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PRELIMINARY TECHNICAL DATA = 16-/32- Channel, Serially Controlled 4 1.8 V to 5.5 V, 2.5 V, Analog Multiplexers ADG725/ADG731 Preliminary Technical Data FUNCTIONAL BLOCK DIAGRAMS ADG731 S1 FEATURES 3-Wire SPI Serial Interface 1.8 V to 5.5 V Single Supply 2.5 V Dual Supply Operation 4 On Resistance 0.5 On Resistance Flatness 7mm x 7mm 48 lead Chip Scale Package (CSP) or 48 lead TQFP package. Rail to Rail Operation Power On Reset Fast Switching Times Single 32 to 1 Channel Multiplexer Dual/Differential 16 to 1 Channel Multiplexer TTL/CMOS Compatible Inputs For Functionally Equivalent devices with Parallel Interface See ADG726/ADG732 APPLICATIONS Optical Applications Data Acquisition Systems Communication Systems Relay replacement Audio and Video Switching Battery Powered Systems Medical Instrumentation Automatic Test Equipment GENERAL DESCRIPTION ADG725 S1A DA S16A D S1B DB S32 INPUT SHIFT REGISTER S16B INPUT SHIFT REGISTER SCLK DIN SYNC SCLK DIN SYNC The ADG725/ADG731 are monolithic CMOS 32 channel/dual 16 channel analog multiplexers with a serially controlled 3-wire interface. The ADG732 switches one of thirty-two inputs (S1-S32) to a common output, D. The ADG725 can be configured as a dual mux switching one of sixteen inputs to one output or a differential mux switching one of sixteen inputs to a differential output. These mulitplexers utilize a 3-wire serial interface that is compatible with SPITM, QSPITM, MICROWIRETM and some DSP interface standards. On power-up, the internal shift register contains all zeros and all switch are in the OFF state. These multiplexers are designed on an enhanced submicron process that provides low power dissipation yet gives high switching speed, very low on resistance and leakage currents. They operate from single supply of 1.8V to 5.5V and 2.5 V dual supply, making them ideally suited to a variety of applications. On resistance is in the region of a few Ohms and is closely matched between switches and very flat over the full signal range. These parts can operate equally well as either Multiplexers or De-Multiplexers REV. PrD May 2002 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. and have an input signal range which extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All channels exhibit break before make switching action preventing momentary shorting when switching channels. They are available in either 48 lead CSP or TQFP package. PRODUCT HIGHLIGHTS 1. 2. 3-Wire Serial Interface. +1.8 V to +5.5 V Single or 2.5 V Dual Supply operation. These parts are specified and guaranteed with +5 V 10%, +3 V 10% single supply and 2.5 V 10% dual supply rails. On Resistance of 4 . Guaranteed Break-Before-Make Switching Action. 7mm x 7mm 48 lead Chip Scale Package (CSP) or 48 lead TQFP package. 3. 4. 5. One Technology Way, P Box 9106, Norwood, MA 02062-9106, U.S.A. .O. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 Analog Devices, Inc., 2002 PRELIMINARY TECHNICAL DATA ADG725/ADG731-SPECIFICATIONS1(V Parameter ANALOG SWITCH Analog Signal Range On-Resistance (RON) On-Resistance Match Between Channels (RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) ADG725 ADG731 Channel ON Leakage ID, IS (ON) ADG725 ADG726 DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS tTRANSITION 2 DD = 5V 10%, VSS = 0V, GND = 0 V, unless otherwise noted) B Version -40C +25oC to +85C 0 V to VDD 4 5.5 6 0.3 0.8 1 0.01 0.25 0.05 0.5 1 0.05 0.5 1 Units V Test Conditions/Comments 