| PART |
Description |
Maker |
| 16190 16190-8 |
THERMAL INTERFACE PAD (MINI)
THERMAL INTERFACE PAD, (MINI)
|
VICOR[Vicor Corporation]
|
| TMP-001 TMP-002 TMP-003 TMP-005 TMP-007 |
TMP Thermal Pad Accessory
|
http://
Crane Aerospace & Electronics.
|
| AND8044D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ON Semiconductor
|
| AND8044 AND8044_D AND8044/D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ONSEMI
ON Semiconductor
|
| 12.000MQ22030-101860 12.000MQ2030-101860 MQ2 MQ203 |
7 x 5mm SMD, 4 pad or 2 pad
|
EUROQUARTZ limited
|
| EMC1428 EMC1428-1-AP EMC1428-6-AP |
1∑C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
SMSC Corporation
|
| EYP2BH145 EYP05BE115 EYP05BE101 EYP1BF145 EYP2BH11 |
Thermal Cutoffs (TCO)/ Thermal-links Small and Insulation Type High Reliability
|
Panasonic Semiconductor
|
| KD2003-DC72A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| KD2002-DC70A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| KD3006-DC72A |
Thick film thermal printhead (with thermal historical contorl)
|
Rohm
|
