| PART |
Description |
Maker |
| AP2301EN-HF-14 |
Small Package Outline
|
Advanced Power Electron...
|
| CSSOP |
Ceramic Shrink Small Outline Package
|
Amkor Technology
|
| AP2326GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2328GN-HF |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
|
| AP2327GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2313GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2622GY-12 |
Low Gate Charge, Small Package Outline
|
Advanced Power Electron...
|
| AK14D300-HSOP AK14D300-WSO AK08D300-HSOP AK08DS300 |
Small Outline Package SOIC, SOJ and PLCC DIP Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
ACCUTEK MICROCIRCUIT CORPOR...
ACCUTEK MICROCIRCUIT CO...
|
| AP2310GN |
Simple Drive Requirement Small Package Outline Surface Mount Device
|
TY Semiconductor Co., Ltd
|
| AP2310GN-HF |
Simple Drive Requirement, Small Package Outline, Surface Mount Device
|
Advanced Power Electronics Corp.
|
| AP2318AGEN-HF AP2318AGEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package, Surface Mount Device
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| MPXV6115V |
High Temperature Accuracy Integrated Silicon Pressure Sensor - Small Outline Package
|
Freescale (Motorola)
|