0.5 typ max typ max typ max typ max typ max max typ max max VS = 0 V to VDD, IDS = 10 mA; Test Circuit 1 VS = 0 V to VDD , IDS = 10 mA VS = 0 V to VDD, IDS = 10 mA VDD = 5.5 V VD = 4.5 V/1 V, VS = 1 V/4.5 V; Test Circuit 2 VD = 4.5 V/1 V, VS = 1 V/4.5 V; Test Circuit 3 VD = VS = 1 V, or 4.5V; Test Circuit 4 0.5 2.5 5 2.5 5 2.4 0.8 nA nA nA nA nA nA nA nA V min V max A typ A max pF typ ns typ ns max ns typ ns min pC typ dB typ dB typ VIN = VINL or VINH 0.005 0.1 5 40 60 30 1 5 -60 -60 Break-Before-Make Time Delay, tD Charge Injection Off Isolation Channel to Channel Crosstalk -3 dB Bandwidth ADG725 ADG731 C S (OFF) C D (OFF) ADG725 ADG731 CD, CS (ON) ADG725 ADG731 POWER REQUIREMENTS IDD RL = 300 , CL = 35 pF,Test Circuit 5; VS1 = 3 V/0 V, VS32 = 0 V/3V RL = 300 , CL = 35 pF; VS = 3 V, Test Circuit 6 VS = 0 V, RS = 0 , CL = 1 nF; Test Circuit 7 RL = 50 , CL = 5 pF, f = 100 kHz; Test Circuit 8 RL = 50 , CL = 5 pF, f = 100 kHz; Test Circuit 9 RL = 50 , CL = 5 pF, Test Circuit 10 f = 1 MHz f = 1 MHz f = 1 MHz f = 1 MHz f = 1 MHz VDD = +5.5 V Digital Inputs = 0 V or +5.5 V 34 18 13 180 360 200 400 10 20 MHz typ MHz typ pF typ pF typ pF typ pF typ pF typ A typ A max NOTES 1 Temperature range is as follows: B Version: -40C to +85C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. -2- REV. PrD PRELIMINARY TECHNICAL DATA SPECIFICATIONS Parameter ANALOG SWITCH Analog Signal Range On-Resistance (R ON) 1(VDD = 3V 10%, VSS = 0V, GND = 0 V, unless otherwise noted) B Version -40C +25oC to +85C 0 V to VDD 7 11 12 0.4 1 3 Units V ADG725/ADG731 Test Conditions/Comments On-Resistance Match Between Channels (RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage I S (OFF) Drain OFF Leakage ID (OFF) ADG725 ADG731 Channel ON Leakage ID, IS (ON) ADG725 ADG731 DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH C IN, Digital Input Capacitance DYNAMIC CHARACTERISTICS tTRANSITION 2 typ max typ max max typ max typ max max typ max max VS = 0 V to VDD, IDS = 10 mA; Test Circuit 1 VS = 0 V to VDD , IDS = 10 mA VS = 0 V to VDD, IDS = 10 mA VDD = 3.3 V VS = 3 V/1 V, VD = 1 V/3 V; Test Circuit 2 VS = 1 V/3 V, VD = 3 V/1 V; Test Circuit 3 VS = VD = +1 V or +3 V; Test Circuit 4 0.01 0.25 0.05 0.5 1 0.05 0.5 1 0.5 2.5 5 2.5 5 2.0 0.8 nA nA nA nA nA nA nA nA V min V max A typ A max pF typ ns typ ns max ns typ ns min pC typ dB typ dB typ VIN = VINL or VINH 0.005 0.1 5 45 75 30 1 5 -60 -60 Break-Before-Make Time Delay, t D Charge Injection Off Isolation Channel to Channel Crosstalk -3 dB Bandwidth ADG725 ADG731 C S (OFF) C D (OFF) ADG725 ADG731 CD, CS (ON) ADG725 ADG731 POWER REQUIREMENTS IDD RL = 300 , CL = 35 pF Test Circuit 5 VS1 = 2 V/0 V, VS32 = 0 V/2 V RL = 300 , CL = 35 pF; VS = 2 V, Test Circuit 6 VS = 0 V, RS = 0 , CL = 1 nF; Test Circuit 7 RL = 50 , CL = 5 pF, f = 1 MHz; Test Circuit 8 RL = 50 , CL = 5 pF, f = 1 MHz; Test Circuit 9 RL = 50 , CL = 5 pF, Test Circuit 10 f = 1 MHz f = 1 MHz f = 1 MHz f = 1 MHz f = 1 MHz VDD = +3.3 V Digital Inputs = 0 V or +3.3 V 34 18 13 180 360 200 400 10 20 MHz typ MHz typ pF typ pF typ pF typ pF typ pF typ A typ A max NOTES 1 Temperature ranges are as follows: B Version: -40C to +85C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. REV. PrD -3- PRELIMINARY TECHNICAL DATA ADG725/ADG731-SPECIFICATIONS1 Dual Supply (V = +2.5 V 10%, V = -2.5 V 10%, GND = 0 V, unless otherwise noted) DD SS Parameter ANALOG SWITCH Analog Signal Range On-Resistance (R ON) On-Resistance Match Between Channels (RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage