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DATA SHEET DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC1652G
SILICON MONOLITHIC BIPOLAR INTEGRATED CIRCUIT WIDE BAND AMPLIFIER
DESCRIPTION
The PC1652G is a silicon monolithic integrated circuit especially designed as a wide band amplifier convering HF band through UHF band.
INPUT GND GND GND
PIN CONNECTIONS
1 2 3 4
8 7 6 5
GND VCC VCC OUTPUT
FEATURES
* Excellent frequency response : 1 200 MHz TYP. @ 3 dB down * High power gain : 18 dB TYP. @ f = 500 MHz * Low voltage operation : VCC = 5 V * SOP package
ABSOLUTE MAXIMUM RATINGS (TA = +25 C)
Supply Voltage Total Power dissipation Operating Ambient Temperature Storage Temperature VCC PD TA Tstg 7 440 -20 to +75 -40 to +125 V mW C C
EQUIVALENT CIRCUIT
VCC
ELECTRICAL CHARACTERISTICS (TA = +25 C, VCC = 5 V)
CHARACTERISTIC Circuit Current Power Gain Noise Figure
OUT
SYMBOL MIN. TYP. MAX. UNIT ICC GP NF BW ISO S11 S22 PO 15 16 20 18 5.5 1000 1200 23 17 12 3 26 20 15 5 25 20 6.5 mA dB dB
TEST CONDITIONS No signals f = 500 MHz f = 500 MHz
Band Width Isolation
MHz 3 dB down below flat gain dB dB dB f = 500 MHz f = 500 MHz f = 500 MHz
IN
Input Return Loss Output Return Loss Maximum Output Level
GND
dBm f = 500 MHz
NEC cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P12443EJ5V0DS00 (5th edition) Date Published November 1999 N CP(K) Printed in Japan
The mark
shows major revised points.
(c)
1983, 1999
PC1652G
TYPICAL CHARACTERISTICS (TA = +25 C)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE INPUT POWER vs. OUTPUT POWER VCC = 5 V f = 500 MHz 20
PO-Output Power-dBm ICC-Circuit Current-mA
+5
10
0
-5 0 1 2 3 4 VCC-Supply Voltage-V 5 6
-20
-15 Pin-Input Power-dBm
-10
NOISE FIGURE AND POWER GAIN vs. FREQUENCY VCC = 5V
INPUT AND OUTPUT RETURN LOSS vs. FREQUENCY VCC = 5V
NF-Noise Figure-dB
10
GP-Power Gain-dB
25 20 15 10 5 0 50 100 GP NF
|S11|-Input Return Loss-dB |S22|-Output Return Loss-dB
0 -10 -20 -30 -40 50 100 |S11| |S12|
8 6 4 2 0
200 500 1000 f-Frequency-MHz
2000
200 500 1000 f-Frequency-MHz
2000
ISOLATION vs. FREQUENCY VCC = 5V
0
|S12|-Isolation-dB
-10 -20 -30 -40 50 100 200 500 1000 f-Frequency-MHz 2000
2
Data Sheet P12443EJ5V0DS00
PC1652G
PACKAGE DIMENSIONS
8 PIN PLASTIC SOP (225 mil) (UNIT: mm)
8
5
detail of lead end
3-3
+7
1
5.2 0.2
4
6.5 0.3 1.57 0.2 1.49 4.4 0.15 1.1 0.2
0.85 MAX. 1.27 0.42 -0.07 0.1 0.1
+0.08
0.6 0.2 0.17 -0.07
+0.08
0.10
0.12 M
NOTE
Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.
Data Sheet P12443EJ5V0DS00
3
PC1652G
NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to keep minimum ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) The bypass capacitor should be attached to the VCC pin. (5) The DC cut capacitor must be each attached to the input and output pins. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
PC1652G
Recommended Condition Symbol IR35-00-3
Soldering Method Infrared ray reflow
Soldering Conditions Package peak temperature: 235 C, Hour: within 30 s. Note (more than 210 C), Time: 3 times, Limited days: no. Package peak temperature: 215 C, Hour: within 40 s. Note (more than 200 C), Time: 3 times, Limited days: no. Soldering tub temperature: less than 260 C, Hour: within 10 s. Note Time: 1 time, Limited days: no. Pin area temperature: less than 300 C, Hour: within 3 s/pin. Note Limited days: no.
VPS
VP15-00-3
Wave soldering
WS60-00-1
Pin part heating
Note It is the storage days after opening a dry pack, the storage conditions are 25 C, less than 65 % RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
4
Data Sheet P12443EJ5V0DS00
PC1652G
[MEMO]
Data Sheet P12443EJ5V0DS00
5
PC1652G
[MEMO]
6
Data Sheet P12443EJ5V0DS00
PC1652G
[MEMO]
Data Sheet P12443EJ5V0DS00
7
PC1652G
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

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