| PART |
Description |
Maker |
| MPC603PFE220LX MPC603PFE240LX MPC603PFE233LX MPC60 |
32-BIT, 220 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 240 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 233 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 180 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 200 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 166 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 160 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
|
Motorola Mobility Holdings, Inc.
|
| MPC603EFE100LX MPC603EFE133LX MPC603EEC |
MPC603e RISC Microprocessor Family PID6-603e Hardware Specification Advance Information
32-BIT, 133 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
|
Motorola Mobility Holdings, Inc.
|
| ATCWBR14701FGEW |
Wire Bond Resistors
|
List of Unclassifed Manufac...
|
| TT140N16SOF |
Solder-Bond Technology
|
Infineon Technologies A...
|
| TT160N16SOF |
Solder-Bond Technology
|
Infineon Technologies A...
|
| MA4BPS201 MA4BPS301 MA4BPS101 |
PIN Diode Chips with Offset Bond Pads
|
MACOM[Tyco Electronics]
|
| MPE603EFE100LX |
32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
|
Motorola Mobility Holdings, Inc.
|
| SML-LX19012UWC-WB7 |
7W, WIRELESS BOND LED MODULE
|
LUMEX INC.
|
|
