| PART |
Description |
Maker |
| 0901200843 90120-0843 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 3 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 90136-2210 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0705419040-17 |
2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded
|
Molex Electronics Ltd.
|
| 0705419079-17 |
2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded
|
Molex Electronics Ltd.
|
| 0705419077-17 |
2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded
|
Molex Electronics Ltd.
|
| 0705419044-17 |
2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded
|
Molex Electronics Ltd.
|
| 87937-0106 0879370106 |
2.54mm (.100) Pitch KK庐 Header, Single Row Dual Body, Through Hole, Vertical, 1 Circuits, 2.50渭m (100渭) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 1 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
|
Molex Electronics Ltd.
http://
|
| 90121-0121 0901210121 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, 1 Circuit, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| 0901210149 |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, 29 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| 0901210148 |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, 28 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
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