| PART |
Description |
Maker |
| ZSPM9000 ZSPM9000AI1R |
Ultra-Compact, High-Performance DrMOS Device
|
Integrated Device Techn...
|
| LSM303CTR |
Ultra-compact high-performance e-compass 3D accelerometer and 3D magnetometer module
|
ST Microelectronics
|
| RPM973-H11 |
Ultra-compact, Ultra-thin Side View FIR-compatible IrDA Module with Built-in Remote Control Transmission Function
|
Rohm
|
| EC2-6 EC2 EC2-12ND EC2-12NP EC2-12NU EC2-12NJ EC2- |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type
COMPACT AND LIGHTWEIGHT/ SMALL MOUNTING SIZE/ HIGH BREAKDOWN VOLTAGE
High Insulation/ High breakdown voltage/ compact and lightweight/ Surface mounting type
A/D Converter (A-D) IC; Resolution (Bits):24; Sample Rate:192kSPS; Input Channels Per ADC:8; Input Channel Type:Differential; Data Interface:Serial; Package/Case:48-LQFP RoHS Compliant: Yes
CONNECTOR ACCESSORY
Film Capacitor; Capacitor Type:Suppression; Voltage Rating:100VDC; Capacitor Dielectric Material:Polyester; Capacitance:0.022uF; Capacitance Tolerance: 10%; Lead Pitch:5.00mm; Leaded Process Compatible:Yes RoHS Compliant: Yes
COMPACT AND LIGHTWEIGHT, SMALL MOUNTING SIZE, HIGH BREAKDOWN VOLTAGE 小巧轻盈，小安装尺寸，高击穿电压
|
NEC Corp.
NEC, Corp.
|
| EBPC-3500L-75SE EBPC-3500L-61SE |
Ultra-compact Intel垄莽 Atom N270/AMD LX800 Embedded System
Ultra-compact Intel? Atom N270/AMD LX800 Embedded System
|
Advantech Co., Ltd.
|
| MGWI06-24D05 MGWI06-24D12 MGWI06-24D15 MGWI06-24S0 |
Ultra compact DIP Package
|
Total Power Internation...
|
| ICO-200 |
Ultra slim and compact design
|
Axiomtek Co., Ltd.
|
| RS5C313 |
ULTRA-COMPACT REAL-TIME CLOCK IC
|
RICOH electronics devices d...
|
| BRPG1211C BRBG1211C BRPY1211C |
Bi-Color Ultra Compact SMT LED
|
Stanley Electric
ETC[ETC]
List of Unclassifed Manufacturers
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