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www.fairchildsemi.com FAN1539/FAN1540 1A/1.3A, LDO With Low Quiescent Current Features * * * * * * * * Very Low Ground Current (IGND = 1mA) Excellent Line Regulation Excellent Load Regulation Very Low Transient Overshoot Stable with low ESR Output Capacitor (ESR = 0m) Thermal Shutdown Current Limit Output Options: 3.3V and 1.8V Description The FAN1539/FAN1540 series of high current LDO (1.0A and 1.3A) has been developed for portable applications where low quiescent current is an important requirement. The device features excellent line and load transient response which does not exceed 10% of nominal output value for full operating temperature range even during power ON cycle and short circuit removal. Internally trimmed, temperature compensated bandgap reference guarantees 2.5% accuracy for full range of input voltage, output current and temperature. Included on the chip are accurate current limit and thermal shutdown protection. Device stability is achieved with only two external low ESR ceramic capacitors. The FAN1539/FAN1540 is available in thermally enhanced 3x3mm 6-lead MLP, 5x6mm 8-lead MLP package and 3-lead TO-252 packages. The 5x6mm MLP package version features separate Kelvin sense pin for high precision applications. Applications * * * * Disk Drive Circuits Desktop Computers Laptop, Notebook Computers General purpose Three Terminal Regulator Block Diagram V IN V OUT BANDGAP REFERENCE CURRRENT LIMIT ERROR AMPLIFIER X (Note1) V SENSE (Note2) SRART-UP CIRCUIT THERMAL SHUTDOWN GND Notes: 1. No connection for FAN1540MMPX. 2. VSEN available for FAN1540MMPX. REV. 1.0.8 3/22/04 FAN1539/FAN1540 PRODUCT SPECIFICATION Pin Assignments TOP VIEW GND VOUT VSEN VIN 1 8 GND GND GND GND NC VOUT VIN 1 2 6 5 GND NC NC 2 7 FAN1540 3 6 4 5 3 4 FAN1540 FAN1539/FAN1540 3x3mm 6-Lead MLP VOUT GND VIN 5x6mm 8-Lead MLP 3-Lead TO-252 PACKAGE Pin Description Symbol VIN GND VOUT VSEN NC Input pin Ground Pin (Tab) Output pin: Fixed Output Voltage Output sense pin. Connect to VOUT if Kelvin sensing is not required No Connection Name And Function 2 REV. 1.0.8 3/22/04 PRODUCT SPECIFICATION FAN1539/FAN1540 Absolute Maximum Ratings Parameter Operating Input Voltage Power Dissipation Short Circuit Output Current Operating Junction Temperature Range Thermal Resistance- Junction to Tab, TO-252 Thermal Resistance- Junction to Tab, 3mmx3mm 6-lead MLP (Note 3) Thermal Resistance- Junction to Tab, 5mmx6mm 8-lead MLP (Note 3) Storage Temperature Range (Note 3) Lead Temperature (I.R. Reflow) 30Sec. (Note 4) Lead Temperature (Soldering) 10Sec. (Note 4) Electrostatic Discharge Protection (Note 5) HBM CDM Symbol VIN PD IOSH TJ JC JC JC TSTG TLEAD TLEAD ESD Value 10 Internally Limited Internally Limited 0 to 150 3 8 4 -65 to 150 240 260 4 2 Units V W A C C/W C/W C/W C C C kV Notes: 3. Junction to ambient thermal resistance, JA, is a strong function of PCB material, board thickness, thickness and number of copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics.Thermal resistance( JA ), VIN, IOUT must be chosen not to exceed TJ = 150C. 4. Soldering temperature should be 260C for 10 second after 240C for 30 second in I.R. reflow using 60/40 solder. Maximum rate of temperature rise is 3C/SEC to within 100C of the final temperature. 5. