator " 50K 12V 200nF 300nF Same Type as DUT VGS Qg 10V VDS VGS DUT 3mA Qgs Qgd R1 Current Sampling (IG) Resistor R2 Current Sampling (ID) Resistor Charge Fig 13. Resistive Switching Test Circuit & Waveforms RL Vout Vin RG DUT Vin 10V td(on) t on tr td(off) t off tf 10% Vout VDD ( 0.5 rated VDS ) 90% Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms LL VDS Vary tp to obtain required peak ID BVDSS 1 EAS = ---- LL IAS2 -------------------2 BVDSS -- VDD BVDSS IAS C VDD VDD tp ID RG DUT 5V tp ID (t) VDS (t) Time IRLS540A Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms N-CHANNEL POWER MOSFET DUT + VDS -- IS L Driver RG VGS Same Type as DUT VGS VDD * dv/dt controlled by RG * IS controlled by Duty Factor D VGS ( Driver ) Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current IS ( DUT ) IRM di/dt Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt Vf VDD Body Diode Forward Voltage Drop TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx Bottomless CoolFET CROSSVOLT DenseTrench DOME EcoSPARK E2CMOSTM EnSignaTM FACT FACT Quiet Series DISCLAIMER FAST a FASTr FRFET GlobalOptoisolator GTO HiSeC I2C ISOPLANAR LittleFET MicroFET MicroPak MICROWIRE OPTOLOGIC a OPTOPLANAR PACMAN POP Power247 PowerTrench a QFET QS QT Optoelectronics Quiet Series SILENT SWITCHER a UHC SMART START UltraFET a SPM VCX STAR*POWER Stealth SuperSOT-3 SuperSOT-6 SuperSOT-8 SyncFET TinyLogic TruTranslation STAR*POWER is used under license FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Preliminary No Identification Needed Full Production Obsolete Not In Production Rev. H5 |
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