PART |
Description |
Maker |
P-306-DB |
Multiple Density Solder Eyelet
|
List of Unclassifed Man...
|
CXA49XXXX |
Low Profile Dip Solder / Eyelet Edgecard Connectors
|
Sullins Electronics
|
A2-7PA-2.54DS A2-7PA-2.54DSA A1-60PA-2. A2-2PA-2.5 |
2.54mm Pitch High Density Connector 1 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER 3 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER 2.54mm Pitch High Density Connector 2.54mm间距高密度连接器 KPT 12C 8#20 4#16 PIN RECP GIGABASE CAT 5E UNIVERSALJACK, TEL IVORY ZX Series, Subminiature Basic Switch, SPDT, 125 Vac, 3 A, Straight Lever Actuator, Solder Termination FEMALE; MALE, RIGHT ANGLE; STRAIGHT TWO PART BOARD CONNECTOR, CRIMP; SOLDER, SOCKET
|
HIROSE ELECTRIC Co., Ltd. Hirose Electric USA, INC. HIROSE[Hirose Electric]
|
EBT15610A1WAA9 EBT15610A1XAA9 EBT15610A2WAA9 EBT15 |
Edgeboard Connectors, Single Readout, Dip Solder, Eyelet and Wire Wrap Termination 18 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, WIRE WRAP 10 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SOLDER
|
Vishay Siliconix Vishay Intertechnology, Inc. VISHAY DALE
|
L77HDE15S |
SOLDER-CUP TERMINATION STANDARD and HIGH DENSITY
|
Amphenol Corporation
|
DBCHDMCD78 DBCHDFCD78 DBCHDMSS62S DBCHDFCD44 DBCHD |
D TYPE CONNECTORS LOW COST HIGH DENSITY SOLDER BUCKET
|
Dubilier
|
EMC1438-2-AP-TR EMC1438-1-AP-TR |
1°C Multiple Temperature Sensor with Hardware Controlled Standby & Hottest of Multiple Zones
|
SMSC Corporation
|
ISPLSI1032EA-170LT100 ISPLSI1032EA-200LT100 1032EA |
60 MHz in-system prommable high density PLD 170 MHz in-system prommable high density PLD 125 MHz in-system prommable high density PLD 100 MHz in-system prommable high density PLD Shielded Paired Cable; Number of Conductors:8; Conductor Size AWG:24; No. Strands x Strand Size:7 x 32; Jacket Material:Polyethylene; Shielding Material:Aluminum Foil/Polyester Tape/Tinned Copper Braid; Number of Pairs:4 RoHS Compliant: Yes In-System Programmable High Density PLD 在系统可编程高密度可编程逻辑器件
|
LATTICE[Lattice Semiconductor] Lattice Semiconductor Corporation Lattice Semiconductor, Corp.
|
M74DW66500B90ZT M74DW66500B M74DW66500B70ZT |
2x 64Mbit (x8/ x16, Multiple Bank, Boot Block) Flash Memory and 32Mbit Pseudo SRAM, 3V Supply, Multiple Memory Product
|
ST Microelectronics STMICROELECTRONICS[STMicroelectronics]
|
ISPLSI1024 ISPLSI1024EA-200LT100 1024EA ISPLSI1024 |
200 MHz in-system prommable high density PLD Shielded Paired Cable; Number of Conductors:8; Conductor Size AWG:28; No. Strands x Strand Size:7 x 36; Jacket Material:Polyethylene; Number of Pairs:4; Features:Alumunium Foil Polyester/Tinned Copper Braid; Impedance:120ohm RoHS Compliant: Yes In-System Programmable High Density PLD 100 MHz in-system prommable high density PLD
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Lattice Semiconductor Corporation LATTICE[Lattice Semiconductor] http://
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