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model). REV. 1.0.8 3/22/04 3 FAN1539/FAN1540 PRODUCT SPECIFICATION Electrical Characteristics--FAN1539MPX, FAN1540MPX, FAN1540MMPX, FAN1540DX Unless otherwise specified, VIN = 4.50V to 7V, Tj = 25C, IMAX (FAN1539) = 1.0A, IMAX (FAN1540) = 1.3A. Boldface limits apply over operating junction temperature range of 0C T J 125C. TEST CONDITIONS Parameter Symbol VOUT VIN IOUT TEST LIMITS Min. 3.217 Typ. Max. 3.383 2 25 30 0.9 3.3 0 15 35 40 1.2 V A mA mV mV Units Output Voltage FAN1540 4.75V V IN 5.25V 3.0V V IN 5.25V 4.75V 5mA I OUT I MAX 5mA I OUT I MAX 5mA I OUT I MAX FAN1539 FAN1540 3.234 3.300 3.366 V Line Regulation REG(LINE) Load Regulation REG(LOAD) Dropout Voltage (Note 6) Current Limit Min. Output Current for regulation ( V OUT 3% ) Temperature Stability RMS Output Noise (Note 7) VD IS IOMIN 5.5V IOUT = IMAX TS VN RA IOUT = 5mA IOUT = IMAX 0.3 0.003 % %VOUT Ripple Rejection Ratio (Note 8) 5V IOUT = 10mA IOUT = 100mA IOUT = IMAX 65 63 45 75 73 57 2.0 dB Transient Response Change of VOUT with step load change (Note 9) V OUT ---------------I OUT 5V 1mA to IMAX t r 1S IMAX to 1mA t f 1S 10 (undershoot or overshoot of VOUT) 10 (undershoot or overshoot of VOUT) % Transient Response Change of VOUT with application of VIN (Note 9) V OUT ---------------V IN 0 to 5V Step Input t r 1S 10% to 90% 1mA I OUT I MAX 5.0 % 4 REV. 1.0.8 3/22/04 PRODUCT SPECIFICATION FAN1539/FAN1540 Electrical Characteristics--FAN1539MPX, FAN1540MPX, FAN1540MMPX, FAN1540DX (Continued) Unless otherwise specified, VIN = 4.50V to 7V, Tj = 25C, IMAX (FAN1539) = 1.0A, IMAX (FAN1540) = 1.3A. Boldface limits apply over operating junction temperature range of 0C T J 125C. TEST CONDITIONS Parameter Transient Response Short circuit Removal Response (Note 9) Symbol VIN 5V IOUT IOUT = short to IOUT = 10mA TEST LIMITS Min. Typ. 5.0 Max. Units % V OUT ---------------V IN @IOUT = short 10 (overshoot or undershoot of VO) 2.0 2.0 2.0 Quiescent Current Quiescent Current Quiescent Current Thermal Shutdown Thermal Hysteresis IGND IGND IGND TjSD THYST V IN 7V V IN 7V VIN = 5V IOUT = 0mA 2mA I OUT I MAX 0mA I OUT 50mA 1.0 1.0 1.0 160 15 mA mA mA 3.0V V IN 5.25V 3.0 V IN 5.25V C C Notes: 6. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the nominal value measured at VIN = 5V. 7. Measured within 10Hz to 10kHz bandwidth. 8. Measured at DC, specified at 120 Hz. 9. CIN = 22F, COUT = 10F. Both capacitors are low ESR X7R type. Test Circuit VIN IN VOUT DUT GND OUT 10F CIN 22F COUT Notes: 1. Use low ESR capacitors. 2. CIN should be placed as close to VIN as possible. REV. 1.0.8 3/22/04 5 FAN1539/FAN1540 PRODUCT SPECIFICATION Electrical Characteristics--FAN1540D18X Unless otherwise specified, VIN = 3.135V to 3.465V, Tj= 25C, IMAX = 1.3A. Boldface limits apply over operating junction temperature range of 0C T J 125C. TEST CONDITIONS Parameter Symbol VOUT VIN IOUT TEST LIMITS Min. Typ. Max. Units Output Voltage Line Regulation 3.15V V IN 3.465V 5mA I OUT I MAX 5mA I OUT I MAX 5mA I OUT I MAX IOUT = IMAX 1.755 1.800 1.845 3 20 10 40 V mV mV REG(LINE) 3.135V V IN 3.465V 3.3V Load Regulation REG(LOAD) Dropout Voltage (Note 6) Current Limit Min. Output Current for regulation ( V OUT 3% ) Temperature Stability RMS Output Noise (Note 7) VD IS IOMIN 3.3V 0.9 2.5 1.2 V A 0 mA TS VN RA IOUT = 5mA IOUT = IMAX 0.3 0.003 % %VOUT Ripple Rejection Ratio (Note 8) Transient Response Change of VOUT with step load change (Note 9) 3.3V 3.3V IOUT = 500mA 40 2.0 dB 10 (undershoot or overshoot of VOUT) 10 (undershoot or overshoot of VOUT) V OUT ---------------I OUT 1mA to IMAX t r 