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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 1998.07.01 Revised Date : 1999.08.01 Page No. : 1/5 HU603AL N-Channel Logic Level Enhancement Mode Field Effect Transistor Description This very high density process has been especially tailored to minimize onstate resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as DC/DC converters and other battery powered circuits where fast switching, low inline power loss, and resistance to transients are needed. Absolute Maximum Ratings (Ta=25C) * Maximum Temperatures Operating and Storage Temperature ................................................................................ -65 ~ +175 C * Maximum Power Dissipation Total Power Dissipation at Tc=25C ............................................................................................... 60 W Derate Above 25C ................................................................................................................ 0.4 W / C * Maximum Voltages and Currents Drain-Source Voltage ...................................................................................................................... 30 V Gate-Source Voltage -Continuous................................................................................................. 20 V Drain Current -Continuous .............................................................................................................. 30 A Drain Current -Pulsed ................................................................................................................... 100 A Thermal Resistance, Junction-to-Case .................................................................................. 2.5 C / W Thermal Resistance, Junction-to-Ambient............................................................................ 62.5 C / W Electrical Characteristics * Off Characteristics Symbol Parameter BVDSS Drain-Source Breakdown Voltage IDSS Zero Gate Voltage Drain Current +IGSS Gate-Body Leakage ,Forward -IGSS Gate-Body Leakage ,Reverse * On Characteristics VGS(TH) Gate Threshold Voltage VDS=VGS, ID=250uA VDS=VGS, ID=10mA VGS=10V, ID=25A VGS=4.5V, ID=10A VGS=10V, VDS=10V VGS=4.5V, VDS=10V VDS=10V, ID=25A 1.1 1.4 60 15 3 3 0.018 0.022 0.029 0.040 26 1100 600 180 V A S pF pF pF Condition VGS=0V, ID=250uA VDS=30V, VGS=0V VGS=20V, VDS=0V VGS=-20V, VDS=0V Min 30 Typ Max Unit V 10 uA 100 nA -100 nA RDS(on) Static Drain-Source On-Resistance IDS(on) gFS On-State Drain Current Forward Transconductance * Dynamic Characteristic Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance VDS=15V, VGS=0V f=1.0Mhz HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. * Switching Characteristics Symbol Parameter Turn-On Delay Time T(on) Turn-On Rise Time Turn-Off Delay Time T(off) Turn-Off Fall Time Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain Charge Condition VDS=15V, ID=25A VGS=10V, RGEN=24 VDS=10V, ID=25A, VGS=10V Spec. No. : Preliminary Data Issued Date : 1998.07.01 Revised Date : 1999.08.01 Page No. : 2/5 Min - Typ - Max Unit 30 ns 110 ns 150 ns 130 ns 45 nC 10 nC 10 nC * Drain-Source Diode Characteristics And Maximum Ratings VSD Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage VGS=0V, IS=25A - - 25 1.3 A V Characteristics Curve On-Region Characteristic 100 VGS=10V 8V 80 3.0 7V 6V VGS= 4V On-Resistance Variation With Gate Voltage & Drain Current Normalized Drain-Source OnResistance Drain-Source Current (A) 2.5 4.5V 5V 5V 60 4.5V 40 2.0 6V 1.5 7V 8V 1.0 10V 4V 20 3V 0 0 1 2 3 4 5 0.5 0 20 40 60 80 Drain-Source Voltage (V) Drain Current (A) On Resistance Variation & Temperature 1.6 On-Resistance Variation & Drain Current & Temperature 2.5 Normalized Drain-Source On-Resistance 1.5 1.3 1.2 1.1 1.0 0.9 0.8 25 50 ID=25A VGS=10V Normalized Drain-Source OnResistance 1.4 VGS=10V 2 TJ=125C 1.5 TJ=25C 1 0.5 75 100 125 150 0 20 40 60 80 Junction Temperature (C) Drain Current (A) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 1998.07.01 Revised Date : 1999.08.01 Page No. : 3/5 Drain Current Variation & Gate Voltage & Temperature 50 TJ= 25C 40 TJ=125C 0.05 0.06 Sub-Threshold Drain Current Variation & Gate Voltage & Temperature TJ=125C TJ=25C Drain Current (A) 30 Drain Current (A) 0.04 0.03 20 0.02 10 0.01 0 0 1 2 3 4 5 6 0 0.5 1.0 1.5 2.0 2.5 Gate-Source Voltage (V) Gate-Source Voltage (V) Gate Threshold Variation & Temperature 1.8 1.7 2000 Capacitance Characteristics Gate-Source Threshold Voltage (V) 1.6 1500 1.4 ID=1mA 1.3 1.2 ID= 250uA 1.1 Capacitance (pF) 1.5 ID=10mA Ciss 1000 Coss 500 1 Crss 0.9 0.8 25 50 75 100 125 150 0 0 5 10 15 20 25 30 Junction Temperature (C) Drain-Source Voltage (V) Breakdown Voltage Variation & Temperature 1.1 100 Body Diode Forward Voltage Variation & Current & Temperature Normalized Drain-Source Breakdown Voltage 1.08 TJ=125C Reverse Drain Current (A) 1.06 TJ= 25C 10 1.04 1.02 1 1 0.98 25 50 75 100 125 150 0.1 0.2 0.4 0.6 0.8 1 1.2 Junction Temperature (C) Body Diode Forward Voltage (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 1998.07.01 Revised Date : 1999.08.01 Page No. : 4/5 Transductance Variation & Drain Current & Temperature 30 TJ=25C Maximum Safe Operating Area 100 Drain-Source Current (A) 25 1us TJ=125C Rds(on) Line 1ms Transconductance (S) 20 15 10 10ms 100ms VGS=20V Single Pulse TC=25C 10 5 Dc 0 0 10 20 30 40 50 1 0.1 1 10 100 Drain Current (A) Drain-Source Voltage (V) Trancient Thermal Response Curve 1 Normalized Effective Transient Thermal Resistance 0.5 0.2 0.1 0.1 0.05 0.02 0.01 Single Pulse 0.01 0.1 1 10 100 1000 RJC(t) = r(t) * RJC(t) RJC =2.5 C / W P(pk) t1 t2 TJ-TC=P* RJC(t) Duty Cycle,D=t1/t2 Time (ms) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-263 Dimension Marking : A 2 C E Spec. No. : Preliminary Data Issued Date : 1998.07.01 Revised Date : 1999.08.01 Page No. : 5/5 1 F HSMC Logo Part Number Date Code Product Series Rank B D 1 I J K L 2 3 G Style : Pin 1.Gate 2.Drain 3.Source 2 3 H 3-Lead TO-263 Plastic Surface Mounted Package HSMC Package Code : U *:Typical DIM A B C D E F G H Inches Min. Max. 0.3800 0.4050 0.3300 0.3700 0.0550 0.5750 0.6250 0.1600 0.1900 0.0450 0.0550 0.0900 0.1100 0.0180 0.0290 Millimeters Min. Max. 9.65 10.29 8.38 9.40 1.40 14.61 15.88 4.06 4.83 1.14 1.40 2.29 2.79 0.46 0.74 DIM I J K L 1 2 3 Inches Min. Max. 0.0500 0.0700 *0.1000 0.0450 0.0550 0.0200 0.0390 - Millimeters Min. Max. 1.27 1.78 *2.54 1.14 1.40 0.51 0.99 6 8 6 8 0 5 Notes : 1.Dimension and tolerance based on our Spec. dated Jan. 09,1998. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification |
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