I S (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) B Version -40C +25oC to +85C VSS to VDD 4 5.5 6 0.3 0.8 1 0.01 0.25 0.05 0.5 1 0.01 0.5 1 Units V Test Conditions/Comments 0.5 typ max typ max typ max typ max typ max max typ max max VS = VSS to VDD, IDS = 10 mA; Test Circuit 1 VS = VSS to VDD, IDS = 10 mA VS = VSS to VDD, IDS = 10 mA VDD = +2.75 V, VSS = -2.75 V VS = +2.25 V/-1.25 V, VD = -1.25 V/+2.25 V; Test Circuit 2 VS = +2.25 V/-1.25 V, VD = -1.25 V/+2.25 V; Test Circuit 3 VS = VD = +2.25 V/-1.25 V, Test Circuit 4 0.5 2.5 5 2.5 5 1.7 0.7 nA nA nA nA nA nA nA nA DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH C IN, Digital Input Capacitance DYNAMIC CHARACTERISTICS tTRANSITION 2 V min V max A typ A max pF typ ns typ ns max ns typ ns min pC typ dB typ dB typ VIN = VINL or VINH 0.005 0.1 5 40 60 15 1 8 -60 -60 Break-Before-Make Time Delay, t D Charge Injection Off Isolation Channel to Channel Crosstalk -3 dB Bandwidth ADG725 ADG731 C S (OFF) C D (OFF) ADG725 ADG731 CD, CS (ON) ADG725 ADG731 POWER REQUIREMENTS IDD ISS RL = 300 , CL = 35 pF Test Circuit 5 VS1 = 1.5 V/0 V,VS32 = 0 V/1.5 V RL = 300 , CL = 35 pF; VS = 1.5 V, Test Circuit 6 VS = 0 V, RS = 0 , CL = 1 nF; Test 7 RL = 50 , CL = 5 pF, f = 1 MHz; Test Circuit 8 RL = 50 , CL = 5 pF, f = 1 MHz; Test Circuit 9 RL = 50 , CL = 5 pF, Test Circuit 10 34 18 13 180 360 200 400 10 20 10 20 MHz typ MHz typ pF typ pF typ pF typ pF typ pF typ A A A A typ max typ max f = 1 MHz f = 1 MHz f = 1 MHz f = 1 MHz VDD = +2.75 V Digital Inputs = 0 V or +2.75 V VSS = -2.75 V Digital Inputs = 0 V or +2.75 V NOTES 1 Temperature range is as follows: B Version: -40C to +85C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. -4- REV. PrD PRELIMINARY TECHNICAL DATA ADG725/ADG731 TIMING CHARACTERISTICS1,2 Parameter t1 t2 t3 t4 t5 t6 t7 t8 Limit at TMIN, TMAX 33 13 13 13 40 5 4.5 33 Units ns ns ns ns ns ns ns ns min min min min min min min min Conditions/Comments SCLK Cycle time SCLK High Time SCLK Low Time SYNC to SCLK falling edge setup time Minimum SYNC low time Data Setup Time Data Hold Time Minimum SYNC high time NOTES 1 See Figure 1. 2 All input signals are specified with tr =tf = 5ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. Specifications subject to change without notice. t1 SCLK t8 SYNC t2 t4 t5 t6 DIN DB7 t7 DB0 t3 Figure 1. 3-Wire Serial Interface Timing Diagram. DB7 (MSB) EN CSA CSB X A3 A2 DB0 (LSB) A1 A0 DB7 (MSB) EN CS X A4 A3 A2 DB0 (LSB) A1 A0 DATA BITS DATA BITS Figure 2. ADG725 Input Shift Register Contents Figure 3. ADG731 Input Shift Register Contents REV. PrD -5- PRELIMINARY TECHNICAL DATA ADG725/ADG731 ABSOLUTE MAXIMUM RATINGS 1 (TA = +25C unless otherwise noted) VDD to VSS VDD to GND VSS to GND Analog Inputs2 +7 V -0.3 V to +7 V +0.3 V to -7 V VSS - 0.3 V to VDD +0.3 Vor 30 mA, Whichever Occurs First Digital Inputs 2 -0.3V to VDD +0.3 V or 30 mA, Whichever Occurs First Peak Current, S or D 60mA (Pulsed at 1 ms, 10% Duty Cycle max) Continuous Current, S or D 30mA Operating Temperature Range Industrial (B Version) -40C to +85C Storage Temperature Range -65C to +150C Junction Temperature +150C TBDC/W 48 lead CSP JA Thermal Impedance 48 lead TQFP JA Thermal Impedance TBDC/W Lead Temperature, Soldering (10seconds) 300C IR Reflow, Peak Temperature +220C NOTES 1 Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Overvoltages at SCLK, SYNC, DIN, RS, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG725/ADG731 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ORDERING