| PART |
Description |
Maker |
| K7R643684M K7R641884M |
2Mx36 & 4Mx18 QDRTM II b4 SRAM
|
Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| K7R321884M K7R321884M-FC16 K7R321884M-FC20 K7R3218 |
1Mx36 & 2Mx18 & 4Mx9 QDRTM II b2 SRAM
2Mx36 & 4Mx18 & 8Mx9 QDRTM II b2 SRAM
1Mx36 & 2Mx18 QDRTM II b4 SRAM
|
Samsung Electronic
SAMSUNG[Samsung semiconductor]
|
| XQ1701L-SERIES XQR1701L-SERIES XQ1701LCC44M XQR170 |
Cascadable for storing longer or multiple bitstreams
QPro configuration PROM. Radiation-hardened.
QPro configuration PROM. SMD number 5962-9951401NXB.
QPro configuration PROM. SMD number 5962-9951401QYA
QPro Series Configuration PROMs (XQ) including Radiation-Hardened Series (XQR) 1M X 1 CONFIGURATION MEMORY, PDSO20
1M X 1 CONFIGURATION MEMORY, CQCC44
|
Xilinx, Inc.
XILINX INC
|
| AT17C128 AT17C128-10JC AT17C128-10JI AT17C128-10PC |
FPGA Configuration E2PROM 64K X 1 CONFIGURATION MEMORY, PDSO20
|
Atmel, Corp.
Atmel Corp.
ATMEL[ATMEL Corporation]
|
| T10C T10C110 T10C140 T10C180 T10C220 T10C270 T10C8 |
3 Terminal configuration, matches G.D.T. pin configuration For Plug in Applications, fits in KRONE3 Point Connector Block 5B. 3端配置，比赛在应用程序插件GDT中引脚配置，适合在科龙⑩3点连接器5B条
3 Terminal configuration, matches G.D.T. pin configuration For Plug in Applications, fits in KRONE⑩ 3 Point Connector Block 5B.
3 Terminal configuration matches G.D.T. pin configuration For Plug in Applications fits in KRONE 3 Point Connector Block 5B.
3 Terminal configuration, matches G.D.T. pin configuration For Plug in Applications, fits in KRONE 3 Point Connector Block 5B.
SiBOD
|
Littelfuse, Inc.
LITTELFUSE[Littelfuse]
|
| XCF01SV XCF01SVG XCF01SVO20C XCF01SVO48 XCF01SVOG2 |
Platform Flash In-System Programmable Configuration PROMS 平台Flash在系统可编程配置方案管理系统
Platform Flash In-System Programmable Configuration PROMS 8M X 1 CONFIGURATION MEMORY, PDSO48
|
Xilinx, Inc.
PROM
XILINX INC
|
| AT17LV020-10JC AT17LV020-10JI AT17LV020 AT17C020-1 |
10MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA) 2M X 1 CONFIGURATION MEMORY, PQCC20
2-megabit FPGA Configuration EEPROM Memory
|
Atmel, Corp.
ATMEL[ATMEL Corporation]
|
| AT17F080 AT17F080-30BJC AT17F080-30BJI AT17F080-30 |
FPGA CONFIGURATION FLASH MEMORY 4M X 1 CONFIGURATION MEMORY, PQCC20
|
Atmel, Corp.
http://
Atmel Corp.
ATMEL[ATMEL Corporation]
|
| XC18V00-SERIES-OF-IN-SYSTEM-PROGRAMMABLE XC18V256V |
XC18V00 Series of In-System Programmable Configuration PROMs
In-system programmable configuration PROM.
|
Xilinx
|
| IRFK6J150 IRFK6H150 IRFK6H350 IRFK6J350 IRFK6JC50 |
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION 隔震基电力六角巴基斯坦大会平行芯片配
Lsolated Base Power HEX-pak Assembly Half Bridge Configuration
100V SINGLE HEXFET Power MOSFET in a TO-240AA package
|
International Rectifier, Corp.
IRF[International Rectifier]
|
| M28W320EBB85ZB1T M28W320EBT85N1T M28W320EBB85N1T M |
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 12.7 V; VZ min.: 11.4 V; VZ nom: 12 V
surface mount silicon Zener diodes
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 15.6 V; VZ min.: 13.8 V; VZ nom: 15 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 11.6 V; VZ min.: 10.4 V; VZ nom: 11 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 10.6 V; VZ min.: 9.4 V; VZ nom: 10 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 3.5 V; VZ min.: 3.1 V; VZ nom: 3.3 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 14.1 V; VZ min.: 12.4 V; VZ nom: 13 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 2.6 V; VZ min.: 2.2 V; VZ nom: 2.4 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 2.9 V; VZ min.: 2.5 V; VZ nom: 2.7 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 3.2 V; VZ min.: 2.8 V; VZ nom: 3 V
32 Mbit (2Mb x16, Boot Block) 3V Supply Flash Memory 32兆位（处理器x16插槽，引导块V电源快闪记忆
|
意法半导
STMicroelectronics N.V.
|
| XQ18V04 XQR18V04 XQ18V04VQ44N DS082 |
IEEE Std 1149.1 boundary-scan (JTAG) support
QPro XQ18V04 (XQR18V04) QML In-System Programmable Configuration PROMs
QPro XQ18V04 (XQR18V04) QML In-System Programmable Configuration PROMs
|
Xilinx, Inc.
|
