| PART |
Description |
Maker |
| PL342 PL34120191000GDDC PL34120191000KKEX PL341201 |
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±14; Dark
Infrared Light Emitting Diodes Top View Type; Type: Surface Mount Type (Sideview); Peak light emitting wavelength P (nm): 950; Half viewing angle
Infrared Light Emitting Diodes Top View Type; Type: Sideview Resin; Peak light emitting wavelength P (nm): 950; Half viewing angle 1/2 (deg): ±
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±32; Dark
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 3.0x2.5(t=2.5); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 1;
Schottky Barrier Diodes; Package: TO220FN; Constitution materials list: Packing style: Bulk; Package quantity: 500;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 81.3; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 2.6x1.6(t=0.8); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 0.7;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 1.9x1.3(t=0.6); Number of terminal: 2; Reverse voltage VR(V): 100; Average rectified forward current IO(A): 0.5;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
High Sensitivity Chip Sensors Sideview Type; Type: Surface Mount Type; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±12; Dark current ICEO (Max.)(µA): 0.5; Response time tr·tf (µA): 10; Yes;
Reflective Type Photosensors (Photoreflectors); Type: Cased Type; Light Emitting Diode: 630; Phototransistor: 600; Collector current IC (Min.)(mA): 0.08; Response time tr·tf (µs): 10;
Photointerrupter General Type; Packing style: Plastic bag; Package quantity: 400; 塑料无引线芯片载
Plastic Leadless Chip Carrier 塑料无引线芯片载
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 80; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24; 塑料无引线芯片载
Lead Frame Remote Control Receiver Modules (5V Type); Packing style: Stick; Package quantity: 1000; 塑料无引线芯片载
660/780nm Dual Wave Low Power Lasers; Packing style: Tray; Package quantity: 500; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 400; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 5.5x6.5(t=2.3); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 6;
|
Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
|
| AM29L510PCB AM29L510/BXC AM29510LMB AM29L510DCB |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3086AM with Tape and Reel Packaging
Hi-Rel RAD-Hard, Single, 28V Input DC-DC Converter in LS package; Hi-Rel RAD-Hard, Single, 28V Input DC-DC Converter in LS package
Universal Active ORing Controller. Controller / driver IC in an SO-8 package for implementation of Active ORing / reverse polarity protection using N-channel Power MOSFETs.; Similar to IR5001S with Lead-Free packaging.
200V Secondary Side High Speed SR Controller in a 8-Lead SOIC Package. Used to drive N-Channel power MOSFETs used as Synchronous Rectifiers in isolated Flyback converters.; Similar to IR1166SPBF with Tape and Reel Packaging. 乘法累加
|
ITT, Corp.
|
| AH3004-DC60A |
For Packaging High-speed Printers AH Series
|
Rohm
|
| ACT-F1288N ACT-F1288N-150P7T ACT-F1288N-150P7Q ACT |
High speed 1 Megabit monolithic FLASH. Speed 150ns.
High speed 1 Megabit monolithic FLASH. Speed 90ns.
High speed 1 Megabit monolithic FLASH. Speed 70ns.
ACT-F128K8 High Speed 1 Megabit Monolithic FLASH
High speed 1 Megabit monolithic FLASH. Speed 60ns.
High speed 1 Megabit monolithic FLASH. Speed 120ns.
|
AEROFLEX[Aeroflex Circuit Technology]
|
| ADM222 ADM222AN ADM222AR ADM232A ADM232AAN ADM232A |
High Speed, 5 V, 0.1 uF CMOS RS-232 Drivers/Receivers
High Speed/ 5 V/ 0.1 uF CMOS RS-232 Drivers/Receivers
High Speed. 5 V. 0.1 uF CMOS RS-232 Drivers/Receivers 高速5.1超滤的CMOS的RS - 232驱动接收
5V High-Speed RS-232 Transceivers with 0.1uF Capacitors 5V的高速RS - 232收发器与0.1uF电容
LED GREEN DIFFUSED 1X5MM RECT DUAL LINE TRANSCEIVER, PDSO16
|
http://
AD[Analog Devices]
Analog Devices, Inc.
