| PART |
Description |
Maker |
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| AP2305BGN-HF AP2305BGN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| SOP-7 |
Package Outline
|
Global Mixed-mode Techn...
|
| PG-LQFP-64-13 PG-LQFP-64-5 PG-LQFP-64-4 |
Package Outline
|
Infineon
|
| TQFN4X4-24 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-32 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN2X2-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|
