| PART |
Description |
Maker |
| N111195 |
PACKAGING: 4,000 PCS PER REEL
|
E-SWITCH
|
| N111251 |
PACKAGING: 125 PIECES PER TUBE
|
E-SWITCH
|
| M29F04B55N1F M29F04B45K1E M29F04B90N1T M29F04B45N6 |
Reversible Motor Driver for Output 1.0A (1 Motor); Package: SIP9; Constitution materials list: Packing style: Tube packaging; Package quantity: 1000
4ch System Motor Driver ICs; Package: HSOP-M28; Constitution materials list: Packing style: Tube packaging; Package quantity: 1000; Minimum package quantity: 1000; 4兆位12KB的8，统一座）单电源闪
4 Mbit (512Kb x8, Uniform Block) Single Supply Flash Memory 4兆位12KB的8，统一座）单电源闪
Reversible Motor Drivers for Output 1.0A or more (2 Motors); Package: HSIP10; Constitution materials list: Packing style: Tube packaging; Package quantity: 500; Minimum package quantity: 500; 4兆位12KB的8，统一座）单电源闪
|
意法半导
STMicroelectronics N.V.
|
| 87911-5211 |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 52 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87911-6411 0879116411 |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 64 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 64 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87911-3611 0879113611 |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 36 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 90325-9004 0903259004 |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 4 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 4 Circuits, Tin (Sn) Plating, Tube Packaging
|
Molex Electronics Ltd.
|
| 90325-9024 |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 24 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 24 Circuits, Tin (Sn) Plating, Tube Packaging
|
Molex Electronics Ltd.
|
| OV7411N OV7635 OV9630 OV7648 OV7431 |
MCU CMOS 18LD 4MHZ 1K EPRM, 0C to 70C, 18-PDIP, TUBE
MCU CMOS 18LD 20MHZ 1K EPRM, 0C to 70C, 18-SOIC 300mil, TUBE
MCU CMOS 18LD 20MHZ 1K EPRM, -40C to 85C, 18-PDIP, TUBE
MCU CMOS 20LD 20MHZ 1K EPRM, -40C to 85C, 20-SSOP 208mil, TUBE
packaging specifications
MCU CMOS 18LD 4MHZ 1K EPRM, -40C to 85C, 18-PDIP, TUBE /黑白| NTSC制式| 508 × 492 |模拟|的CameraChip |技术报
|
Omnivision Technologies Inc.
|
| 87898-1626 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 16 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
|
Molex Electronics Ltd.
|
| 87898-2426 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 24 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
|
Molex Electronics Ltd.
|
| 0353620670 353620670 35362-0670 |
2.00mm (.079) Pitch Sherlock Wire-to-Board Header, Vertical, with Positive Lock, 6Circuits, with Kinked PC Tails, Tube Packaging, Natural
|
Molex Electronics Ltd.
|
|
