Part Number Hot Search : 
LT1933 VAL1Z 2R1205 F335R P6KE170 3SMC78A BYM36 T03GH
Product Description
Full Text Search

UT61L256JC-10 - Access time: 10 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM Access time: 12 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM Access time: 15 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM Access time: 8 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM

UT61L256JC-10_8151383.PDF Datasheet

 
Part No. UT61L256JC-10 UT61L256JC-12 UT61L256JC-15 UT61L256JC-8 UT61L256LS-10 UT61L256LS-12 UT61L256LS-15
Description Access time: 10 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM
Access time: 12 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM
Access time: 15 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM
Access time: 8 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM

File Size 152.76K  /  10 Page  

Maker

UTRON Technology



Homepage
Download [ ]
[ UT61L256JC-10 UT61L256JC-12 UT61L256JC-15 UT61L256JC-8 UT61L256LS-10 UT61L256LS-12 UT61L256LS-15 Datasheet PDF Downlaod from Datasheet.HK ]
[UT61L256JC-10 UT61L256JC-12 UT61L256JC-15 UT61L256JC-8 UT61L256LS-10 UT61L256LS-12 UT61L256LS-15 Datasheet PDF Downlaod from Maxim4U.com ] :-)


[ View it Online ]   [ Search more for UT61L256JC-10 ]

[ Price & Availability of UT61L256JC-10 by FindChips.com ]

 Full text search : Access time: 10 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM Access time: 12 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM Access time: 15 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM Access time: 8 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM
 Product Description search : Access time: 10 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM Access time: 12 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM Access time: 15 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM Access time: 8 ns, 32 K x 8 Bit high speed low Vcc CMOS SRAM


 Related Part Number
PART Description Maker
WE128K32N-120G2TC WE128K32N-120G2TCA WE128K32N-120 Access time:120 ns; 128K x 32 EEPROM module, SMD 5962-94585
Access time:150 ns; 128K x 32 EEPROM module, SMD 5962-94585
Access time:200 ns; 128K x 32 EEPROM module, SMD 5962-94585
Access time:140 ns; 128K x 32 EEPROM module, SMD 5962-94585
Access time:300 ns; 128K x 32 EEPROM module, SMD 5962-94585
Access time:250 ns; 128K x 32 EEPROM module, SMD 5962-94585
Access time:240 ns; 128K x 32 EEPROM module, SMD 5962-94585
White Electronic Designs
AS29P200 AS29F200B-120SC AS29F200B-70TC AS29F200B- 5V 256K x 8 / 128K x 16 CMOS Flash EEPROM
5V 256K x 8 or 128 x 16 CMOS flash EEPROM, access time 120ns
5V 256K x 8 or 128 x 16 CMOS flash EEPROM, access time 70ns
5V 256K x 8 or 128 x 16 CMOS flash EEPROM, access time 55ns
5V 256K x 8 or 128 x 16 CMOS flash EEPROM, access time 90ns
Alliance Semiconductor
WE512K16-XG4X WE512K16-140G4C WE512K16-140G4CA WE5 Access time:200 ns; 5V power supply; 512K x 16 CMOS EEPROM module
Access time:20150 ns; 5V power supply; 512K x 16 CMOS EEPROM module
Access time:150 ns; 5V power supply; 512K x 16 CMOS EEPROM module
Access time:140 ns; 5V power supply; 512K x 16 CMOS EEPROM module
EEPROM MCP
White Electronic Designs
K4R441869B-NMCK7 K4R441869B-NMCK8 K4R271669B-NMCG6 256K x 18 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz.
256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz.
256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz.
K4R271669B:Direct RDRAMData Sheet
256K x 16/18 bit x 32s banks Direct RDRAMTM
256K x 16 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz.
256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz.
Samsung Electronic
SAMSUNG[Samsung semiconductor]
5962R-0323502QUA 5962R-0323501VUC 5962R-0323502QUC 512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish hot solder dipped. Total dose 100K rad(Si).
512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class V. Lead finish gold. Total dose 100K rad(Si).
512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish gold. Total dose 100K rad(Si).
512K x 18 SRAM. 15ns access time. Lead finish hot gold.
512K x 18 SRAM. 15ns access time. Lead finish hot solder dipped.
512K x 18 SRAM. 15ns access time. Lead finish gold. Prototype flow.
512K x 18 SRAM. 15ns access time. Lead finish factory option.
512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish factory option. Total dose 100K rad(Si).
512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class V. Lead finish hot solder dipped. Total dose 100K rad(Si).
Aeroflex Circuit Technology
UM6264 UM6264M-10 UM6264M-10L UM6264-12 UM6264-10 Flash - NOR IC; Memory Type:FLASH; Access Time, Tacc:90ns; Page/Burst Read Access:25ns; Sector Type:Uniform; Package/Case:64-BGA; Memory Configuration:64K x 8; Memory Size:32MB; NOR Flash Type:Page Mode Access
8K x 8 CMOS SRAM
United Microelectronics Corporation
ETC
UMC[UMC Corporation]
KM416RD8AC KM418RD2AC KM418RD2AD KM418RD2C KM418RD 128/144Mbit RDRAM 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, speed: 711 Mbps(356 MHz).
256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, speed: 711 Mbps(356 MHz).
256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, speed: 800 Mbps(400 MHz).
Samsung Electronic
SAMSUNG[Samsung semiconductor]
AM29F002BT-90ED AM29F002BB-70ED AM29F002NBB-70PD Flash Memory IC; Leaded Process Compatible:Yes; Memory Size:2Mbit; Package/Case:48-TSOP; Peak Reflow Compatible (260 C):Yes; Supply Voltage Max:5V; Access Time, Tacc:90ns; Series:AM29 RoHS Compliant: Yes
256K X 8 FLASH 5V PROM, 70 ns, PDSO32
Flash Memory IC; Package/Case:32-DIP; Supply Voltage Max:5V; Access Time, Tacc:70ns RoHS Compliant: Yes
SPANSION LLC
5962-0151101TXC 5962-0151101QXC 5962-0151101 UT9Q5 512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 3E4(30krad(Si)).
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 3E4(30krad(Si)).
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 5E4(50krad(Si)).
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 1E4(10krad(Si)).
UT9Q512K32 16Megabit SRAM MCM
UT9Q512K32 16Megabit SRAM MCM
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose none
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose none
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 1E4(10krad(Si)).
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 5E4(50krad(Si)).
AEROFLEX[Aeroflex Circuit Technology]
UT6164CJC-10 UT6164CJC-12 UT6164CJC-15 Access time: 10 ns, 8 K x 8 Bit high speed CMOS SRAM
Access time: 12 ns, 8 K x 8 Bit high speed CMOS SRAM
Access time: 15 ns, 8 K x 8 Bit high speed CMOS SRAM
UTRON Technology
UT61L256CJC-10 UT61L256CJC-12 UT61L256CJC-15 UT61L Access time: 10 ns, 32 K x 8 Bit high speed CMOS SRAM
Access time: 12 ns, 32 K x 8 Bit high speed CMOS SRAM
Access time: 15 ns, 32 K x 8 Bit high speed CMOS SRAM
UTRON Technology
 
 Related keyword From Full Text Search System
UT61L256JC-10 protection ic UT61L256JC-10 reference voltage UT61L256JC-10 external rom UT61L256JC-10 IC在线 UT61L256JC-10 microsemi
UT61L256JC-10 advantech pdf UT61L256JC-10 Reference UT61L256JC-10 huck UT61L256JC-10 array UT61L256JC-10 Megabit
 

 

Price & Availability of UT61L256JC-10

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
0.50857496261597