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TPS850
TOSHIBA Photo IC Silicon Epitaxial Planar
TPS850
Mobile Phones, PHS, Pagers Notebook PCs, PDAs Video Cameras, Digital Still Cameras Other Equipment Requiring Luminosity Adjustment
The TPS850 is a linear-output photo-IC which incorporates a photodiode and a current amp circuit in a single chip. This photo-IC is current output type, so can set up output voltage freely by arbitrary load resistance. * * * * * * High sensitivity: IL = 230 A @EV = 100 lx (typ.) Using the fluorescent light Little fluctuation in light current : Width range = x1 to x1.6 (typ. 25%) Output linearity of illuminance is excellent Open-emitter output Compact and light surface-mount package Pb-free TOSHIBA Weight: 0.017 g (typ.)
Maximum Ratings (Ta = 25C)
Characteristics Supply voltage Output voltage Light current Permissible power dissipation Operating temperature range Storage temperature range Soldering temperature range (10 s) (Note 1) Symbol VCC VOUT IL P Topr Tstg Tsol Rating -0.5 to 7 < VCC = 10 70 -30 to 85 -40 to 100 260 Unit V V mA mW C C C
Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling Precautions.
Recommended Operating Conditions
Characteristics Supply voltage Symbol VCC Min 2.2 Typ. 3/4 Max 5.5 Unit V
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TPS850
Electrical and Optical Characteristics (Ta = 25C)
Characteristics Supply current Light current (1) Light current (2) Light current (3) Symbol ICC IL (1) IL (2) IL (3)
IL (1) IL (3)
Test Condition VCC = 3 V, EV = 1000 lx, RL = 250 W (Note 2) VCC = 3 V, EV = 100 lx (Note 2, 4) VCC = 3 V, EV = 10 lx (Note 3, 4) VCC = 3 V, EV = 100 lx (Note 3, 4)
Min
Typ. 4 300 23 230
Max 3/4
Unit mA
3/4 3/4
18 180
3/4
30 300 mA
Light current ratio Dark current Saturation output voltage Peak sensitivity wavelength Rise time Switching time Fall time
3/4
VCC = 3.3 V, EV = 0 VCC = 3 V, RL = 75 kW, EV = 100 lx (Note 3) 3/4 VCC = 3 V, RL = 5 kW, (Note 5)
1.3 3/4 2.35 640 0.2 0.35
1.7 0.5 mA V nm ms 2
ILEAK Vo lp tr tf
3/4
2.2 3/4
3/4
3/4 1
3/4 3/4
Note 2: CIE standard A light source is used (color temperature = 2856K, approximated incandescence light). Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process. Note 4: Light current measurement circuit
VCC Light source TPS850 A IL OUT
Note 5: Rise time/fall time measurement method
Pulse drive White LED TPS850
VCC
IF
OUT RL
1.5 V
90%
VOUT 10% GND tr tf
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TPS850
Package Dimensions
Weight: 0.017 g (typ.)
Block Diagram
3 VCC Current amp 4 OUT 1 GND 2 GND
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TPS850
Handling Precautions
At power-on in darkness, the internal circuit takes about 50 ms to stabilize. During this period the output signal is unstable and may change. Please take this into account.
Moisture-Proof Packing
(1) (2) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel. Since the optical characteristics of the device can be affected during soldering by vaporization resulting from prior absorption of moisture and they should therefore be stored under the following conditions: Temperature: 5C to 30C, Relative humidity: 60% (max), Time: 168 h Baking is required if the devices have been store unopened for more than six months or if the aluminum envelope has been opened for more than 168 h. These devices are packed on tapes; hence, please avoid baking at high temperature. Recommended baking conditions: 60C for 12 h or longer
(3)
Mounting Precautions
(1) (2) (3) Do not apply stress to the resin at high temperature. The resin part is easily scratched, so avoid friction with hard materials. When installing the assembly board in equipment, ensure that this product does not come into contact with other components.
Mounting Methods
(1) Reflow soldering * Package surface temperature: 260C (max) * Please perform reflow soldering using the following reference temperature profile. Perform reflow soldering no more than twice.