GUIDE Model ADG725BCP ADG725BSU ADG731BCP ADG731BSU Temperature Range -40 -40 -40 -40 o o Package Description Chip Thin Chip Thin Scale Quad Scale Quad Package (CSP) Flatpack Package (CSP) Flatpack Package Option CP-48 SU-48 CP-48 SU-48 C C o C o C to to to to +85 +85 +85 +85 o o C C o C o C -6- REV. PrD PRELIMINARY TECHNICAL DATA ADG725/ADG731 PIN FUNCTION DESCRIPTION ADG725 ADG731 Mnemonic Function SCLK Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. These devices can accomodate serial input rates of up to 30MHz. Active low control input that clears the input register and turns all switches to the OFF condition. Serial Data Input. Data is clocked into the 8-bit input register on the falling edge of the serial clock input. Source. May be an input or output. Drain. May be an input or output. Power Supply Input. These parts can be operated from a supply of +1.8V to +5.5V and dual supply of +/-2.5V. Ground reference. Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low, it powers on the SCLK and DIN buffers and the input shift register is enabled. An 8-bit counter is also enabled. Data is transferred on the falling edges of the following clocks. After 8 falling clock edges, switch conditions are automaticaly updated. SYNC may be used to frame the signal, or just pulled low for a short period of time to enable the counter and input buffers. PIN CONFIGURATIONS CSP & TQFP RS DIN SXX DX VDD GND SYNC S13A S14A S15A S16A S16A S15B S14B S13 S14 S15 S16 S32 S31 S30 S29 NC NC NC D 48 47 46 45 44 43 42 41 40 39 38 37 48 47 46 45 44 43 42 41 40 39 38 37 36 S28 35 S27 34 S26 33 S25 32 S24 31 S23 30 S22 29 S21 28 S20 27 S19 26 S18 25 S17 S12 1 S11 2 S10 3 S9 4 S8 5 S7 6 S6 7 S5 8 S4 9 S3 10 S2 11 S1 12 NC = NO CONNECT S12A 1 S11A 2 S10A 3 S9A 4 S8A 5 S7A 6 S6A 7 S5A 8 S4A 9 S3A 10 S2A 11 S1A 12 NC = NO CONNECT S13B 36 S12B 35 S11B 34 S10B 33 S9B 32 S8B 31 S7B 30 S6B 29 S5B 28 S4B 27 S3B 26 S2B 25 S1B NC DA DIN NC PIN 1 IDENTIFIER PIN 1 IDENTIFIER ADG731 TOP VIEW (Not to Scale) ADG725 TOP VIEW (Not to Scale) 13 14 15 16 17 18 19 20 21 22 23 24 13 14 15 16 17 18 19 20 21 22 23 24 DB GND VDD VDD NC NC NC NC NC SYNC SYNC REV. PrD SCLK -7- SCLK DIN GND VDD VDD VSS VSS NC NC NC NC NC PRELIMINARY TECHNICAL DATA ADG725/ADG731 Table 1. ADG725 Truth Table A3 X X 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 A2 X X 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 A1 X X 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 A0 X X 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 EN X 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 CSA CSB 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Switch Condition Retains previous switch condition All Switches OFF S1A - DA, S1B - DB S2A - DA, S2B - DB S3A - DA, S3B - DB S4A - DA, S4B - DB S5A - DA, S5B - DB S6A - DA, S6B - DB S7A - DA, S7B - DB S8A - DA, S8B - DB S9A - DA, S9B - DB S10A - DA, S10B - DB S11A - DA, S11B - DB S12A - DA, S12B - DB S13A - DA, S13B - DB S14A - DA, S14B - DB S15A - DA, S15B - DB S16A - DA, S16B - DB Table 2. ADG731 Truth Table A4 X X 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 A3 X X 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 A2 X X 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 A1 X X 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 A0 X X 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 E N C S Switch Condition X 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Retains previous switch condition All