ANALOG DEVICES INC
|
| K6R1008C1C- K6R1008C1C-C10 K6R1008C1C-C12 K6R1008C |
128K x 8 high speed static RAM, 5V operating, 12ns
128Kx8 Bit High-Speed CMOS Static RAM(5V Operating). Operated at Commercial and Industrial Temperature Ranges. 128Kx8位高速CMOS静态RAMV的工作）。在经营商业和工业温度范围
RES-140 0.0625W 1% THICK FILM
128K x 8 high speed static RAM, 5V operating, 15ns
128K x 8 high speed static RAM, 5V operating, 10ns
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
|
| AM29818AXM AM29818ADE AM29818APC AM29818ADCB AM298 |
Digital Audio Driver with Discrete Dead-Time and Protection. High and Low Side Driver in a 14-Lead SOIC package; A IRS20124S packaged in a Lead-Free
Pipeline Register
High Performance Appliance RAM Based Motion Control IC; A IRMCF343 with Standard Packaging
High Voltage, high performance Class D audio aplifier driver with PWM modulator and protection in a 16-Lead PDIP Package; A IRS2092PBF with Standard Packaging
Fully optimized solution for high current synchronous buck multiphase applications in a LGA power block.; Similar to IP2003ATR with Lead Free Packaging.
High Voltage, high performance Class D audio aplifier driver with PWM modulator and protection in a 16-Lead SOIC Narrow Package; Similar to IRS2092PBF Shipped on Tape and Reel
Synchronous Buck Multiphase Optimized BGA Power Block.; Similar to iP2002 with Lead Free Packaging on Tape and Reel.
500VA HiRel iMotion Digital Sensor-Less Motor Controller in an MP-3T package.; A IRMCT3UF1 with Standard Packaging
Fully optimized solution for high current synchronous buck multiphase applications in a LGA power block.; Similar to IP2003A with Lead Free Packaging.
A high performance OTP based motion control IC designed primarily for appliance applications.; A IRMCK343 with Standard Packaging
Self-Oscillating Full-Bridge 600V Driver in a 14-Lead SOIC narrow boddy package; A IRS2453D packaged in a Lead-Free 14-Lead SOIC shipped on Tape and Reel
Protected Digital Audio Driver with Floating PWM input in a 16-Lead SOIC Narrow Package; A IRS20955SPBF packaged in a Lead-Free 16-Lead SOIC Narrow shipped on Tape and Reel
IP1001; A IP1001 with Standard Packaging
Dual Output Full Function 2 Phase Synchronous Power Block, Integrated Power Semiconductors, PWM Controller and Passives.; Similar to iP1201 with Lead Free packaging.
Protected Digital Audio Driver with Floating PWM input; A IRS20954SPBF with Standard Packaging 管道注册
|
Advanced Micro Devices, Inc.
|
| CY27H512-30JC CY27H512-30WC CY27H512-35HC CY27H512 |
64K x 8 High-Speed CMOS EPROM
64K x 8 High-Speed CMOS EPROM 64K X 8 OTPROM, 25 ns, PDSO28
64K x 8 High-Speed CMOS EPROM 64K X 8 OTPROM, 55 ns, PDSO28
64K x 8 High-Speed CMOS EPROM 64K X 8 OTPROM, 30 ns, PDIP28
64K x 8 High-Speed CMOS EPROM 64K X 8 UVPROM, 55 ns, CDIP28
64K x 8 High-Speed CMOS EPROM 64K X 8 UVPROM, 45 ns, CDIP28
64K x 8 High-Speed CMOS EPROM 64K X 8 OTPROM, 55 ns, CDIP28
64K x 8 High-Speed CMOS EPROM 64K X 8 UVPROM, 45 ns, CQCC32
64K x 8 High-Speed CMOS EPROM 64K X 8 OTPROM, 70 ns, PDIP28
64K x 8 High-Speed CMOS EPROM 64K X 8 OTPROM, 70 ns, PQCC32
64K x 8 High-Speed CMOS EPROM 64K X 8 UVPROM, 70 ns, CQCC32
64K x 8 High-Speed CMOS EPROM 64K X 8 OTPROM, 70 ns, PDSO28
CAP SM CER 2200PFD 50V 10% X7R 0805
|
Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
CYPRESS[Cypress Semiconductor]
|
| AT27BV256-90TI AT27BV256 AT27BV256-12JC AT27BV256- |
High Speed CMOS Logic Dual 4-Stage Binary Counters 14-SOIC -55 to 125 32K X 8 OTPROM, 150 ns, PDSO28
High Speed CMOS Logic Dual 4-Input NOR Gates 14-SOIC -55 to 125
High Speed CMOS Logic Dual Decade Ripple Counters 16-SOIC -55 to 125
High Speed CMOS Logic Dual 4-Input NOR Gates 14-PDIP -55 to 125
256K 32K x 8 Unregulated Battery-Voltage High Speed OTP CMOS EPROM
|
Atmel, Corp.
