PART |
Description |
Maker |
LFBGA-H FBGA |
Fine Pitch Ball Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
2-316289-0 2-917797-0 8-316289-0 5-917797-0 7-9177 |
ON TAPING (EMBOSS) 0.5mm PITCH Fine Mate CONN.
|
Tyco Electronics
|
1565360-9 1565359 1565359-1 1565359-3 1565359-5 15 |
ON TAPING 0.5MM PITCH FINE MATE CONN. TAB ASSEMBLY
|
Tyco Electronics
|
UPD70P3002GC-25-7EA |
32-BIT, OTPROM, 25 MHz, MICROCONTROLLER, PQFP100 14 X 14 MM, FINE PITCH, PLASTIC, QFP-100
|
Panduit, Corp.
|
UPD703014AYGC-XXX-8EU |
32-BIT, MROM, 20 MHz, MICROCONTROLLER, PQFP100 14 X 14 MM, FINE PITCH, PLASTIC, LQFP-100
|
LEDtronics, Inc.
|
UPD703228GC-003-8EU |
32-BIT, MROM, 20 MHz, RISC MICROCONTROLLER, PQFP100 14 X 14 MM, FINE PITCH, PLASTIC, LQFP-100
|
Infineon Technologies AG
|
UPD780308GC-XXX8EU-A |
8-BIT, MROM, 5 MHz, MICROCONTROLLER, PQFP100 14 X 14 MM, LEAD FREE, FINE PITCH, PLASTIC, LQFP-100
|
Vishay Semiconductors
|
24-5046-030-600-829 |
Fine Pitch SMT Board to Board Connectors
|
AVX Corporation
|
527527ZNP3A 527527NCP3A 527527NCP2A 527527NFP1A 52 |
EMI/RFI Shield Sock Strain-Relief Backshell EMI/RFI Shield Sock Strain-Relief Backshell
|
Glenair, Inc.
|
319A138XN10 319A138XN12 319A138XN14 319A138XN16 31 |
Composite Swing-Arm Strain Relief with Shield Sock
|
Glenair, Inc.
|
550T007M |
EMI/RFI D-Subminiature Split Backshell with Pre-Terminated Overall Shield Sock
|
Glenair, Inc.
|
0747121008 |
6.25mm (.246) Pitch Ganged RF Header, Vertical, 6 Circuits, Long Tails, Without Packaging Header
|
Molex Electronics Ltd.
|
|