| PART |
Description |
Maker |
| DAT-G01R SEC-G01R BCD110V3 |
Bluetooth v2.0 EDR specification
|
DB Lectro Inc
|
| HHM1517 |
For Bluetooth & IEEE802.11b/g
MULTILAYER BALUN SPECIFICATION
|
TDK Corporation
TDK Electronics
|
| CGB240 |
2-Stage Bluetooth InGaP HBT Power Amplifier
2.4 to 2.5 GHz HBT Bluetooth Power Amplifier
|
TriQuint Semiconductor,Inc.
TRIQUINT[TriQuint Semiconductor]
|
| SIW1711 SIW1711DIF-B SIW1711DIF-T13 SIW1711FIF SIW |
BLUETOOTH RADIO MODEM SPECIALTY TELECOM CIRCUIT, U
BLUETOOTH RADIO MODEM
|
RF Micro Devices, Inc.
RFMD
|
| OPB16450UART |
This document provides the specification
DS433 August 18, 2004 Product Specification
|
Xilinx, Inc.
|
| TB31296FT |
Bluetooth RF IC
|
Toshiba Corporation
Toshiba Semiconductor
|
| ESD110V2SK-02 |
Bluetooth Module
|
List of Unclassifed Manufacturers
List of Unclassifed Man...
|
| BTM61 |
Bluetooth Module
|
Buddies
|
| BTM8645 |
Bluetooth Module
|
Buddies-tech
|
| BLUEM-D2X0 |
Bluetooth Module
|
List of Unclassifed Manufacturers
List of Unclassifed Manufac...
|
| BTM41 |
Bluetooth Module
|
BUDDIES TECHNOLOGY LIMI...
|