Atmel Corp.
ATMEL[ATMEL Corporation]
|
| XM20C64PMHR-55 XM20C64 XM20C64-55 XM20C64I-55 XM20 |
High Speed AUTOSTORE?/a> NOVRAM
High Speed AUTOSTORENOVRAM 高速自动存储⑩NOVRAM
High Speed AUTOSTORE NOVRAM
High Speed AUTOSTORE⑩ NOVRAM
|
XICOR[Xicor Inc.]
|
| AM29F002BB-120EE AM29F002BB-120EI AM29F002BB-120JC |
-55V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF5305S with Standard Packaging
-100V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF5210S with Lead Free Packaging
-100V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF9520NS with Lead Free Packaging
-100V Single P-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF9540NPBF with Standard Packaging
-55V Single P-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU9024N with Standard Packaging
-55V Single P-Channel HEXFET Power MOSFET in a TO-220 Full-Pak package; A IRLIB9343 with Standard Packaging
-55V Single P-Channel HEXFET Power MOSFET in a TO-262 package; A IRF5305L with Standard Packaging
-150V Single P-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRFR6215 with Lead Free Packaging
-30V Single P-Channel HEXFET Power MOSFET in a Micro 8 package; A IRF7726 with Lead Free Packaging
-55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR9024N with Standard Packaging
-20V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7204 with Lead Free Packaging
-100V Single P-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU5410 with Lead Free Packaging
-100V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF9530NS with Tape and Reel Right Packaging
-150V Single P-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF6215PBF with Standard Packaging
-100V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF9540NS with Tape and Reel Left Packaging
-55V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF9Z34NS with Lead Free Packaging
-55V Single P-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU5505 with Lead Free Packaging
-55V Single P-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF5305PBF with Standard Packaging
-30V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7406 with Lead Free Packaging
-55V Single P-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU9024N with Lead Free Packaging
-55V Single P-Channel HEXFET Power MOSFET in a TO-262 package; A IRF4905L with Standard Packaging
-150V Single P-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU6215 with Standard Packaging
-55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR5305 with Standard Packaging
-55V Single P-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF9Z34N with Standard Packaging
-100V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF9530NS with Lead Free Packaging
-20V Single P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7204 with Standard Packaging
-100V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF9540NS with Standard Packaging
-12V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7233 with Lead Free Packaging
-40V Single P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7241 with Standard Packaging
-100V Single P-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF5210 with Standard Packaging
-55V Single P-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU5305 with Standard Packaging
-40V Single P-Channel HEXFET Power MOSFET in a TSSOP-8 package; A IRF7704 with Standard Packaging
-100V Single P-Channel HEXFET Power MOSFET in a TO-247AC package; Similar to IRFP9140N with Lead Free Packaging
-30V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to SI4435DY with Lead Free Packaging
-40V Single P-Channel HEXFET Power MOSFET in a TSSOP-8 package; Similar to IRF7704 with Lead-Free Packaging.
-12V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7210 with Lead-Free Packaging.
-100V Single P-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRF5210L with Lead Free Packaging x8闪存EEPROM
x8 Flash EEPROM x8闪存EEPROM
|
Advanced Micro Devices, Inc.
|
| W26L010A W26L010A-10 W26L010A-12 W26L010AJ-10 W26L |
JT 10C 10#20 PIN RECP
From old datasheet system
64K X 16 High Speed CMOS Static RAM
HIGH SPEED SRAM 64Kx16
|
Winbond Electronics Corp
WINBOND[Winbond]
|
