PART |
Description |
Maker |
1212691 |
Replacement die - CF 500/DIE RCI 6-1
|
PHOENIX CONTACT
|
HMT351U7CFR8C-H9 HMT351U7CFR8C-RD HMT351U7CFR8C-PB |
DDR3 SDRAM Unbuffered DIMMs Based on 2Gb C-Die DDR3L SDRAM Unbuffered DIMMs Based on 4Gb M-Die
|
Hynix Semiconductor
|
SIDC02D60SIC2SAWN SIDC02D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 6A die sawn Diodes - HV Chips - 600V, 6A die unsawn
|
Infineon
|
HTCICC6402FUG HTCICC6403FUG |
HITAG RO64 Transponder IC HTCICC64; HITAG RO64 transponder IC HTCICC6402FUG/AM<Uncased die|<<<1<Always Pb-free,;HTCICC6403FUG/AM<Uncased die|<<<1<Always Pb-free,;
|
NXP Semiconductors N.V.
|
SIDC03D30SIC2SAWN SIDC03D30SIC2UNSAWN |
Diodes - HV Chips - 300V, 10A die sawn Diodes - HV Chips - 300V, 10A die unsawn
|
Infineon
|
MURC520 |
MURC520 Ultrafast Silicon Die MURC520 Ultrafast Silicon Die
|
Sensitron
|
PUMA2U8002I-25 PUMA2U8002I-20 PUMA2U8002M-15 PUMA2 |
DIE SALE, 1.8V,11MIL(SERIAL EE) x32 EPROM Module 10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE) 8-TSSOP, PB/HALO FREE,NiPdAu, 1.8V(SERIAL EE) 8 TSSOP, PB/HALO FREE, IND TEMP, 1.8V(SERIAL EE) X32号存储器模块 8-SAP,PB/HALO FREE,IND TEMP,2.7V(SERIAL EE) X32号存储器模块
|
NXP Semiconductors N.V. Amphenol, Corp.
|
T8302B 1140-2006 0011-40-2006 001140-2006 |
Terminator Die
|
Molex Electronics Ltd.
|
11-40-2015 1140-2015 0011-40-2015 001140-2015 |
Terminator Die
|
Molex Electronics Ltd.
|
11-40-2001 0011402001 T8300A 1140-2001 0011-40-200 |
Terminator Die
|
Molex Electronics Ltd.
|
S1-1000-50 |
RECTIFIER DIE
|
Sussex Semiconductor, Inc.
|