| PART |
Description |
Maker |
| SOT-89-3L |
PACKAGE OUTLINE DIMENSIONS
|
ETC
|
| 081029132723 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029132636 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| DFN1006H4-2 AP02002 DFN0603H3-2 DFN1006-2 DFN1006- |
PACKAGE OUTLINE DIMENSIONS
|
Diodes Incorporated
|
| R-8 |
8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions
|
Analog Devices
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| SSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|
| TO252 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
