PART |
Description |
Maker |
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
WDFN3X3-10 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN2X2-12 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP15X15-163 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-28-EP |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-14-EP |
Package Outline
|
Global Mixed-mode Techn...
|