| PART |
Description |
Maker |
| N111252 |
PACKAGING: TAPE AND REEL/ 4000 PIECES PER
|
E-SWITCH
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| GBJ10K GBJ10A GBJ10B GBJ10D GBJ10G GBJ10J |
Aluminum Polymer SMT Capacitor; Capacitance: 390uF; Voltage: 4V; Case Size: 6.3x6 mm; Packaging: Tape & Reel
Aluminum Polymer SMT Capacitor; Capacitance: 1200uF; Voltage: 4V; Case Size: 10x8 mm; Packaging: Tape & Reel
GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER(VOLTAGE - 50 to 800 Volts CURRENT - 10.0 Amperes)
|
PanJit International Inc.
PANJIT[Pan Jit International Inc.]
|
| CT10-1532-G2 |
Tape and reel packaging
|
Coto Technology
|
| GBJ1010 GBJ10005 GBJ1001 GBJ1002 GBJ1004 GBJ1006 G |
Aluminum Polymer SMT Capacitor; Capacitance: 47uF; Voltage: 25V; Case Size: 10x10 mm; Packaging: Tape & Reel 10 A, 400 V, SILICON, BRIDGE RECTIFIER DIODE
Aluminum Polymer SMT Capacitor; Capacitance: 68uF; Voltage: 20V; Case Size: 10x8 mm; Packaging: Tape & Reel 10 A, 100 V, SILICON, BRIDGE RECTIFIER DIODE
Aluminum Polymer SMT Capacitor; Capacitance: 22uF; Voltage: 20V; Case Size: 6.3x6 mm; Packaging: Tape & Reel 10 A, 50 V, SILICON, BRIDGE RECTIFIER DIODE
10A GLASS PASSIVATED BRIDGE RECTIFIER
|
Diodes, Inc.
DIODES[Diodes Incorporated]
|
| M513 |
Tape and Reel Packaging for Surface Mount Components
|
M/A-COM Technology Solutions, Inc.
|
| ANI-019 |
Tape & Reel Packaging and Orientation for Surface Mount Components
|
http://
|
| PT510 PT501 PT510A PT501C PT510C PT501A PT501B |
PHOTOTRANSISTOR | NPN | 800NM PEAK WAVELENGTH | CAN-4.7 光电晶体管|叩| 800NM峰值波长|的CAN - 4.7
55V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU2405 with Lead Free Packaging
150V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRFSL33N15D with Lead Free Packaging
such as active OR'ing. Shipped in Tape and Reel only. Part is not available in bulk, TR is implied in part number.; A IRF6610 with Standard Tape and Reel
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF2805S with Standard Packaging
TO-18 Type Narrow Acceptance Phototransistor
|
Sharp Electrionic Components
|
| KBH2B KBH2A |
Tantalum Molded Capacitor; Capacitance: .68uF; Voltage: 20V; Case Size: 3.3x1.6 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: .68uF; Voltage: 20V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
|
DC Components Co., Ltd.
|
| 87891-1818 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38渭m (15渭) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87891-2818 0878912818 |
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK垄莽 Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| KA8513B/C KA8513B KA8513C |
FM IF RECEIVER
Tantalum Conformal-Coated Capacitor; Capacitance: 2.2uF; Voltage: 16V; Case Size: 1.4x2.6 mm; Packaging: Tape & Reel 引言
Tantalum Conformal-Coated Capacitor; Capacitance: 2.2uF; Voltage: 16V; Case Size: 1.4x2.6 mm; Packaging: Tape & Reel
|
Samsung Electronic
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| AM29F800BT-90WBC AM29F800BT-55WBI AM29F800BB-55WBE |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3087 with bag packaging
30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3709Z with Lead Free Packaging
40V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7470 with Lead Free Packaging
Complete VR11.0 or AMD PVID power solution.; A IR3505M packaged on tape and reel 3000 per reel
8 PWM 400 KHz Sync Contr in a 8-Pin SOIC(NB) package; A IRU3037ACS with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRLZ44NS with Lead Free Packaging
The XPHASE Control IC combined with an IR XPhase TM Phase IC provides a full featured and flexible way to implement a complete an Opteron or Athlon 64 power solution.; A IR3082M with Tape and Reel Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRLL024Z with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; A IRLL2705 with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-262 Package; Similar to IRF2807ZL with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3805S with Lead Free Packaging
x8/x16 Flash EEPROM x8/x16闪存EEPROM
XPHASE VRD10 Control IC with VccVid and Overtemp Detect; Similar to IR3080M with Lead Free Packaging on Tape and Reel x8/x16闪存EEPROM
XPHASE IC with Fault and Overtemp Detect; Same as the IR3088AM with Tape and Reel Packaging. x8/x16闪存EEPROM
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO44
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO44
|
Linear Technology, Corp.
ATM Electronic, Corp.
Integrated Device Technology, Inc.
Advanced Micro Devices, Inc.
|
