| PART |
Description |
Maker |
| XD1004-BD-EV1 XD1004-BD-000V |
10.0-40.0 GHz GaAs MMIC Distributed Amplifier 10000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
10.0-40.0 GHz GaAs MMIC Distributed Amplifier 10.0-40.0千兆赫的GaAs MMIC分布式放大器
|
Mimix Broadband, Inc.
|
| FXC6000 |
Distributed Power Front-End
|
POWER-ONE[Power-One]
|
| UFE1300-5 UFE2000-9 |
AC-DC / Distributed Power Front-End 1U
|
Emerson
|
| MAAPGM0052-DIE |
Amplifier, Distributed Power 4.0-18.0 GHz
|
MACOM[Tyco Electronics]
|
| FXC7000 FXC7000-48-S |
Distributed Power Front-End
|
POWER-ONE[Power-One]
|
| SMH4811 SMH4811A SMH4811AG SMH4811AS |
DISTRIBUTED POWER HOT SWAP CONTROLLER
|
SUMMIT[Summit Microelectronics, Inc.]
ETC
|
| DS550DC-3 |
Distributed Power Bulk Front-End
|
Artesyn Technologies
|
| SMH4803AS SMH4803A |
Distributed Power Hot Swap Controller
|
SUMMIT[Summit Microelectronics, Inc.]
|
| DS2000-309 DS2000-3 |
2000 Watts 12 V Distributed Power System
|
Emerson Network Power
|
| DS550-3 DS450-3 |
450-550 Watts 12V DS450-3/DS550-3 Distributed Power System
450-550 Watts 12V DS450-3/DS550-3 Distributed Power System
|
ASTEC[Astec America, Inc]
|
| BBS-15 BBS-1/4 BBS-2/10 BBS-1-8/10 BBS-10 BBS-1-6/ |
72-Mbit QDR™-II SRAM 2-Word Burst Architecture
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL™ Architecture
72-Mbit DDR-II SRAM 2-Word Burst Architecture
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL™ Architecture
36-Mbit QDR™-II SRAM 4-Word Burst Architecture
Fuse
256K (32K x 8) Static RAM
64/256/512/1K/2K/4K x 18 Synchronous FIFOs
Low-Voltage 64/256/512/1K/2K/4K/8K x 9 Synchronous FIFOs
Neuron® Chip Network Processor
64-Kbit (8K x 8) Static RAM
72-Mbit QDR™-II SRAM 2-Word Burst Architecture 保险
|
NXP Semiconductors N.V.
|
