PART |
Description |
Maker |
ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸(16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu... ICSI[Integrated Circuit Solution Inc] Intersil, Corp.
|
AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP9X9-81 |
Package Outline
|
Global Mixed-mode Techn...
|
SOT223 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
SOD882 |
Package outline
|
STANFORD[Stanford Microdevices]
|
TSSOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|