| PART |
Description |
Maker |
| MOC213M |
8-Pin SOIC Phototransistor Output Optocoupler; Package: SOIC-W; No of Pins: 8; Container: Box
|
FAIRCHILD SEMICONDUCTOR CORP
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| ATS040040013-PF-13L |
40.00 x 40.00 x 13.00 mm BGA Heat SInk (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS024024013-PF-8L |
24.00 x 24.00 x 13.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS017017020-PF-5S |
17.00 x 17.00 x 20.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin FIn
|
Advanced Thermal Solutions, Inc.
|
| ATS024024020-PF-8S |
24.00 x 24.00 x 20.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS031031005-PF-10D |
31.00 x 31.00 x 5.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin FIn
|
Advanced Thermal Solutions, Inc.
|
| ATS015015007-PF-4F |
15.00 x 15.00 x 7.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin FIn
|
Advanced Thermal Solutions, Inc.
|
| ATS040040007-PF-13F |
40.00 x 40.00 x 7.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS042042017-PF-14P |
42.00 x 42.00 x 17.00 BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS020020005-PF-7D |
20.00 x 20.00 x 5.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
