| PART |
Description |
Maker |
| HIP9010 |
Signal Processor, Engine Knock, Two Sensor Inputs, Microprocessor Programmable, On-Chip Clock
|
Intersil
|
| HIP9011 |
Signal Processor, Engine Knock, Two Sensor Inputs, Microprocessor Programmable, External Clock Frequencies up to 24MHz
|
Intersil
|
| TMP007 |
<font color=red>[Old version datasheet]</font> TMP007 Infrared Thermopile Sensor with Integrated Math Engine
|
TI store
|
| LSM330DLC LSM330DLCTR |
iNEMO inertial module: 3D accelerometer and 3D gyroscope
|
ST Microelectronics STMicroelectronics
|
| LSM9DS0 LSM9DS0TR |
iNEMO inertial module:3D accelerometer, 3D gyroscope, 3D magnetometer iNEMO inertial module 3D accelerometer, 3D gyroscope, 3D magnetometer
|
ST Microelectronics STMicroelectronics
|
| T8200 |
Patented, Absorption Infrared Gas sensing engine sensing engine provides high accuracy in a compact low cost package
|
Amphenol Corporation
|
| MSMC-0102 MSMC-0104 MSMC-0103 MSMC-0105 MSMC-0100 |
PHOTOCELL,90mW,150V PEAK, 27KohmMAX LIGHT,2MohmMIN DARK PHOTOCELL,150mW,200VPK,3.6Kohm MAX LITE,0.3Mohm MIN DARK PHOTOCELL,90mW,150VPK,5Kohm, MAX LITE,20Mohm MIN DARK PHOTOCELL,400mW,350VPK,8Kohm MAX LITE,1Mohm MIN. DARK PHOTOCELL,100mW,150VPK,3Kohm, MAX LITE, 0.2Mohm MIN DARK PHOTOCELL,100mW,150VPK,80Kohm, MAX LITE,5Mohm MIN DARK CAP,CERM,DISC,470PF,1KV,20% CAP,CERM,DISC,0.047UF,1KV,20% AP,CERM,DISC,5PF,50V,20% INCREMENTS of 10 PHOTOCELL,90mW,150VPK,27Kohm, MAX LITE,0.3Mohm MIN DARK 医药0W的超小型开关电 PHOTOCELL,90mW,150VPK,10Kohm, MAX LITE,20Mohm MIN DARK 医药0W的超小型开关电
|
Astrodyne, Inc.
|
| HS-26082 |
ULV Intel? Celeron? Processor Embedded Engine Board ULV Intel垄莽 Celeron垄莽 Processor Embedded Engine Board
|
BOSER Technology Co., Ltd
|
| LSM330DLTR |
Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor
|
STMicroelectronics
|
| DS28CN01U_T DS28CN01 DS28CN01U_ DS28CN01U DS28CN01 |
1Kbit I2C/SMBus EEPROM with SHA-1 Engine 1Kbit I?C/SMBus EEPROM with SHA-1 Engine
|
MAXIM[Maxim Integrated Products]
|
| R1250 |
PHOTOMULTIPLIER TUBE Linear Sensor Photodiode Array; 128x1 Sensor-Elements Organization; 400 Dots-Per-Inch (DPI) Sensor Pitch; High Linearity and Uniformity; Wide Dynamic
|
Hamamatsu Corporation Hamamatsu Photonics
|
|