Temperature (C) (R)
260C max 230C 190C 180C
Preheating part 60 s to 120 s
30 s to 50 s Heating part
Time (s) (R)
* *
Please perform the first reflow soldering within 168 h after opening the package with reference to the above temperature profile. Second reflow soldering In case of second reflow soldering, it should be performed within 168 h after first reflow under the above conditions. Storage conditions before second reflow soldering: 30C, 60% RH or lower
* *
Do not perform flow soldering. Make any necessary soldering correction manually. (do not do this more than once for any given pin.) Temperature: no more than 350C (25 W for soldering iron) Time: within 5 s
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TPS850
(2) Recommended soldering pattern
1.6
1.3
1.6
Unit: mm
(3)
Cleaning conditions When cleaning is required after soldering Chemicals: AK225 alcohol Temperature and time: 50C 30 s or : 30C 3 mins Ultrasonic cleaning: 300 W or less
Packing Specification
(1) Packing quantity
Reel (minimum packing quantity) Carton
0.95
0.6
0.95
3000 devices 5 reels (15000 devices)
(2)
Packing format An aluminum envelope containing silica gel and reels is deaerated and sealed. Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them. * Carton specification
Label
Carton dimensions (W) 81 mm (L) 280 mm (H) 280 mm
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TPS850
Tape Packing Specifications
(1) Reel dimensions
11.4 1 9 0.3
+0 f180 - 4 f21 0.3 f13 0.5
2 0.5
Label
(2)
Tape dimensions
4.0 0.1 + 0.1 f1.5 0 2.0 0.05 A 1.75 0.1 0.2 0.05 max 6 max 6
f60 3.5 0.1 8.0 0.2
B
B'
4.0 0.1
(2.75)
3.6 0.1
Device Orientation A' Feed direction
1.3 0.1 A-A'
2.8 0.1
max 6
max 6
B-B'
(3)
Packing quantity: 3000/reel
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TPS850
P - Ta
80 70 10
ILEAK - Ta
VCC = 3 V Please refer to Figure 2.
(typ.)
P (mW)
(mA)
60 50 40 30 20 10 0 0
1
Power dissipation
Dark current ILEAK
0.1
0.01
20
40
60
80
100
0.001 20
40
60
80
100
Ambient temperature Ta (C)
Ambient temperature Ta (C)
IL - EV
10000
(typ.)
1.4
Relative IL - Ta
VCC = 3 V Please refer to Figure 1. Fluorescent light A light source
(typ.)
IL (mA)
1000
1.2
Light current
100
Relative light current
1.0
10
Ta = 25C VCC = 3 V Please refer to Figure 1. A light source Fluorescent light 10 100 1000 10000
0.8
1 1
0.6 -40
-20
0
20
40
60
80
100
Illuminance EV
(lx)
Ambient temperature Ta (C)
Relative IL - VCC
1.6
(typ.)
10
Vo - EV
Ta = 25C VCC = 3 V Please refer to Figure 4.
(typ.)
1 1.2
Relative light current
Output voltage Vo
(V)
0.1 0.01
0.8
0.4
0.001 Ta = 25C Please refer to Figure 1. 3 4 5 6 7
Fluorescent light Fluorescent light A light source A light source 10 100 1000
RL = 250 W RL = 5 kW RL = 250 W RL = 5 kW 10000
0 2
0.0001 1
Supply voltage VCC
(V)
Illuminance EV
(lx)
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TPS850
ICC - EV
10 3
(typ.)
1.40
Relative ICC - Ta
VCC = 3 V Using the Fluorescent light RL = 1 kW Please refer to Figure 3.
(typ.)
(mA)
Relative consumption current
1 0.3 0.1 0.03 0.01 0.003 0.001 1 Ta = 25C VCC = 3 V Using the A light source Please refer to Figure 3. RL = 250 W RL = 1000 W RL = 5000 W 10 100 1000 10000
1.20
Consumption current
ICC
1.00
0.80
0.60 -40
-20
0
20
40
60
80
100
Illuminance EV
(lx)
Ambient temperature Ta (C)
Switching characteristics (Non-saturating operation)
1000 Ta = 25C VCC = 3 V VOUT = 1.5 V Using the White LED Please refer to Figure 5.
(typ.)
1000
Switching characteristics (Saturating operation)
Ta = 25C VCC = 3 V VOUT > 2 V = Using the White LED Please refer to Figure 5.
(typ.)
300
300
100
100 tf tf
30
(ms)
(ms)
td
30 td ts 10
Switching time
tr 10
Switching time
3
3
tr
1
1
ts 0.3 0.3
0.1 0.1
0.3
1
3
10
0.1 0.1
0.3
1
3
10
Load resistance RL
(kW)
Load resistance RL
(kW)
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Spectral response
1 Ta = 25C 0.8
(typ.)
Radiation pattern
(typ.)
Ta = 25C Luminosity angle
20 30 40 10 0 10
Relative sensitivity
0.6
20 30 40 50 60 70 80 90 1.0
0.4 60 0.2 70 80 0 200 90
50
400
600
800
1000
1200
0
0.2
0.4
0.6
0.8
Wavelength l
(nm)
Relative sensitivity
Measurement Circuits
VCC Light TPS850 A IL OUT TPS850 A VCC ILEAK OUT
Figure 1 Light current measurement circuit
Figure 2 Dark current measurement circuit
Icc VCC A Light TPS850 RL VCC OUT Light TPS850 RL V Vo
Figure 3 Consumption current measurement circuit
Figure 4 Output voltage measurement circuit
IF Pulse drive White LED TPS850 RL OUT VOUT 10% GND tr tf td VCC 1.5 V ts 90%
Figure 5 Switching measurement circuit and waveform
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TPS850
RESTRICTIONS ON PRODUCT USE
000707EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice.
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