| PART |
Description |
Maker |
| JMC150-16 |
Chip - double mesa SCRs of reverse blocking high-voltage
|
JIEJIE MICROELECTRONICS...
|
| HYB25D256400BT HYB25D256800BTL-8 HYB25D256160BC-6 |
256-Mbit Double Data Rate SDRAM, Die Rev. B
|
INFINEON[Infineon Technologies AG]
|
| 2N4170 2N2619 2N1771A 2N1772A 2N1773A 2N1774A 2N17 |
SCRs 8 A, SCR, TO-64
SCRs Continued)
|
Central Semiconductor, Corp.
Central Semiconductor Corp.
Central Corp
CENTRAL[Central Semiconductor Corp]
|
| IPT1206-CEB IPT1206-SEB IPT1206-TEB |
High current density due to double mesa technology
|
IP SEMICONDUCTOR CO., L...
|
| IPT1206-BEF IPT1206-TEF IPT1206-CEF IPT1206-SEF |
High current density due to double mesa technology
|
IP SEMICONDUCTOR CO., L...
|
| DSP56800SDKPB |
Embedded SDK for DSP56800 Rev 3.0, Rev 7.0 Product Brief
|
Motorola
|
| MC145576EVKAD |
Addendum to MC145576EVK/D Rev. 1.1 ISDN Single-Chip NT1 Transceiver Evaluation Kit
|
Motorola
|
| NEXC224Z5.5V10.5X8.5TRF NEXC474Z3.5V10.5X8.5TRF NE |
CAPACITOR, ELECTRIC DOUBLE LAYER, 5.5 V, 220000 uF, SURFACE MOUNT CHIP, LEAD FREE
CAPACITOR, ELECTRIC DOUBLE LAYER, 3.5 V, 470000 uF, SURFACE MOUNT CHIP, LEAD FREE
CAPACITOR, ELECTRIC DOUBLE LAYER, 5.5 V, 47000 uF, SURFACE MOUNT CHIP, LEAD FREE
CAPACITOR, ELECTRIC DOUBLE LAYER, 3.5 V, 220000 uF, SURFACE MOUNT CHIP, LEAD FREE
|
NIC Components, Corp.
|
| MPC860UM MPC860UMAD |
Errata to the MPC860 PowerQUICC Family User’s Manual, Rev. 2
Errata to the MPC860 PowerQUICC⑩ Family User’s Manual, Rev. 2
Errata to the MPC860 PowerQUICC Family Users Manual Rev. 2
Errata to the MPC860 PowerQUICC Family Users Manual, Rev. 2
Errata to the MPC860 PowerQUICCFamily UserManual, Rev. 2
|
MOTOROLA[Motorola, Inc]
MOTOROLA[Motorola Inc]
|