1S IMAX to 1mA % t f 1S Transient Response Change of VOUT with application of VIN (Note 9) V OUT ---------------V IN 0 to 1.8V Step Input t r 1S 10% to 90% 1mA I OUT I MAX 3.0 % 6 REV. 1.0.8 3/22/04 PRODUCT SPECIFICATION FAN1539/FAN1540 Electrical Characteristics--FAN1540D18X (Continued) Unless otherwise specified, VIN = 3.135V to 3.465V, TA= 25C. Boldface limits apply over operating junction temperature range of 0C T J 125C. TEST CONDITIONS Parameter Transient Response Short circuit Removal Response (Note 9) Symbol VIN 3.3V IOUT IOUT = short to IOUT = 10mA TEST LIMITS Min. Typ. 3.0 Max. Units % V OUT ---------------V IN @IOUT = short 10 (overshoot or undershoot of VO) 2.0 2.0 Quiescent Current Quiescent Current Thermal Shutdown Thermal Hysteresis IGND IGND TjSD THYST 3.3V 3.3V IOUT = 0mA 2mA I OUT I MAX 1.0 1.0 160 10 mA mA C C Notes: 6. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the nominal value measured at VIN = 3.3V. 7. Measured within 10Hz to 10kHz bandwidth. 8. Measured at DC, specified at 120 Hz. 9. CIN = 22F, COUT = 10F. Both capacitors are low ESR X7R type. Test Circuit VIN IN VOUT DUT GND OUT 10F CIN 22F COUT Notes: 1. Use low ESR capacitors. 2. CIN should be placed as close to VIN as possible. REV. 1.0.8 3/22/04 7 FAN1539/FAN1540 PRODUCT SPECIFICATION Typical Performance Characteristics--FAN1539MPX, FAN1540MPX, FAN1540MMPX, FAN1540DX Output Voltage vs. Temperature 3.310 1.3 Ground Pin Current vs. Temperature Quiescent Current (mA) 3.305 Output Voltage (V) 1.2 1.1 1.0 0.9 0.8 0.7 3.300 3.295 3.290 3.285 3.280 3.275 -50 0 50 100 150 VIN = 5V VIN = 5V = 10mA IOUT OUT = 5mA Typical I3.3V Device Typical 3.3V Device VIN = 5V IOUT = 10mA 0 50 100 150 Ambient Temperature (C) Ambient Temperature (C) Ground Pin Current vs. Input Voltage 1.20 Ground Pin Current vs. Output Current 1.07 1.06 1.05 1.04 1.03 1.02 1.01 1.00 VIN = 5V Quiescent Current (mA) 1.10 1.05 1.00 0.95 0.90 0.85 IOUT = 10mA Quiescent Current (mA) 1.15 4 5 6 7 8 9 10 0 200 400 600 800 1000 1200 1400 Input Voltage (V) Output Current (mA) Dropout Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 0.7 0.6 IOUT = 1.3A IOU T Output Voltage vs. Output Current 3.5 3.0 Dropout Voltage (V) Output Voltage (V) 2.5 2.0 1.5 1.0 0.5 0.0 VIN = 5V Tj = 25C = 1A IO UT = 0. 5A -50 0 50 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Ambient Temperature (C) Output Current (A) 8 REV. 1.0.8 3/22/04 PRODUCT SPECIFICATION FAN1539/FAN1540 Typical Performance Characteristics--FAN1539MPX, FAN1540MPX, FAN1540MMPX, FAN1540DX (Continued) Line Transient Response Output Voltage Output Voltage IOUT = IMAX Load Transient Response 3.300V (20mV/div) VIN = 5V (50mV/div) 3.300V CIN = 22F COUT = 10F (Ceramic Low ESR Capacitors) CIN = 22F COUT = 10F (Ceramic Low ESR Capacitors) Output Current (0.5A/div) Output Voltage tr = 1s tf = 1s Tj = 25C (2.5V/div) tr = 1s Tj = 25C Time (20s/div) Time (20s/div) Short Circuit Removal Response 100 90 Ripple Rejection (dB) Ripple Rejection vs. Frequency Output Voltage (50mV/div) 3.300V VIN = 5V 80 70 60 50 40 30 20 10 0 VIN = 5V IOUT = 10mA COUT = 10F (Low ESR) CIN = 22F COUT = 10F (Ceramic Low ESR Capacitors) Output Current (2.5A/div) ~3.3A 10mA tf j= 1s T = 25C 10 1 10 2 10 3 10 4 Frequency (Hz) 10 5 10 6 Time (40s/div) Output Spectral Noise Density vs. Frequency Output Spectral Noise Density (Equivalent Series Resistance) Typical Region of Stability ESR vs. Output Current* 1000 Region of Instability 100 (Vrms/rtHz) ESR (m) 10 VIN = 5V Region of Stability 1 CIN= 22F COUT = 10F Tj = 25C 0.1 0 Frequency (Hz) 200 400 600 800 1000 1200 1400 Output Current (mA) *Note: ESR Values measured at f=10kHz Note: Transient response tests require short lead lengths and low resistance connections at source and load. REV. 1.0.8 3/22/04 9 FAN1539/FAN1540 PRODUCT SPECIFICATION Typical Performance Characteristics--FAN1540D18X Output Voltage vs. Temperature 1.810 1.3 Ground Pin Current vs. Temperature Quiescent Current (mA) 1.805 Output Voltage (V) 1.2 1.1 1.0 0.9 0.8 0.7 0 50 1.800 1.795 1.790 1.785 1.780 1.775 VIN = 3.3V IOUT = 10mA Typical 1.8V Device VIN = 3.3V IOUT = 10mA 0 50 100 150 100 150 Ambient Temperature (C) Ambient Temperature (C) Ground Pin Current vs. Input Voltage 1.20 Ground Pin Current vs. Output Current 1.07 1.06 1.05 1.04 1.03 1.02 1.01 1.00 VIN = 3.3V Quiescent Current (mA) 1.10 1.05 1.00 0.95 0.90 0.85 IOUT = 10mA Quiescent Current (mA) 1.15 3 4 5 6 7 8 9 10 0 200 400 600 800 1000 1200 1400 Input Voltage (V) Output Current (mA) Dropout Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 0.7 IOUT = 1.3A IOU T = 1A Output Voltage vs. Output Current 1.9 1.8 1.7 VIN = 3.3V Dropout Voltage (V) Output Voltage (V) 1.6 1.5 Tj = 25C IO UT = 0. 5A 1.4 0.6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 0 50 100 Ambient Temperature (C) Output Current (A) 10 REV. 1.0.8 3/22/04 FAN1539/FAN1540 PRODUCT SPECIFICATION Applications Information General Circuit Description The FAN1539/FAN1540 is an advanced low dropout voltage regulator, specially designed for applications in portable computers, where high performance and low quiescent current is required. The device has an internal trimmed bandgap voltage reference and an internal output voltage sense divider. These two signals form the input to the error amplifier which regulates the output voltage. The FAN1539/FAN1540 has a complete set of internal protection circuitry including thermal shutdown, short circuit current limit and electrostatic discharge protection. Low ESR ceramic capacitors are needed for input as well as output pins to maintain the circuit stability. Short Circuit Current Limit The device has internal over-current limit and short circuit protection. Under over-current conditions the device current is determined by the current limit threshold. Once the device is released from short circuit conditions, the normal level of current limit is gradually re-established as the device output voltage reaches normal levels. Special circuitry has been added to ensure that recovery from short circuit current conditions does not lead to excessive overshoot of the output voltage -- a phenomenon often encountered in conventional regulators. Thermal Protection The FAN1539/FAN1540 is designed to supply at least 1A/ 1.3A output currents. Excessive output load at high input output voltage difference will cause the device temperature to increase and exceed maximum ratings due to power dissipation. During output overload conditions, when the die temperature exceeds the shutdown limit temperature of 160C, an onboard thermal protection will disable the output until the temperature drops approximately 15C below the limit, at which point the output is re-enabled. Thermal Characteristics The FAN1539/FAN1540 is designed to supply at least 1A/ 1.3A at the specified output voltage with an operating die (junction) temperature of up to 125C. Once the power dissipation and thermal resistance