| PART |
Description |
Maker |
| SG-BGA-6377 |
Ball guide prevents over compression of elastomer
|
Ironwood Electronics.
|
| ECG2351 ECG2352 ECG2353 ECG2355 ECG2356 ECG2357 EC |
FAN AC 60X30 230V BALL, 11cfm
FAN AC 80X38 120/230V BALL, 25cfm
FAN AC 80X38 120/230V BALL, 18cfm
FAN AC 80X35 115V BALL, 31cfm
FAN AC 80X38 115V BALL, 23cfm
FAN AC 80X38 115V BALL, 17cfm
FAN AC 80X38 220V BALL, 31cfm
FAN AC 60X30 115V BALL, 11cfm
FAN AC 80X38 120/230V BALL, 13cfm
FAN AC 254MM(10'') 230V, 700cfm
FAN AC 254MM(10'') 230V, 555cfm
FAN AC 254MM,10'' 230V BALL, 547cfm
FAN AC 254MM(10'') 230V, 600cfm
FAN AC 80X35 115V BALL, 23cfm 晶体管|晶体管|进步党| 50V五（巴西）总裁| 100mA的一（c）|2VAR
FAN AC 254MM(10") 115V, 600cfm
FAN AC 80X38 220V BALL, 17cfm
|
|
| AY-3-8500 |
Ball and Paddle
|
General Semiconductor
|
| KEST-471BT KEST-471BW KEST-471SW KEST-472BT KEST-4 |
Sleeve or Ball Bearing
|
Kepont Electronics, Inc.
Kepont Electronics, Inc...
|
| CS280 |
Ball Chip Scale Package - CS280
|
XILINX[Xilinx, Inc]
|
| 127089FK940JX00PY |
Socket 940 Solder Ball Type
|
SUYIN USA, INC.
|
| 0690187029 |
Ball Bearing Bushing with Lip Seal for TM-42
|
Molex Electronics Ltd.
|
| MCP2150 MCP2120 |
DEVELOPER’S KIT USER’S GUIDE
DEVELOPERS KIT USERS GUIDE
|
MICROCHIP[Microchip Technology]
|
| NP396-500 |
Shrink Ball Grid Array (1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| V54C3256164VBUC V54C3256164VBUT V54C3256164VBLT7 |
16M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
LOW POWER 256Mbit SDRAM 3.3 VOLT, 54-BALL SOC BGA 54-PIN TSOPII 16M X 16
LOW POWER 256Mbit SDRAM 3.3 VOLT/ 54-BALL SOC BGA 54-PIN TSOPII 16M X 16
|
MOSEL-VITELIC
Mosel Vitelic, Corp.
Mosel Vitelic Corp
|
| ADSP-BF527C ADSP-BF525C |
Blackfin Embedded Processor 289-ball MBGA package
|
Analog Devices
|
| KLT-131452 |
1310nm InGaAsP strained MQW for FP-LD 2mm ball lens TO CAN
|
KODENSHI KOREA CORP.
|
