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HFA1114
November 1996
850MHz Video Cable Driving Buffer
Description
The HFA1114 is a closed loop Buffer featuring user programmable gain and ultra high speed performance. Manufactured on Intersil' proprietary complementary bipolar UHF-1 process, the HFA1114 offers a wide -3dB bandwidth of 850MHz, very fast slew rate, excellent gain flatness, low distortion and high output current. A unique feature of the pinout allows the user to select a voltage gain of +1, -1, or +2, without the use of any external components. Gain selection is accomplished via connections to the inputs, as described in the "Application Information" section. The result is a more flexible product, fewer part types in inventory, and more efficient use of board space. Compatibility with existing op amp pinouts provides flexibility to upgrade low gain amplifiers, while decreasing component count. Unlike most buffers, the standard pinout provides an upgrade path should a higher closed loop gain be needed at a future date. For applications requiring a standard buffer pinout, please refer to the HFA1110 datasheet.
Features
* Access to Summing Node Allows Circuit Customization * User Programmable For Closed-Loop Gains of +1, -1 or +2 Without Use of External Resistors * Wide -3dB Bandwidth . . . . . . . . . . . . . . . . . . . . 850MHz * Very Fast Slew Rate . . . . . . . . . . . . . . . . . . . . 2400V/s * Fast Settling Time (0.1%) . . . . . . . . . . . . . . . . . . . 11ns * High Output Current . . . . . . . . . . . . . . . . . . . . . . . 60mA * Excellent Gain Accuracy . . . . . . . . . . . . . . . . . . 0.99V/V * Overdrive Recovery . . . . . . . . . . . . . . . . . . . . . . . <10ns * Standard Operational Amplifier Pinout
Applications
* RF/IF Processors * Driving Flash A/D Converters * High Speed Communications * Impedance Transformation * Line Driving * Video Switching and Routing * Radar Systems * Medical Imaging Systems
Ordering Information
PART NUMBER (BRAND) HFA1114IP HFA1114IB (H1114I) HFA11XXEVAL TEMP. RANGE (oC) -40 to 85 -40 to 85 PACKAGE 8 Ld PDIP 8 Ld SOIC PKG. NO. E8.3 M8.15
DIP Evaluation Board for High Speed Op Amps
Pinout
HFA1114 (PDIP, SOIC) TOP VIEW
Pin Descriptions
NAME NC
NC -IN +IN V1 300 2 3 4 300
PIN NUMBER 1, 8 2 3 4 5 6 7
DESCRIPTION No Connection Inverting Input Non-Inverting Input Negative Supply Summing Node Output Positive Supply
-IN
8 7 6 5 NC
+IN
-
V+ OUT SN
+
VSN OUT V+
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright (c) Intersil Corporation 1999
File Number
3151.3
5-1
HFA1114
Absolute Maximum Ratings
Voltage Between V+ and V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V DC Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSUPPLY Differential Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60mA
Thermal Information
Thermal Resistance (Typical, Note 1) JA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 Maximum Junction Temperature (Die). . . . . . . . . . . . . . . . . . . . 175oC Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
PARAMETER INPUT CHARACTERISTICS Output Offset Voltage
VSUPPLY = 5V, AV = +1, RL = 100, Unless Otherwise Specified TEST CONDITIONS TEMP. (oC) MIN TYP MAX UNITS
25 Full
39 35 25 240 2.5
8 10 45 9 37 25 50 300 2 2.8
25 35 40 65 360 -
mV mV V/oC dB dB nV/Hz pA/Hz A A k pF V
Output Offset Voltage Drift PSRR
Full 25 Full
Input Noise Voltage Non-Inverting Input Noise Current Non-Inverting Input Bias Current
100kHz 100kHz
25 25 25 Full
Non-Inverting Input Resistance Inverting Input Resistance Input Capacitance Input Common Mode Range TRANSFER CHARACTERISTICS Gain AV = +1, VIN = +2V Either Input
25 25 25 Full
25 Full
0.980 0.975 1.96 1.95 -
0.990 1.98 0.02
1.02 1.025 2.04 2.05 -
V/V V/V V/V V/V %
AV = +2, VIN = +1V
25 Full
DC Non-Linearity OUTPUT CHARACTERISTICS Output Voltage
AV = +2, 2V Full Scale
25
AV = -1
25 Full
3.0 2.5 50 35 -
3.3 3.0 60 50 0.3
-
V V mA mA
Output Current
AV = -1, RL = 50
25, 85 -40oC
Closed Loop Output Impedance
AV = +2, DC
25
5-2
HFA1114
Electrical Specifications
PARAMETER POWER SUPPLY CHARACTERISTICS Supply Voltage Range Supply Current Full 25 Full AC CHARACTERISTICS -3dB Bandwidth (VOUT = 0.2VP-P) AV = -1 AV = +1 AV = +2 Slew Rate (VOUT = 5VP-P) AV = -1 AV = +1 AV = +2 Full Power BW Gain Flatness Gain Flatness 2nd Harmonic Distortion 3rd Harmonic Distortion 3rd Order Intercept 1dB Compression Rise Time (VOUT = 0.5V Step) 5VP-P, AV = +2 To 30MHz, AV = +2 To 100MHz, AV = +2 50MHz, VOUT = 2VP-P 50MHz, VOUT = 2VP-P 100MHz, AV = +2 100MHz, AV = +2 AV = +2 AV = +1 Overshoot 0.1% Settling Time 0.05% Settling Time Overdrive Recovery Time Differential Gain AV = +1, 3.58MHz, RL = 150 AV = +2, 3.58MHz, RL = 150 Differential Phase AV = +1, 3.58MHz, RL = 150 AV = +2, 3.58MHz, RL = 150 VOUT = 0.5V Step, AV = +2 VOUT = 2V to 0V VOUT = 2V to 0V 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 800 850 550 2400 1500 1900 220 0.015 0.07 -53 -68 28 19 700 480 6 11 15 8.5 0.03 0.02 0.05 0.04 MHz MHz MHz V/s V/s V/s MHz dB dB dBc dBc dBm dBm ps ps % ns ns ns % % Degrees Degrees 4.5 21 5.5 26 33 V mA mA VSUPPLY = 5V, AV = +1, RL = 100, Unless Otherwise Specified (Continued) TEST CONDITIONS TEMP. (oC) MIN TYP MAX UNITS
