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HPI307R2 - Plastic mold package

HPI307R2_8374134.PDF Datasheet


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HPI307R2 Plastic mold package
KODENSHI KOREA CORP.
LBT-125 Compact package based on the double-mold method
ETC[ETC]
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NEC[NEC]
2P1M-YB 2P6M-YB 2P4M-YB 2P2MYC 2P2M-YB 2P2M-CY 2P0 4 A, 100 V, SCR PLASTIC PACKAGE-3
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4 A, 400 V, SCR PLASTIC PACKAGE-3
4 A, 200 V, SCR
4 A, 50 V, SCR

GL561 GL560 Low Peak Forward Voltage Type Φ 5 Resin Mold Package Infrared Emitting Diodes
Low Peak Forward Voltage Type フ 5 Resin Mold Package Infrared Emitting Diodes
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Low Peak Forward Voltage Type 5 Resin Mold Package Infrared Emitting Diodes
SHARP[Sharp Electrionic Components]
Sharp Corporation
2SC5179-T1 2SC5179-T2 2SC5179 NPN EPITAXIAL SILICON TRANSISTOR IN SMALL MINI-MOLD PACKAGE FOR LOW-NOISE MICROWAVE AMPLIFICATION
NEC
2SC5180 NPN EPITAXIAL SILICON TRANSISTOR IN SUPER MINI-MOLD PACKAGE FOR LOW-NOISE MICROWAVE AMPLIFICATION
NEC
2SC5182-T1 2SC5182-T2 2SC5182 NPS EPITAXIAL SILICON TRANSISTOR IN MINI-MOLD PACKAGE FOR LOW-NOISE MICROWAVE AMPLIFICATION
From old datasheet system
NEC Corp.
PS21963-ET09 PS21963-AET PS21963-CET PS21963-ET PS Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
Mitsubishi Electric Semiconductor
PS21963-EST09 PS21963-EST Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
Mitsubishi Electric Semiconductor
BGA-320P-M06 PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
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NEC[NEC]
NEC, Corp.
 
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