Switches OFF 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 X = Don't Care -8- REV. PrD PRELIMINARY TECHNICAL DATA ADG725/ADG731 TERMINOLOGY VDD VSS IDD ISS GND S D IN VD (VS) RON R ON RFLAT(ON) I S (OFF) I D (OFF) ID, IS (ON) VINL VINH IINL(IINH) C S (OFF) C D (OFF) C D ,C S (ON) CIN tTRANSITION tOPEN Charge Injection Off Isolation A measure of unwanted signal coupling through an "OFF" switch. Crosstalk A measure of unwanted signal is coupled through from one channel to another as a result of parasitic capacitance. On Response The Frequency response of the "ON" switch. Insertion Loss The loss due to the ON resistance of the switch. Most positive power supply potential. Most Negative power supply in a dual supply application. In single supply applications, connect to GND. Positive supply current. Negative supply current. Ground (0 V) reference. Source terminal. May be an input or output. Drain terminal. May be an input or output. Logic control input. Analog voltage on terminals D, S Ohmic resistance between D and S. On resistance match between any two channels, i.e. RONmax - RONmin Flatness is defined as the difference between the maximum and minimum value of on-resistance as mea sured over the specified analog signal range. Source leakage current with the switch "OFF." Drain leakage current with the switch "OFF." Channel leakage current with the switch "ON." Maximum input voltage for logic "0". Minimum input voltage for logic "1". Input current of the digital input. "OFF" switch source capacitance. Measured with reference to ground. "OFF" switch drain capacitance. Measured with reference to ground. "ON" switch capacitance. Measured with reference to ground. Digital input capacitance. Delay time measured between the 50% and 90% points of the SYNC and the switch "ON" condi tion when switching from one address state to another. "OFF" time measured between the 80% points of both switches when switching from one address state to another. A measure of the glitch impulse transferred from the digital input to the analog output during switching. REV. PrD -9- PRELIMINARY TECHNICAL DATA ADG725/ADG731 TYPICAL PERFORMANCE CHARACTERISTICS TBD TBD TBD TPC 1. On Resistance vs. VD(VS) for for Single Supply TPC 4. On Resistance vs. VD(VS) for Different Temperatures, Single Supply TPC 7. Leakage Currents vs. VD(VS) TBD TBD TBD TPC 2. On Resistance vs. VD(VS) for Dual Supply TPC 5. On Resistance vs. VD(VS) for Different Temperatures, Dual Supply TPC 8. Leakage Currents vs. VD(VS) TBD TBD TBD TPC 6. Leakage Currents vs. VD(VS) TPC 3. On Resistance vs. VD(VS) for Different Temperatures, Single Supply TPC 9. Leakage Currents vs. Temperature -10- REV. PrD PRELIMINARY TECHNICAL DATA ADG725/ADG731 TBD TBD TBD TPC 10. Leakage Currents vs. Temperature TPC 13. TON/TOFF Times vs. Temperature TPC 16. On Response vs. Frequency TBD TBD TPC 11. Supply Currents vs. Input Switching Frequency TPC 14. Off Isolation vs. Frequency TBD TBD TPC 12. Charge Injection vs. Source Voltage TPC 15. Crosstalk vs. Frequency REV. PrD -11- PRELIMINARY TECHNICAL DATA ADG725/ADG731 GENERAL DESCRIPTION The ADG725 and ADG731 are serially controlled, 32 channel and dual/differential 16 channel multiplexers respectively. POWER ON RESET On power up of the device, all switches will be in the OFF condition and the internal shift register is filled with zeros and will remain so until a valid write takes place. SERIAL INTERFACE The ADG725 and ADG731 have a three wire serial interface (SYNC, SCLK, and