5-3
HFA1114 Application Information
Closed Loop Gain Selection The HFA1114 features a novel design which allows the user to select from three closed loop gains, without any external components. The result is a more flexible product, fewer part types in inventory, and more efficient use of board space. This "buffer" operates in closed loop gains of -1, +1, or +2, and gain selection is accomplished via connections to the inputs. Applying the input signal to +IN and floating -IN selects a gain of +1, while grounding -IN selects a gain of +2. A gain of -1 is obtained by applying the input signal to -IN with +IN grounded. The table below summarizes these connections:
GAIN (ACL) -1 +1 +2 CONNECTIONS +INPUT (PIN 3) GND Input Input -INPUT (PIN 2) Input NC (Floating) GND
50 45 40 35 30 25 20 15 10 5 0 0
Figure 1 details starting points for the selection of this resistor. The points on the curve indicate the RS and CL combinations for the optimum bandwidth, stability, and settling time, but experimental fine tuning is recommended. Picking a point above or to the right of the curve yields an overdamped response, while points below or left of the curve indicate areas of underdamped performance. RS and CL form a low pass network at the output, thus limiting system bandwidth well below the amplifier bandwidth of 850MHz. By decreasing RS as CLincreases (as illustrated in the curves), the maximum bandwidth is obtained without sacrificing stability. Even so, bandwidth does decrease as you move to the right along the curve. For example, at AV = +1, RS = 50 , CL = 30pF, the overall bandwidth is limited to 300MHz, and bandwidth drops to 100MHz at AV = +1, RS = 5 , CL = 340pF.
The frequency response of this amplifier depends greatly on the amount of care taken in designing the PC board. The use of low inductance components such as chip resistors and chip capacitors is strongly recommended, while a solid ground plane is a must! Attention should be given to decoupling the power supplies. A large value (10F) tantalum in parallel with a small value (0.1F) chip capacitor works well in most cases. Terminated microstrip signal lines are recommended at the input and output of the device. Capacitance directly on the output must be minimized, or isolated as discussed in the next section. For unity gain applications, care must also be taken to minimize the capacitance to ground seen by the amplifier's inverting input. At higher frequencies this capacitance will tend to short the -INPUT to GND, resulting in a closed loop gain which increases with frequency. This will cause excessive high frequency peaking and potentially other problems as well. An example of a good high frequency layout is the Evaluation Board shown in Figure 2.
RS ()
PC Board Layout
AV = +1
AV = +2 40 80 120 160 200 240 280 320 LOAD CAPACITANCE (pF) 360 400
FIGURE 1. RECOMMENDED SERIES OUTPUT RESISTOR vs LOAD CAPACITANCE
Evaluation Board
The performance of the HFA1114 may be evaluated using the HFA11XX Evaluation Board, slightly modified as follows: 2. Remove the 500 feedback resistor (R2), and leave the connection open. 3. a. For AV = +1 evaluation, remove the 500 gain setting resistor (R1), and leave pin 2 floating. b. For AV = +2, replace the 500 gain setting resistor with a 0 resistor to GND. 4. Isolate Pin 5 from the stray board capacitance to minimize peaking and overshoot. The layout and modified schematic of the board are shown in Figure 2. To order evaluation boards (part number HFA11XXEVAL), please contact your local sales office.
Driving Capacitive Loads
Capacitive loads, such as an A/D input, or an improperly terminated transmission line will degrade the amplifier's phase margin resulting in frequency response peaking and possible oscillations. In most cases, the oscillation can be avoided by placing a resistor (RS) in series with the output prior to the capacitance.
(AV = +1) or 0 (AV = +2)
R1 50 IN 0.1F -5V GND 1 2 3 4 10F 8 7
VH 0.1F 50 6 5 OUT 10F +5V +IN
TOP LAYOUT
VH 1
BOTTOM LAYOUT
X
GND
VL
OUT V+ VL VGND
FIGURE 2. EVALUATION BOARD SCHEMATIC AND LAYOUT
5-4
HFA1114 Die Characteristics
DIE DIMENSIONS: 63 mils x 44 mils x 19 mils 1600m x 1130m x 483m METALLIZATION: Type: Metal 1: AICu(2%)/TiW Thickness: Metal 1: 8kA 0.4kA Type: Metal 2: AICu(2%) Thickness: Metal 2: 16kA 0.8kA PASSIVATION: Type: Nitride Thickness: 4kA 0.5kA TRANSISTOR COUNT: 52 SUBSTRATE POTENTIAL (Powered Up): Floating (Recommend Connection to V-)
Metallization Mask Layout
HFA1114
NC
+IN
V-
NC
-IN
SN
NC
V+
OUT
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
5-5

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