| PART |
Description |
Maker |
| HSU277 |
Low forward resistance Ultra small Resin Package (URP) is suitable for surface mount design
|
TY Semiconductor Co., L...
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| L4100 |
Resin-potted metal package LED
Resin-potted metal package LED 树脂盆栽金属封装的LED
|
HAMAMATSU[Hamamatsu Corporation]
Hamamatsu Photonics K.K.
|
| LR-A67F |
white SMT package, colorless clear resin
|
OSRAM GmbH
|
| LCWCQAR.PC LCW-CQAR.PC |
SMD ceramic package with silicon resin with lens
|
OSRAM GmbH
|
| LCWCP7P.PC LCW-CP7P.PC |
SMD ceramic package with silicon resin with lens
|
OSRAM GmbH
|
| LH-CP7P |
SMD ceramic package with silicon resin with lens
|
OSRAM GmbH
|
| GW-PSLR32.EM |
white SMT package, colored diffused silicone resin
|
OSRAM GmbH
|
| LCW-JDSI.EC |
white SMT package, colored diffused silicone resin
|
OSRAM GmbH
|
| LCW-JDSH.EC |
white SMT package, colored diffused silicone resin
|
OSRAM GmbH
|