is known, the maximum junction temperature of the device can be calculated. While the power dissipation is calculated from known electrical parameters, the actual thermal resistance depends on the thermal characteristics of the chosen package and the surrounding PC board copper to which it is mounted. The power dissipation is equal to the product of the input-tooutput voltage differential and the output current plus the ground current multiplied by the input voltage, or: P D = ( V IN - V OUT )I OUT + V IN I GND The ground pin current, IGND can be found in the charts provided in the "Electrical Characteristics" section. The relationship describing the thermal behavior of the package is: T J ( max ) - T A P D ( max ) = ----------------------------- JA where TJ(max) is the maximum allowable junction temperature of the die, which is 150C, and TA is the ambient operating temperature. JA is dependent on the surrounding PC board layout and can be empirically obtained. While the JC (junction-to-case) of the 6-lead MLP package is specified at 8C /W, the JA for a minimum PWB footprint will be in substantially higher. This can be improved upon by providing a heat sink of surrounding copper ground on the PWB. Depending on the size of the copper area, and the thickness of the copper layer, the resulting JA can vary over a wide range. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing thermal resistance. Thermal simulations performed on a thermally optimized board layout indicate that JA as low as 20C /W can be achieved. For example, the heat contributed by the dissipation of other devices located nearby must be included in the design considerations. Overload conditions also need to be considered. It is possible for the device to enter a thermal cycling loop, in which the circuit enters a shutdown condition, cools, re-enables, and then again overheats and shuts down repeatedly due to a persistent fault condition. Capacitor ESR and Printed Circuit Board Layout The FAN1539/FAN1540 has been optimized to accommodate low ESR bypass capacitors down to 0 m. For best results it is important to place both input and output bypass capacitors as near to the input and output pins as possible. Use of X7R types such as Murata's GRM31CR70J106KA01B (10F) and GRM43ER71A226KE01B (22F) or similar component from TDK. The capacitors should connect directly to the ground plane. Use of ground plane on the top and the bottom side of the PCB is recommended. As many via as possible should be used to minimize ground plane resistance. 11 REV. 1.0.8 3/22/04 PRODUCT SPECIFICATION FAN1539/FAN1540 Mechanical Dimensions 5x6mm 8-Lead MLP REV. 1.0.8 3/22/04 12 PRODUCT SPECIFICATION FAN1539/FAN1540 Mechanical Dimensions 3x3mm 6-Lead MLP REV. 1.0.8 3/22/04 13 PRODUCT SPECIFICATION FAN1539/FAN1540 Mechanical Dimensions 3-Lead TO-252 REV. 1.0.8 3/22/04 14 FAN1539/FAN1540 PRODUCT SPECIFICATION Ordering Information Product Number FAN1540MMPX FAN1539MX FAN1540MX FAN1540DX FAN1540D18X Output Voltage 3.3V 3.3V 3.3V 3.3V 1.8V Package 5x6mm 8-Lead MLP in T&R 3x3mm 6-Lead MLP in T&R 3x3mm 6-Lead MLP in T&R 3-Lead TO-252 in T&R 3-Lead TO-252 in T&R Tape and Reel Information Quantity 3000 Reel Size 7" Width 8mm DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. www.fairchildsemi.com 2004 Fairchild Semiconductor Corporation REV. 1.0.8 3/22/04 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. |
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