| PART |
Description |
Maker |
| DDS040-347TG DDS010-347TG DDS030-347TG DDS050-168T |
40 POS DUAL ROW SOCKET DIP80, IC SOCKET
10 POS DUAL ROW SOCKET DIP20, IC SOCKET
30 POS DUAL ROW SOCKET DIP60, IC SOCKET
50 POS DUAL ROW SOCKET DIP100, IC SOCKET
20 POS DUAL ROW SOCKET DIP40, IC SOCKET
10 POS SINGLE ROW ADAPTER SIP10, IC SOCKET
20 POS SINGLE ROW ADAPTER SIP20, IC SOCKET
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| 87433-0620 87433-0520 87433-2620 87433-2120 87433- |
RECEPTACLE 2 ROW 11WAY
RECEPTACLE 2 ROW 51WAY
RECEPTACLE 2 ROW 25WAY
RECEPTACLE 2 ROW 15WAY
RECEPTACLE 2 ROW 21WAY
RECEPTACLE 2 ROW 9WAY 插座2WAY
RECEPTACLE 2 ROW 41WAY 插座21WAY
|
AVX, Corp.
|
| 75757-1401 75757-1402 75757-1302 75757-1301 75757- |
MX150垄芒 Dual-Row Unshrouded Breakaway Header
MX150?/a> Dual-Row Unshrouded Breakaway Header
MX150 2X10 VERT HEADER ASSY 1.5 TIN
|
Molex Electronics Ltd.
MOLEX INC
|
| 87939-0001 0879390001 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| D2864-01 D2808-21 D2824-21 D2922-01 D2808-01 D2818 |
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 64-way DIP24, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 8-way DIP48, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 22-way DIP22, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 8-way DIP48, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 18-way DIP18, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 20-way DIP40, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 32-way DIP32, IC SOCKET
|
Harwin PLC
|
| 87797-1200 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, 8.00mm (.315) Stacking Height
|
Molex Electronics Ltd.
|
| 87797-1800 0877971800 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging
|
Molex Electronics Ltd.
|
| 855-99-016-20-001 855-93-016-20-001 855-91-016-20- |
PCB connectors 1.27 mm Single row / double row / triple row Solder tail 电路板连接器1.27毫米单列/双列/三列焊尾
|
PRECI-DIP SA
PREDIP[Precid-Dip Durtal SA]
|
| 87939-2000 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 20 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 15.35mm(.604) Stacking Height
|
Molex Electronics Ltd.
|
| SDA-44472-2453 |
4.20mm (.165) Pitch Mini-Fit HCS Header, Dual Row, Vertical
4.20mm (.165") Pitch Mini-Fit HCS垄芒 Header, Dual Row, Vertical
|
Molex Electronics Ltd.
|
| 87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
|
