| PART |
Description |
Maker |
| LDB211G9020C-001 LDB21906M20C-001 LDB21906M05C-001 |
Chip Multilayer Hybrid Baluns 1800 MHz - 2000 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 887 MHz - 925 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 800 MHz - 1000 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 1500 MHz - 1700 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 1600 MHz - 1800 MHz RF TRANSFORMER
|
Murata Manufacturing Co., Ltd.
|
| LDB211GXXXXC-XXX LDB181GXXXXC-XXX |
Chip Multilayer Hybrid Baluns
|
Murata Manufacturing
|
| C281P1.5UF20200V C282P1.5UF10200V C285P1.2UF10500V |
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.5 uF, SURFACE MOUNT, 2825 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.5 uF, SURFACE MOUNT, 3333 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.2 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.2 uF, SURFACE MOUNT, 4040 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.8 uF, SURFACE MOUNT, 2825 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.8 uF, SURFACE MOUNT, 5440 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.5 uF, SURFACE MOUNT, 4040 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.2 uF, SURFACE MOUNT, 2825 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.2 uF, SURFACE MOUNT, 5440 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.8 uF, SURFACE MOUNT, 4040 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.5 uF, SURFACE MOUNT, 5440 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.3 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.9 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.9 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.3 uF, SURFACE MOUNT, 4040 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.3 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.9 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.3 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.3 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.3 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 1000 V, 2.7 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 2.7 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 2.7 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 8.2 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 1000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 10000 V, 0.01 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 3000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 2000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.9 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 5000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 2.7 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 4000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
|
Agilent Technologies, Inc.
Yageo, Corp.
Ecliptek, Corp.
SEMIKRON
Alliance Semiconductor, Corp.
Coilcraft, Inc.
SCHURTER AG
|
| AMK063BJ224ZP-F JMK063BJ473ZP-F EMK063BJ682ZP-F EM |
CAPACITOR, CERAMIC, MULTILAYER, 4 V, X5R, 0.22 uF, SURFACE MOUNT, 0201 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 0.047 uF, SURFACE MOUNT, 0201 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 0.0068 uF, SURFACE MOUNT, 0201 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 0.0033 uF, SURFACE MOUNT, 0201 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 0.0047 uF, SURFACE MOUNT, 0201 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 0.0015 uF, SURFACE MOUNT, 0201 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 10 V, X5R, 0.022 uF, SURFACE MOUNT, 0201 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.022 uF, SURFACE MOUNT, 0201 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.047 uF, SURFACE MOUNT, 0201 CHIP
|
Taiyo Yuden Co., Ltd.
|
| LD08PC753KAB3A LD08PC753KAB1A LD05-20 LD20 LD13 LD |
CAPACITOR, CERAMIC, MULTILAYER, 250 V, X7R, 0.075 uF, SURFACE MOUNT, 1808 CHIP
Tip & Ring Tin/Lead Termination “B Multilayer Ceramic Chip Capacitors
Tip & Ring Tin/Lead Termination “B?Multilayer Ceramic Chip Capacitors
Tip & Ring Tin/Lead Termination “B?Multilayer Ceramic Chip Capacitors
|
AVX, Corp.
AVX Corporation
|
| 160R15Z474MV4T 101R18N221GV4T 101R18N151GV4T 101R1 |
CAPACITOR, CERAMIC, MULTILAYER, 16 V, Z5U, 0.47 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, C0G, 0.00022 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, C0G, 0.00015 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, C0G, 0.00033 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, C0G, 0.00047 uF, SURFACE MOUNT, 1206 CHIP
|
飞思卡尔半导体(中国)有限公司
Chipcon
|
| NMCY5V NMC0201Y5V103Z100TRP3KF NMC0201Y5V103Z100TR |
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.33 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.33 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.33 uF, SURFACE MOUNT, 1206 CHIP, ROHS COMPLIANT
Multilayer Ceramic Chip Capacitors
|
NIC Components, Corp.
NIC[NIC-Components Corp.]
|
| HK10052N7S HK1005XXXX HK1608XXXX |
(HK1005xxx) MultiLayer Chip Inductor
(HK1608xxx) MultiLayer Chip Inductor
|
Taiyo Yuden
|
| LL1608-FSL15NJ LL1608-FSL33NJ LL1608-FSL39NJ LL160 |
DIODE ZENER SINGLE 200mW 18Vz 7mA-Izt 0.05 0.1uA-Ir 14 SOT-323 3K/REEL
Multilayer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multilayer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multilayer Chip Inductors 1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
TOKO Inc.
TOKO, Inc.
|
|
