PART |
Description |
Maker |
EB50-12-I2 |
Absorbent Glass Mat technology for efficient gas recombination
|
B. B. Battery Co., Ltd.
|
LEBQ9WM-4S3T-24 Q65111A2345 |
Compact light source in SMT technology, glass window on top, RoHS compliant..
|
OSRAM GmbH
|
ULTRATECH2700 HSH1000UEO |
320 x 240 pixel format, Chip-On-Glass Technology 灯的光刻 CONNECTOR ACCESSORY Lamps for Photolithography
|
PerkinElmer, Inc. PerkinElmer Inc. PerkinElmer Optoelectronics
|
LEUWS2W-PXQX-4P7R |
compact lightsource in multi chip SMT technology with glass window on top
|
OSRAM GmbH
|
10434 |
Reztore Surface and Mat Cleaner Application Instructions
|
List of Unclassifed Manufacturers
|
1N4002G 1N4007G 1N4001G 1N4003G 1N4004G 1N4005G 1N |
400V, 1.0A glass passivated rectifier 1000V, 1.0A glass passivated rectifier 50V, 1.0A glass passivated rectifier 200V, 1.0A glass passivated rectifier 100V, 1.0A glass passivated rectifier 600V, 1.0A glass passivated rectifier 800V, 1.0A glass passivated rectifier
|
http:// WTE[Won-Top Electronics]
|
33482-0601 |
MX150 2X3 BLADE SEALED ASSEMBLY MAT SEAL
|
Molex Electronics Ltd.
|
33472-0880 |
MX150 2X4 RECEPTACLE SEALED ASSEMBLY MAT SEAL
|
Molex Electronics Ltd.
|
PIC18F4580-I_ML PIC18F4580-I_P PIC18F4580-I_PT PIC |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
PIC18F4680 PIC18F2585 PIC18F2585_07 PIC18F2680 PIC |
Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
MSM9000B-XXAV-Z-XX MSM9000B-01AV-Z-XX |
16 X 60 DOTS DOT MAT LCD DSPL CTLR, UUC 35 MM, TCP
|
Oki Electric Industry Co., Ltd.
|
MSM6222B-01GS-BL |
16 X 40 DOTS DOT MAT LCD DRVR AND DSPL CTLR, PQFP80
|
OKI ELECTRIC INDUSTRY CO LTD
|