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HSB88WA - CMPAK package is suitable for high density surface mounting and high speed assembly

HSB88WA_7227574.PDF Datasheet

 
Part No. HSB88WA
Description CMPAK package is suitable for high density surface mounting and high speed assembly

File Size 66.14K  /  1 Page  

Maker

TY Semiconductor Co., Ltd



JITONG TECHNOLOGY
(CHINA HK & SZ)
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Part: HSB88WS
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Unit price for :
    50: $0.09
  100: $0.09
1000: $0.08

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 Full text search : CMPAK package is suitable for high density surface mounting and high speed assembly
 Product Description search : CMPAK package is suitable for high density surface mounting and high speed assembly


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