| PART |
Description |
Maker |
| BM-10EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
5X7 DOT MATRIX DISPLAY, HIGH EFFICIENCY RED/YELLOW GREEN, 30.48 mm
|
BRIGHT LED ELECTRONICS CORP
AMERICAN BRIGHT OPTOELECTRONICS CORP
|
| SSB-COB13340SYW-B |
SINGLE COLOR DISPLAY CLUSTER, SUPER YELLOW, 133 mm
133mm x 40mm V.A. SUPER YELLOW LED BACKLIGHT CHIPS ON BOARD, 132 CHIPS, 4.2V 660mA
133mm x 40mm V.A. SUPER YELLOW LED BACKLIGHT, CHIPS ON BOARD, 132 CHIPS, 4.2V 660mA
|
ETC
LUMEX INC.
List of Unclassifed Manufacturers
|
| BM-10EG88MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-20EG57MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-20EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| CDR04BX104AKUM CDR03BP331B CDR01B151B CDR01BX561B |
CAP 0.15UF 10% X7R SMD-1812 BULK BASE/BARR/SOLDER R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.1 uF, SURFACE MOUNT, 1812
Chips
MIL-PRF-55681/Chips Part Number Example CDR01 thru CDR06
|
AVX, Corp.
AVX Corporation
|
| 2220GC103KAZ1A 1808AA105JAZ1A 1808GC223JAZ1A 1808H |
CAP 0.01UF 2000V 10% X7R SMD-2220 TR-7 FLEXITERM CAPACITOR, CERAMIC, MULTILAYER, 2000 V, X7R, 0.01 uF, SURFACE MOUNT, 2220
High Voltage MLC Chips FLEXITERM
High Voltage MLC Chips FLEXITERM
|
AVX, Corp.
AVX Corporation
|
| Y4045249K000A0W Y4047249K000A0W Y4475249K000A0W Y4 |
Bulk Metal? Foil Technology Discrete Chips with TCR of 2 ppm/°C and Tolerance to 0.005 % for use in Hybrid Circuits
Bulk Metal庐 Foil Technology Discrete Chips with TCR of 2 ppm/掳C and Tolerance to 0.005 % for use in Hybrid Circuits
Bulk Metal垄莽 Foil Technology Discrete Chips with TCR of 2 ppm/隆?C and Tolerance to 0.005 % for use in Hybrid Circuits
Bulk Metal㈢ Foil Technology Discrete Chips with TCR of 2 ppm/∑C and Tolerance to 0.005 % for use in Hybrid Circuits
|
Vishay Siliconix
|
| JST80 |
Triac Chips
|
JIEJIE MICROELECTRONICS...
|
| 2CW032560YQ-2 2CW032560YQ-5 |
ZENER DIODE CHIPS
|
Silan Microelectronics
|
| TUWDM1551018 |
CWDM Filter Chips
|
Bookham, Inc.
|
| 3VD045060JL |
Nchannel MOSFET CHIPS
|
Silan Microelectronics Joint-stock
|
