| PART |
Description |
Maker |
| MASW-011036-001SMB MASW-011036-14130G MASW-011036- |
Ka-Band High Power Terminated SPDT PIN Switch
Die with G-S-G RF Pads and DC Bias Pads
|
M/A-COM Technology Solu...
|
| VXC1-1133-26M5625000 |
7 x 5 x 1.7mm 4 pads
|
Vectron International, Inc
|
| ATN3580-40 ATN3580 ATN3580-01 ATN3580-02 ATN3580-0 |
Fixed Attenuator Pads
|
SKYWORKS[Skyworks Solutions Inc.]
|
| GF576 |
SMD CMOS output 6 pads
|
Mercury United Electron...
|
| VXC4-1034R VXC4-1034R-25M000 |
7 x 5 x 1.1 mm 4 pads ± 50 PPM at -20C to 70C 30 Ohms Maximum at 100 uW
7 x 5 x 1.1 mm 4 pads 【 50 PPM at -20C to 70C 30 Ohms Maximum at 100 uW
|
VITESSE[Vitesse Semiconductor Corporation]
|
| VXC4-1034R-25M000 |
7 x 5 x 1.1 mm 4 pads 50 PPM at -20C to 70C 30 Ohms Maximum at 100 uW
|
Vitesse Semiconductor Corporation.
|
| A2C25-A-C8 MACC25-A-C MACC25-AV-D |
Hold cords, cables, and tubing Two rubber adhesive pads for added strength
|
PANDUIT CORP.
|
| 420-078 |
PERM - Integrated Circuit Mounts Perm-O-Pads
|
Bivar, Inc.
|
| U3666M U3666M-MFP U3666M-MDP |
Baseband Delay Line o.o64 ms (Improved Version of U3665M)
Baseband Delay Line 64 xs (Improved Version of U3665M)
Baseband Delay Line 64 us (Improved Version of U3665M)
|
Atmel
TEMIC[TEMIC Semiconductors]
|
| MX7524UQ/883B |
Improved MX7524
|
MAXIM - Dallas Semiconductor
|
| AN11247 |
Improved timekeeping accuracy
|
NXP Semiconductors
|
| ESD200 ESD210 |
Output Interface UART, Compliant Bluetooth stack v1.2-improved
Output Interface UART, Compliant Bluetooth stack v1.2-improved AFH
|
DB Lectro Inc
|