DIN), which is compatible with SPI, QSPI, MICROWIRE interface standards and most DSP's. Figure 1 shows the timing diagram of a typical write sequence. Data is written to the 8-bit shift register via DIN under the control of the SYNC and SCLK signals. When SYNC goes low, the input shift register is enabled. An 8-bit counter is also enabled. Data from DIN is clocked into the shift register on the falling edge of SCLK. Figures 2 & 3 show the contents of the input shift registers for these devices. When the part has received eight clock cycles after SYNC has been pulled low, the switches are automatically updated with the new configuration and the input shift register is disabled. With SYNC held high, any further data or noise on the DIN line will have no effect on the shift register. The ADG725 CSA and CSB data bits allow the user the flexibility to change the configuration of either or both banks of the multiplexer. -12- REV. PrD PRELIMINARY TECHNICAL DATA ADG725/ADG731 Test Circuits I DS VDD V1 VSS V SS V DD S1 S D S2 S32 D ID (OFF) A VS VD GND VS R O N = V 1/IDS Test Circuit 1. On Resistance. VDD V DD S1 S2 VS VD S32 D Test Circuit 3. ID (OFF) VDD V DD S1 S32 VSS V SS D ID (ON) A VD VS GND VSS V SS IS (OFF) GND Test Circuit 2. IS (OFF). VDD V DD VSS V SS S1 S2 THRU S31 ADG731* S32 D GND RL 300 CL 35pF VS32 VOUT V OUT VS32 * SIMILAR CONNECTION FOR ADG725 SYNC VS1 0V Test Circuit 4. ID (ON) 50% 50% VS1 90% 90% tTRANSITION tTRANSITION Test Circuit 5. Switching Time of Multiplexer, tTRANSITION. V DD VDD VSS VSS S1 SYNC VS 0V S2 THRU S31 ADG731* S32 D GND RL 300 CL 35pF VOUT VS VOUT 80% 80% t OPEN *SIMILAR CONNECTION FOR ADG725 Test Circuit 6. Break Before Make Delay, tOPEN. REV. PrD -13- PRELIMINARY TECHNICAL DATA ADG725/ADG731 VDD V DD VSS VSS SYNC ADG731* RS VS GND S D CL 1nF VOUT V OUT QINJ = CL x VOUT VOUT *SIMILAR CONNECTION FOR ADG725 Test Circuit 7. Charge Injection. VDD 0.1 F VSS 0.1 F VDD VSS VDD S VSS NETWORK ANALYZER 50 VS VOUT VDD VSS S1 S2 ADG731* S32 50 NETWORK ANALYZER 50 VS VOUT 50 D ADG731* GND RL 50 D GND RL 50 OFF ISOLATION = 20 LOG *SIMILAR CONNECTION FOR ADG725 VOUT VS *SIMILAR CONNECTION FOR ADG725 CHANNEL TO CHANNEL CROSSTALK= 20LOG 10(VOUT /VS) Test Circuit 8. OFF Isolation Test Circuit 9. Channel-to-Channel Crosstalk. VDD 0.1 F VSS 0.1 F NETWORK ANALYZER 50 VS D VOUT VDD S VSS ADG731* GND RL 50 INSERTION LOSS = 20 LOG VOUT WITH SWITCH VOUT WITHOUT SWITCH *SIMILAR CONNECTION FOR ADG725 Test Circuit 10. Bandwidth -14- REV. PrD PRELIMINARY TECHNICAL DATA ADG725/ADG731 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 48-Lead CSP (CP-48) 0.276(7.0) BSC SQ PIN 1 INDICATOR 0.024 (0.60) 0.017 (0.42) 0.009 (0.24) 0.024 (0.60) 0.017 (0.42) 37 0.009 (0.24) 36 0.010 (0.25) MIN 48 1 TOP VIEW 0.266 (6.75) BSC SQ BOTTOM VIEW 0.207 (5.25) 0.201 (5.10) SQ 0.195 (4.95) 0.020 (0.50) 0.016 (0.40) 0.012 (0.30) 12 MAX 0.035 (0.90) MAX 0.033 (0.85) NOM o 25 24 12 13 0.217 (5.5) REF 0.028 (0.70) MAX 0.026 (0.65) NOM 0.002 (0.05) 0.0004 (0.01) 0.012 (0.30) 0.020 (0.50) 0.008(0.20) 0.0 (0.0) BSC 0.009 (0.23) REF 0.007 (0.18) CONTROLLING DIMENSIONS ARE IN MILLIMETERS 48-Lead TQFP (SU-48) 0.047 (1.20) MAX 0.041 (1.05) 0.037 (0.95) 48 1 0.354 (9.00) BSC 0.276 (7.0) BSC 37 36 0.030 (0.75) 0.018 (0.45) TOP VIEW (PINS DOWN) 0.006 (0.15) 0.002 (0.05) 0 - 7 0 MIN 0.008 (0.20) 0.004 (0.09) 12 13 25 24 0.019 (0.5) BSC 0.011 (0.27) 0.006 (0.17) REV. PrD -15- 0.354 (9.00) BSC 0.276 (7.0) BSC SEATING PLANE |
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